SLAA530B March   2012  – July 2021 MSP430F5131 , MSP430F5132 , MSP430F5151 , MSP430F5152 , MSP430F5171 , MSP430F5172 , MSP430F5212 , MSP430F5214 , MSP430F5217 , MSP430F5219 , MSP430F5222 , MSP430F5224 , MSP430F5229 , MSP430F5232 , MSP430F5234 , MSP430F5237 , MSP430F5239 , MSP430F5242 , MSP430F5244 , MSP430F5247 , MSP430F5249 , MSP430F5252 , MSP430F5253 , MSP430F5254 , MSP430F5255 , MSP430F5256 , MSP430F5257 , MSP430F5258 , MSP430F5259 , MSP430F5304 , MSP430F5308 , MSP430F5309 , MSP430F5310 , MSP430F5324 , MSP430F5325 , MSP430F5326 , MSP430F5327 , MSP430F5328 , MSP430F5328-EP , MSP430F5329 , MSP430F5333 , MSP430F5335 , MSP430F5336 , MSP430F5338 , MSP430F5340 , MSP430F5341 , MSP430F5342 , MSP430F5358 , MSP430F5359 , MSP430F5418 , MSP430F5418A , MSP430F5419 , MSP430F5419A , MSP430F5435 , MSP430F5435A , MSP430F5436 , MSP430F5436A , MSP430F5437 , MSP430F5437A , MSP430F5438 , MSP430F5438A , MSP430F5438A-EP , MSP430F5500 , MSP430F5501 , MSP430F5502 , MSP430F5503 , MSP430F5504 , MSP430F5505 , MSP430F5506 , MSP430F5507 , MSP430F5508 , MSP430F5509 , MSP430F5510 , MSP430F5513 , MSP430F5514 , MSP430F5515 , MSP430F5517 , MSP430F5519 , MSP430F5521 , MSP430F5522 , MSP430F5524 , MSP430F5525 , MSP430F5526 , MSP430F5527 , MSP430F5528 , MSP430F5529 , MSP430F5630 , MSP430F5631 , MSP430F5632 , MSP430F5633 , MSP430F5634 , MSP430F5635 , MSP430F5636 , MSP430F5637 , MSP430F5638 , MSP430F5658 , MSP430F5659 , MSP430F6433 , MSP430F6435 , MSP430F6436 , MSP430F6438 , MSP430F6458 , MSP430F6459 , MSP430F6459-HIREL , MSP430F6630 , MSP430F6631 , MSP430F6632 , MSP430F6633 , MSP430F6634 , MSP430F6635 , MSP430F6636 , MSP430F6637 , MSP430F6638 , MSP430F6658 , MSP430F6659 , MSP430F6720 , MSP430F6720A , MSP430F6721 , MSP430F6721A , MSP430F6723 , MSP430F6723A , MSP430F6724 , MSP430F6724A , MSP430F6725 , MSP430F6725A , MSP430F6726 , MSP430F6726A , MSP430F6730 , MSP430F6730A , MSP430F6731 , MSP430F6731A , MSP430F6733 , MSP430F6733A , MSP430F6734 , MSP430F6734A , MSP430F6735 , MSP430F6735A , MSP430F6736 , MSP430F6736A , MSP430F6745 , MSP430F67451 , MSP430F67451A , MSP430F6745A , MSP430F6746 , MSP430F67461 , MSP430F67461A , MSP430F6746A , MSP430F6747 , MSP430F67471 , MSP430F67471A , MSP430F6747A , MSP430F6748 , MSP430F67481 , MSP430F67481A , MSP430F6748A , MSP430F6749 , MSP430F67491 , MSP430F67491A , MSP430F6749A , MSP430F67621 , MSP430F67621A , MSP430F67641 , MSP430F67641A , MSP430F6765 , MSP430F67651 , MSP430F67651A , MSP430F6765A , MSP430F6766 , MSP430F67661 , MSP430F67661A , MSP430F6766A , MSP430F6767 , MSP430F67671 , MSP430F67671A , MSP430F6767A , MSP430F6768 , MSP430F67681 , MSP430F67681A , MSP430F6768A , MSP430F6769 , MSP430F67691 , MSP430F67691A , MSP430F6769A , MSP430F6775 , MSP430F67751 , MSP430F67751A , MSP430F6775A , MSP430F6776 , MSP430F67761 , MSP430F67761A , MSP430F6776A , MSP430F6777 , MSP430F67771 , MSP430F67771A , MSP430F6777A , MSP430F6778 , MSP430F67781 , MSP430F67781A , MSP430F6778A , MSP430F6779 , MSP430F67791 , MSP430F67791A , MSP430F6779A , MSP430FR2000 , MSP430FR2032 , MSP430FR2033 , MSP430FR2100 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2422 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2512 , MSP430FR2522 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR5720 , MSP430FR5721 , MSP430FR5722 , MSP430FR5723 , MSP430FR5724 , MSP430FR5725 , MSP430FR5726 , MSP430FR5727 , MSP430FR5728 , MSP430FR5729 , MSP430FR5730 , MSP430FR5731 , MSP430FR5732 , MSP430FR5733 , MSP430FR5734 , MSP430FR5735 , MSP430FR5736 , MSP430FR5737 , MSP430FR5738 , MSP430FR5739 , MSP430FR5739-EP , MSP430FR5847 , MSP430FR58471 , MSP430FR5848 , MSP430FR5849 , MSP430FR5857 , MSP430FR5858 , MSP430FR5859 , MSP430FR5867 , MSP430FR58671 , MSP430FR5868 , MSP430FR5869 , MSP430FR5870 , MSP430FR5872 , MSP430FR58721 , MSP430FR5887 , MSP430FR5888 , MSP430FR5889 , MSP430FR58891 , MSP430FR5922 , MSP430FR59221 , MSP430FR5947 , MSP430FR59471 , MSP430FR5948 , MSP430FR5949 , MSP430FR5957 , MSP430FR5958 , MSP430FR5959 , MSP430FR5962 , MSP430FR5964 , MSP430FR5967 , MSP430FR5968 , MSP430FR5969 , MSP430FR5969-SP , MSP430FR59691 , MSP430FR5970 , MSP430FR5972 , MSP430FR59721 , MSP430FR5986 , MSP430FR5987 , MSP430FR5988 , MSP430FR5989 , MSP430FR5989-EP , MSP430FR59891 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941 , MSP430FR6005 , MSP430FR6007 , MSP430FR6035 , MSP430FR6037 , MSP430FR60371 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431 , MSP430FR6045 , MSP430FR6047 , MSP430FR60471 , MSP430FR6820 , MSP430FR6822 , MSP430FR68221 , MSP430FR6870 , MSP430FR6872 , MSP430FR68721 , MSP430FR6877 , MSP430FR6879 , MSP430FR68791 , MSP430FR6887 , MSP430FR6888 , MSP430FR6889 , MSP430FR68891 , MSP430FR6920 , MSP430FR6922 , MSP430FR69221 , MSP430FR6927 , MSP430FR69271 , MSP430FR6928 , MSP430FR6970 , MSP430FR6972 , MSP430FR69721 , MSP430FR6977 , MSP430FR6979 , MSP430FR69791 , MSP430FR6987 , MSP430FR6988 , MSP430FR6989 , MSP430FR69891

 

  1.   Trademarks
  2. 1Introduction to ESD
    1. 1.1 Component-Level ESD Rating
      1. 1.1.1 Human Body Model (HBM)
      2. 1.1.2 Charged Device Model (CDM)
    2. 1.2 System-Level ESD Rating
    3. 1.3 ESD Waveforms
  3. 2General System-Level ESD Design Guidelines
    1. 2.1 Enclosures
      1. 2.1.1 Enclosure Openings
      2. 2.1.2 Enclosure Cables
    2. 2.2 PCB Design and Layout
      1. 2.2.1 Example Layout – Current Loop
    3. 2.3 On-Board ESD Protection Devices
      1. 2.3.1 Simple Passive Components
      2. 2.3.2 ESD Suppression Devices
      3. 2.3.3 ESD Protection Using Series Resistor
    4. 2.4 Circuit Design and Software Considerations
      1. 2.4.1 Circuit Design
      2. 2.4.2 Software Considerations
    5. 2.5 ESD Testing
  4. 3System Efficient ESD Design (SEED)
    1. 3.1 System-Level ESD Protection Methodology
      1. 3.1.1 On-Board Protection – Primary Clamp
      2. 3.1.2 On-Chip Protection – Secondary Clamp
      3. 3.1.3 Two-Stage Protection – Fundamental SEED Concept
    2. 3.2 SPICE Simulation Methodology for System-Level ESD Design
  5. 4SEED-Based IEC Protection Design and Verification – Real World Example 1
    1. 4.1 Modeling IEC Stress Waveform
    2. 4.2 Modeling TVS Device
    3. 4.3 Modeling MSP430 I/O Pin
    4. 4.4 Isolated Impedance Calculation
    5. 4.5 SPICE Simulation – SEED Method
    6. 4.6 Board-Level Verification
  6. 5System-Level ESD Protection – Real World Example 2
  7. 6Summary
  8. 7Modeling Using TLP Parameters
    1. 7.1 Modeling TVS Device Using TLP Parameters [8]
    2. 7.2 Modeling IC Interface Pin to be Protected Using TLP Parameters [8]
  9. 8References
  10.   Revision History

3.1.3 Two-Stage Protection – Fundamental SEED Concept

The on-board primary protection and the on-chip secondary protection form the fundamental concept of SEED design methodology and act like the primary and secondary stages of a typical input protection scheme, where the current carrying capabilities of both branches are balanced by a serial impedance [2]. Figure 3-1 shows this two stage protection scheme with necessary isolation impedance between the primary and secondary protection stages.

GUID-B3FF3D9E-A17A-4C31-A62F-FEE5CD5693E7-low.png
Matched primary (on-board TVS) and secondary (IC ESD protection) clamps
Figure 3-1 Two-Stage System-Level ESD Protection [7]

Simulating and analyzing the two-stage protection using the SEED methodology enables board designers to select appropriate on-board protection for primary clamping and other board components (isolation impedance) to ensure peak residual pulse reaching the IC pins (with on-chip ESD protection) can still be handled effectively in preventing any physical device damage and other system level upsets. More information regarding the SEED co-design methodology can be found in the JPEP161 System-level ESD document [2].

In summary, this new co-design methodology concept demonstrates that (1) high-level component-level protection (HBM) does not necessarily ensure effective system ESD robustness, and (2) understanding the interactions between external ESD stress and full system-level design (including ICs in the system) enables achievement of robust system ESD designs with on-chip HBM levels reduced to a more realistic value accepted for IC handling.