SLAA834B May   2018  – August 2021 MSP430FR2000 , MSP430FR2032 , MSP430FR2033 , MSP430FR2100 , MSP430FR2110 , MSP430FR2111 , MSP430FR2153 , MSP430FR2155 , MSP430FR2310 , MSP430FR2311 , MSP430FR2353 , MSP430FR2355 , MSP430FR2422 , MSP430FR2433 , MSP430FR2475 , MSP430FR2476 , MSP430FR2512 , MSP430FR2522 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676 , MSP430FR4131 , MSP430FR4132 , MSP430FR4133 , MSP430FR5720 , MSP430FR5721 , MSP430FR5722 , MSP430FR5723 , MSP430FR5724 , MSP430FR5725 , MSP430FR5726 , MSP430FR5727 , MSP430FR5728 , MSP430FR5729 , MSP430FR5730 , MSP430FR5731 , MSP430FR5732 , MSP430FR5733 , MSP430FR5734 , MSP430FR5735 , MSP430FR5736 , MSP430FR5737 , MSP430FR5738 , MSP430FR5739 , MSP430FR5847 , MSP430FR58471 , MSP430FR5848 , MSP430FR5849 , MSP430FR5857 , MSP430FR5858 , MSP430FR5859 , MSP430FR5867 , MSP430FR58671 , MSP430FR5868 , MSP430FR5869 , MSP430FR5870 , MSP430FR5872 , MSP430FR58721 , MSP430FR5887 , MSP430FR5888 , MSP430FR5889 , MSP430FR58891 , MSP430FR5922 , MSP430FR59221 , MSP430FR5947 , MSP430FR59471 , MSP430FR5948 , MSP430FR5949 , MSP430FR5957 , MSP430FR5958 , MSP430FR5959 , MSP430FR5962 , MSP430FR5964 , MSP430FR5967 , MSP430FR5968 , MSP430FR5969 , MSP430FR59691 , MSP430FR5970 , MSP430FR5972 , MSP430FR59721 , MSP430FR5986 , MSP430FR5987 , MSP430FR5988 , MSP430FR5989 , MSP430FR59891 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Configuration of MSP430FR4xx and MSP430FR2xx Devices
  4. 3 In-System Programming of Nonvolatile Memory
    1. 3.1 Ferroelectric RAM (FRAM) Overview
    2. 3.2 FRAM Cell
    3. 3.3 Protecting FRAM Using Write Protection Bits in FR4xx Family
    4. 3.4 FRAM Memory Wait States
    5. 3.5 Bootloader (BSL)
    6. 3.6 JTAG and Security
    7. 3.7 Production Programming
  5. 4 Hardware Migration Considerations
  6. 5 Device Calibration Information
  7. 6 Important Device Specifications
  8. 7 Core Architecture Considerations
    1. 7.1 Power Management Module (PMM)
      1. 7.1.1 Core LDO and LPM3.5 LDO
      2. 7.1.2 SVS
      3. 7.1.3 VREF
    2. 7.2 Clock System
      1. 7.2.1 DCO Frequencies
      2. 7.2.2 FLL, REFO, and DCO Tap
      3. 7.2.3 FRAM Access at 16 MHz and 24 MHz and Clocks-on-Demand
    3. 7.3 Operating Modes, Wakeup, and Reset
      1. 7.3.1 LPMx.5
      2. 7.3.2 Reset
    4. 7.4 Determining the Cause of Reset
    5. 7.5 Interrupt Vectors
    6. 7.6 FRAM and the FRAM Controller
    7. 7.7 RAM Controller (RAMCTL)
  9. 8 Peripheral Considerations
    1. 8.1  Overview of the Peripherals on the FR4xx and FR59xx Families
    2. 8.2  Ports
      1. 8.2.1 Digital Input/Output
      2. 8.2.2 Capacitive Touch I/O
    3. 8.3  Communication Modules
    4. 8.4  Timer and IR Modulation Logic
    5. 8.5  Backup Memory
    6. 8.6  RTC Counter
    7. 8.7  LCD
    8. 8.8  Interrupt Compare Controller (ICC)
    9. 8.9  Analog-to-Digital Converters
      1. 8.9.1 ADC12_B to ADC
    10. 8.10 Enhanced Comparator (eCOMP)
    11. 8.11 Operational Amplifiers
    12. 8.12 Smart Analog Combo (SAC)
  10. 9 ROM Libraries
  11. 10Conclusion
  12. 11References
  13. 12Revision History

6 Important Device Specifications

Table 6-1 lists important differences in device-level electrical specifications. [4] [5]

Table 6-1 Device-Level Electrical Specifications
ParameterFR4xxFR59xx
Supply voltage range1.8 V to 3.6 V(1)(2)1.8 V to 3.6 V(1)
Maximum system frequency, fSYSTEM(3)16 MHz at VCC = 1.8 V,
24 MHz at VCC = 1.8 V		16 MHz at VCC = 1.8 V
Minimum supply voltage for nonvolatile memory programming1.8 V1.8 V
Minimum analog supply voltage for ADC operation2.0 V1.8 V
(1) The minimum operating voltage depends on the SVSH voltage levels.
(2) Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset even within the recommended supply voltage range.
(3) See the device-specific data sheet for the specified operating conditions.