The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I²C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series-resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring design.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7V to 2.0V), common two-wire interfaces (1.7V to 3.6V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.