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The absolute maximum VGS rating can be a single value or separate positive and negative values depending on the gate structure. As detailed in the What type of ESD protection does your MOSFET include? technical article, TI FETs can have single-ended, back-to-back or no gate ESD protection. FETs with a single-ended ESD structure only have a single value for absolute maximum VGS. Applying a voltage of the opposite polarity forward biases the gate-to-source ESD diode allowing current to flow into the gate and clamping VGS at a junction drop. An external gate resistor can be added to limit the gate current and prevent damaging the FET.
Devices with back-to-back or no ESD protection have separate positive and negative absolute maximum VGS values that can be symmetric (that is, ±20V) or asymmetric (that is, -12V/+16V). Never operate the FET with VGS in excess of the absolute maximum specifications or the FET can be damaged.
Table 4-1, Table 4-2, and Table 4-3 show examples of the absolute maximum ratings for the following TI N-channel MOSFETs:
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-source voltage | 30 | V |
VGS | Gate-to-source voltage | ±20 | V |
ID | Continuous drain current (package limited) | 60 | A |
Continuous drain current (silicon limited), TC = 25°C | 123 | ||
Continuous drain current | 24 | ||
IDM | Pulsed drain current | 256 | A |
PD | Power dissipation | 3.1 | W |
Power dissipation, TC = 25°C | 83 | ||
TJ, Tstg |
Operating junction temperature and storage temperature | –55 to 150 | °C |
EAS | Avalanche energy, single pulse ID = 39A, L = 0.1 mH, RG = 25Ω |
76 | mJ |
TA = 25°C unless otherwise stated | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-source voltage | 30 | V |
VGS | Gate-to-source voltage | 12 | V |
ID | Continuous drain current, TA = 25°C | 3.1 | A |
IDM | Pulsed Drain Current, TA = 25°C | 12 | A |
IG | Continuous gate clamp current | 35 | mA |
Pulsed gate clamp current | 350 | ||
PD | Power dissipation | 500 | mW |
ESD Rating | Human body model (HBM) | 4 | kV |
Charged device model (CDM) | 2 | kV | |
TJ, Tstg |
Operating junction and storage temperature range | –55 to 150 | °C |
EAS | Avalanche energy, single pulse ID = 7.4A, L = 0.1mH, RG = 25Ω |
2.7 | mJ |
TA = 25°C | VALUE | UNIT | |
---|---|---|---|
VDS | Drain-to-source voltage | 25 | V |
VGS | Gate-to-source voltage | –12 to 16 | V |
ID | Continuous drain current (package limited) | 100 | A |
Continuous drain current (silicon limited), TC = 25°C | 261 | ||
Continuous drain current | 38 | ||
IDM | Pulsed drain current, TA = 25°C | 200 | A |
PD | Power dissipation | 3.2 | W |
Power dissipation, TC = 25°C | 156 | ||
TJ, Tstg |
Operating junction temperature and storage temperature | –55 to 150 | °C |
EAS | Avalanche energy, single-pulse ID = 100A, L = 0.1mH, RG = 25Ω |
500 | mJ |