SLAAE75A November   2022  – March 2023 MSPM0L1105 , MSPM0L1106 , MSPM0L1227 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1 MSPM0L Hardware Design Check List
  4. 2 Power Supplies in MSPM0L Devices
    1. 2.1 Digital Power Supply
    2. 2.2 Analog Power Supply
    3. 2.3 Built-in Power Supply and Voltage Reference
    4. 2.4 Recommended Decoupling Circuit for Power Supply
  5. 3 Reset and Power Supply Supervisor
    1. 3.1 Digital Power Supply
    2. 3.2 Power Supply Supervisor
  6. 4 Clock System
    1. 4.1 Internal Oscillators
    2. 4.2 External Clock Output (CLK_OUT)
    3. 4.3 Frequency Clock Counter (FCC)
  7. 5 Debugger
    1. 5.1 Debug Port Pins and Pinout
    2. 5.2 Debug Port Connection With Standard JTAG Connector
  8. 6 Key Analog Peripherals
    1. 6.1 ADC Design Considerations
    2. 6.2 OPA Design Considerations
    3. 6.3 DAC Design Considerations
    4. 6.4 COMP Design Considerations
    5. 6.5 GPAMP Design Considerations
  9. 7 Key Digital Peripherals
    1. 7.1 Timer Resources and Design Considerations
    2. 7.2 UART and LIN Resources and Design Considerations
    3. 7.3 I2C and SPI Design Considerations
  10. 8 GPIOs
    1. 8.1 GPIO Output Switching Speed and Load Capacitance
    2. 8.2 GPIO Current Sink and Source
    3. 8.3 High Speed GPIOs
    4. 8.4 Open-Drain GPIOs Enable 5-V Communication Without a Level Shifter
    5. 8.5 Communicate With 1.8-V Devices Without a Level Shifter
    6. 8.6 Unused Pins Connection
  11. 9 Layout Guides
    1. 9.1 Power Supply Layout
    2. 9.2 Considerations for Ground Layout
    3. 9.3 Traces, Vias, and Other PCB Components
    4. 9.4 How to Select Board Layers and Recommended Stack-up
  12. 10Bootloader
    1. 10.1 Bootloader Introduction
    2. 10.2 Bootloader Hardware Design Considerations
      1. 10.2.1 Physical Communication interfaces
      2. 10.2.2 Hardware Invocation
  13. 11References
  14. 12Revision History

8.2 GPIO Current Sink and Source

Table 8-2 MSPM0L GPIO Absolute Maximum Ratings
MIN NOM MAX UNIT
VDD Supply voltage 1.62 3.6 V
VCORE Voltage on VCORE pin 1.35 V
CVDD Capacitor placed between VDD and VSS 10 uF
CVCORE Capacitor placed between VCORE and VSS 470 nF
TA Ambient temperature, T version –40 105 °C
Ambient temperature, S version –40 125
TA Ambient temperature, Q version -40 125 °C
TJ Max junction temperature, T version 125 °C
TJ Max junction temperature, S and Q versions 130 °C
fMCLK MCLK, CPUCLK, ULPCLK frequency with 1 flash wait state 32 MHz
MCLK, CPUCLK, ULPCLK frequency with 0 flash wait states 24
Note:
  • The total current of I/O must be less than the maximum value of IVDD.
  • HSIO and ODIO are patched in a fixed pin; refer to the device data sheet.

SDIO and HSIO can sink or source a maximum current of 6 mA (typical), which is sufficient to drive a typical LED. The total combined current must be less than IVDD (80 mA typical).