Emerging applications such as augmented reality/virtual reality (AR/VR) headsets, personal electronics, and medical wearable devices such as continuous glucose monitors (CGM) PCBs drive the need for ultra-small temperature sensors. Minimizing the footprint of integrated circuits in these applications improves thermal response by reducing the thermal mass of the device.

TMP110 and TMP112D are TI’s first X2SON-packaged temperature sensors. This package improves response time, saves space, and allows closer placement to the heat source due to the smaller form factor compared to a non-chip-scale package. TMP118 is the smallest temperature sensor in a ball grid array (BGA) wafer-level chip-scale package (WCSP), setting a new industry standard for ultra-small size. TMP114, the thinnest sensor in TI’s portfolio, is designed for applications requiring minimal height, such as under-component temperature sensing.

These sensors enhance performance and efficiency in space-constrained applications. Figure 1 shows where these devices fit within TI's portfolio, highlighting advancements in size and accuracy. Table 1 lists the key specs to facilitate a quick comparison overview.

Figure 1 Overview of the Smallest-Sized Temperature Sensors

From Figure 1, there are a few devices to highlight:

• TMP118 is the smallest device with an area of 0.61mm × 0.55mm x 0.23mm.
• TMP114 and TMP144 are the thinnest device with a maximum height of 150µm.
• TMP112, TMP102, and TMP1075N come in the smallest leaded plastic package SOT563 (1.6mm × 1.6mm).
• TMP112D and TMP110 are available in the smallest package X2SON (0.8mm × 0.8mm).

Table 1 shows a comparison of key specifications of a device versus others in TI's portfolio.

Commonly Used Packages

Figure 2 shows a visual representation of how different package sizes compare in a PCB layout.

Figure 2 Device Size Comparison: Commonly-Used Packages

As seen in the figure above, the X2SON package is considerably smaller than the common packaged temperature sensors. As reference, Figure 3 shows the X2SON package compared to chip-scale devices on a PCB layout along with the smallest leaded package SOT-563.

Figure 3 Device Size Comparison: Chip-Scale Devices (Topside View)

Figure 4 shows an angled view of the chip-scale devices size comparison highlighting the package name, the device used for the comparison, and the maximum height of it.

Figure 4 Device Height Comparison: Chip-Scale Devices (Angled View)

Multisourcing SOT-563 and X2SON-5 Packages

As TMP112 and TMP110 are fully software-compatible, it is important to note that, while they are not pin-to-pin compatible due to the differences between footprints, the end user may still layout the device in such a way that SCL and SDA are stacked on top of each other in cases where multisourcing is required. This layering solution helps reduce the total footprint of an SCL/SDA trace stackup method.

Figure 5 SOT-563 and X2SON-5 Alert and Address Multisourcing Layout