Minimizing the footprint of integrated circuits is always important. However, with temperature sensors, reducing the size of the IC has additional benefits such as reducing the thermal mass of the device—thus, improving the thermal response. TMP110 is TI’s first X2SON packaged temperature sensor. Featuring a significantly smaller form factor than the rest of our packaged temperature sensors portfolio, comparable in size to chip-scale devices, this pushes the boundaries for improved response time and saving space of packaged ICs while also allowing to place the temperature sensor closer to the heat source. In addition, the package protects the die inside from external factors (moisture, light, oxidation). The TMP110 is an I2C digital temperature sensor which offers an additional address orderable and different alert orderables with factory-programmed device-address. To put this into perspective, Figure 1 shows where the new X2SON TMP110 fits within TI's portfolio:

Figure 1 Where TMP110 Fits

The table below shows a comparison on key specs of this device versus others in TI's portfolio.

TMP110 Next To Commonly Used Packages

Figure 2 shows a visual representation as a PCB layout of how the X2SON package compares in size with other common packages.

Figure 2 Package Size Comparison With Common Packages

As seen above, the TMP110 is considerably smaller than the common packaged temperature sensors. As reference, Figure 3 shows the TMP110 compared to chip-scale devices on a PCB layout along with the smallest leaded package.

Figure 3 Package Size Comparison With Chip-Scale Devices