SLAT162 February 2023 MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507 , MSPM0L1105 , MSPM0L1106 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346

Cost Optimized

With MSPM0 MCUs, designers can reduce costs at both the component level and system level without compromising on performance and flexibility.

Internal manufacturing More information	The MSPM0 platform leverages TI’s internal 65-nm low power flash process technology to enable the lowest cost MCUs with more chips per wafer than competing MCUs Wafer fabrication is multi-sourced with both TI internal fab and external foundry capacity for supply continuity Highly optimized, TI internal final assembly and test facilities and techniques enable reduced cost
Reduced package and PCB costs More information	Optimized silicon enables the use of smaller, cost effective packages not previously possible for MCUs, including small-outline transistor (SOT-23-THN) and very-thin shrink small outline package (VSSOP) SOT-23-THN packages provide double the number of pins in less than half of the PCB area of competing small-outline integrated circuit (SOIC) packaging, enabling smaller, lower cost PCB assemblies
Affordable analog performance More information	With the industry’s first chopper-stabilized op-amps integrated into an MCU, it’s now possible to simplify designs by bringing the analog signal chain into the MCU, without compromising on performance MSPM0 chopper-stabilized op-amps provide <±0.5 mV of input offset drift across the -40 to 125ºC operating range, significantly reducing measurement error in high gain applications; with a flexible on-chip analog interconnect, it’s possible to create a wide variety of analog circuits, including inverting/non-inverting amplifiers, buffers, PGAs (from 1X to 32X gain), and differential or cascaded amplifier topologies MSPM0G MCU families offer dual, simultaneous-sampling 4-Msps 12-bit SAR ADCs with internal hardware averaging to enable 14-bit 250-ksps sampling for applications requiring higher precision monitoring of voltages and currents, often eliminating the need for a discrete ADC

Leading the industry in internal manufacturing investments for low-cost microcontrollers

Lehi, Utah is home to Texas Instruments' new 300-mm semiconductor wafer fabrication plant supporting MSPM0 volume production in TI's 65-nm flash process, with more than 275 000 square feet of cleanroom space and capacity for building tens of millions of chips daily.

Cost optimized, small leaded packages

With optimized SOT-23-THN and VSSOP packages, designers get double the pins in half the PCB area of competing solutions, saving package cost and PCB space.