SNVA925E January   2020  – March 2024 LM63610-Q1 , LM63615-Q1 , LM63625-Q1

 

  1.   1
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 HTSSOP Package
    2. 2.2 WSON Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 HTSSOP-16 Package
    2. 4.2 WSON Package
  6. 5Revision History

1 Overview

This document contains information for the LM636xx-Q1 (HTSSOP and WSON packages) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-AF84A8EC-07E8-414D-BE4E-7CFE645B388C-low.gifFigure 1-1 Functional Block Diagram

The LM636xx-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.