SN74AHCT16244

ACTIVE

Product details

Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 8 Supply current (max) (µA) 40 IOH (max) (mA) -8 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS)
    Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per
    MIL-STD-883, Method 3015
  • Package Options Include:
    • Plastic Shrink Small Outline (DL) Package
    • Thin Shrink Small Outline (DGG) Package
    • Thin Very Small Outline (DGV) Package
    • 380-mil Fine-Pitch Ceramic Flat (WD)
      Package Using 25-mil Center-to-Center
      Spacings
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS)
    Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per
    MIL-STD-883, Method 3015
  • Package Options Include:
    • Plastic Shrink Small Outline (DL) Package
    • Thin Shrink Small Outline (DGG) Package
    • Thin Very Small Outline (DGV) Package
    • 380-mil Fine-Pitch Ceramic Flat (WD)
      Package Using 25-mil Center-to-Center
      Spacings

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

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Technical documentation

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Type Title Date
* Data sheet SN74AHCT16244 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. J) PDF | HTML 13 Oct 2014
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 02 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 24 Feb 2000
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 01 Apr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

SN74AHCT16244 Behavioral SPICE Model

SCLM251.ZIP (7 KB) - PSpice Model
Simulation model

SN74AHCT16244 IBIS Model (Rev. A)

SCLM071A.ZIP (17 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
TVSOP (DGV) 48 Ultra Librarian

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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