Emerging applications such as augmented reality/virtual reality (AR/VR) headsets, personal electronics, and medical wearable devices such as continuous glucose monitors (CGM) PCBs drive the need for ultra-small temperature sensors. Minimizing the footprint of integrated circuits in these applications improves thermal response by reducing the thermal mass of the device.
TMP110 and TMP112D are TI’s first X2SON-packaged temperature sensors. This package improves response time, saves space, and allows closer placement to the heat source due to the smaller form factor compared to a non-chip-scale package. TMP118 is the smallest temperature sensor in a ball grid array (BGA) wafer-level chip-scale package (WCSP), setting a new industry standard for ultra-small size. TMP114, the thinnest sensor in TI’s portfolio, is designed for applications requiring minimal height, such as under-component temperature sensing.
These sensors enhance performance and efficiency in space-constrained applications. Figure 1 shows where these devices fit within TI's portfolio, highlighting advancements in size and accuracy. Table 1 lists the key specs to facilitate a quick comparison overview.
From Figure 1, there are a few devices to highlight:
Table 1 shows a comparison of key specifications of a device versus others in TI's portfolio.
Device | Interface | MAX Accuracy | Package | Area (mm × mm) | MAX Height (µm) | Power Supply Range | Shutdown Iq (typical) | Q100 Available |
---|---|---|---|---|---|---|---|---|
TMP118 | I2C | 0.1°C | PICOSTAR-4 | 0.610 × 0.550 = 0.336 | 230 | 1.4V to 5.5V | 0.10µA | No |
TMP114 | I2C | 0.2 | PICOSTAR-4 | 0.760 × 0.760 = 0.578 | 150 | 1.08V to 1.98V | 0.16µA | No |
TMP103 | I2C | 2°C | DSBGA-4 | 0.760 × 0.760 = 0.578 | 625 | 1.4V to 3.6V | 0.50µA | No |
TMP112D | I2C | 0.5°C | X2SON-5 | 0.800 × 0.800 = 0.640 | 400 | 1.4V to 3.6V | 0.15µA | Yes |
TMP110 | I2C | 1°C | X2SON-5 | 0.800 × 0.800 = 0.640 | 400 | 1.14V to 5.5V | 0.15µA | |
TMP144 | UART | 1°C | PICOSTAR-4 | 0.760 × 0.960 = 0.7296 | 150 | 1.4V to 3.6V | 0.50µA | No |
TMP108 | I2C | 0.75°C | DSBGA-6 | 1.186 × 0.786 = 0.932 | 625 | 1.4V to 3.6V | 0.30µA | No |
I2C | 0.5°C | DSBGA-6 | 1.490 x 0.950 = 1.4155 | 525 | 1.4V to 5.5V | 0.07µA | No | |
TMP119 | I2C | 0.08°C | DSBGA-6 | 1.488 × 0.950 = 1.414 | 525 | 1.7V to 5.5V | 0.15µA | No |
TMP117 | I2C | 0.1°C | DSBGA-6 | 1.488 × 0.950 = 1.414 | 531 | 1.8V to 5.5V | 0.50µA | No |
TMP112 | I2C | 0.5°C | SOT563 | 1.600 × 1.600 = 2.56 | 600 | 1.4V to 3.6V | 0.15µA | Yes |
Figure 2 shows a visual representation of how different package sizes compare in a PCB layout.
As seen in the figure above, the X2SON package is considerably smaller than the common packaged temperature sensors. As reference, Figure 3 shows the X2SON package compared to chip-scale devices on a PCB layout along with the smallest leaded package SOT-563.
Figure 4 shows an angled view of the chip-scale devices size comparison highlighting the package name, the device used for the comparison, and the maximum height of it.
As TMP112 and TMP110 are fully software-compatible, it is important to note that, while they are not pin-to-pin compatible due to the differences between footprints, the end user may still layout the device in such a way that SCL and SDA are stacked on top of each other in cases where multisourcing is required. This layering solution helps reduce the total footprint of an SCL/SDA trace stackup method.
Table 2 shows a comprehensive overview of TI's portfolio of local temperature sensors in terms of package and performance over multiple interfaces. Table 3 serves as a reference for picking the right device, according to the end application needs.
Generic Part Number | Orderable Part Number | Center Pad | Address (7-bit format) |
---|---|---|---|
TMP110 | TMP110D0IDPWR | ALERT | 0x48 |
TMP110D1IDPWR | 0x49 | ||
TMP110D2IDPWR | 0x4A | ||
TMP110D3IDPWR | 0x4B | ||
TMP110DIDPWR | ADDRESS | 0x40, 0x41, 0x42, 0x43 | |
TMP112D | TMP112D0IDPWR | ALERT | 0x48 |
TMP112D1IDPWR | 0x49 | ||
TMP112D2IDPWR | 0x4A | ||
TMP112D3IDPWR | 0x4B | ||
TMP112DIDPWR | ADDRESS | 0x40, 0x41, 0x42, 0x43 |
For additional assistance, ask questions to TI engineers on the TI E2E Sensors Support Forum.
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