SNVA925E January   2020  – March 2024 LM63610-Q1 , LM63615-Q1 , LM63625-Q1

 

  1.   1
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 HTSSOP Package
    2. 2.2 WSON Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 HTSSOP-16 Package
    2. 4.2 WSON Package
  6. 5Revision History

2.1 HTSSOP Package

This section provides Functional Safety Failure In Time (FIT) rates for the HTSSOP package of the LM636xx-Q1 based on the following industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total Component FIT Rate17
Die FIT Rate7
Package FIT Rate10

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 600 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS
Digital, analog / mixed		 25 FIT 55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.