SN74CB3Q3253

Name: SN74CB3Q3253
Brand: TI
SKU: SN74CB3Q3253
Price: 0.22 USD

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3.3-V, 4:1, 2-channel FET Bus Switch

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Data sheet

document-pdfAcrobat SN74CB3Q3253 Dual 1-of-4 FET Multiplexer – Demultiplexer 2.5-V – 3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. C) PDF | HTML

SN74CB3Q3253

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Data sheet

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Product details

Configuration

4:1

Number of channels

2

Power supply voltage - single (V)

2.5, 3.3

Protocols

Analog

Ron (typ) (Ω)

3.5

CON (typ) (pF)

13

Supply current (typ) (µA)

700

Bandwidth (MHz)

500

Operating temperature range (°C)

-40 to 85

Features

Powered-off protection, Supports input voltage beyond supply

Input/output continuous current (max) (mA)

64

Rating

Catalog

Drain supply voltage (max) (V)

3.6

Supply voltage (max) (V)

3.6

Configuration

4:1

Number of channels

2

Power supply voltage - single (V)

2.5, 3.3

Protocols

Analog

Ron (typ) (Ω)

3.5

CON (typ) (pF)

13

Supply current (typ) (µA)

700

Bandwidth (MHz)

500

Operating temperature range (°C)

-40 to 85

Features

Powered-off protection, Supports input voltage beyond supply

Input/output continuous current (max) (mA)

64

Rating

Catalog

Drain supply voltage (max) (V)

3.6

Supply voltage (max) (V)

3.6

SSOP (DBQ)

16

29.4 mm² 4.9 x 6

TSSOP (PW)

16

32 mm² 5 x 6.4

TVSOP (DGV)

16

23.04 mm² 3.6 x 6.4

VQFN (RGY)

16

14 mm² 4 x 3.5

High-Bandwidth Data Path (Up to 500 MHz) ⁽¹⁾
5-V Tolerant I/Os With Device Powered Up or Powered Down
Low and Flat ON-State Resistance (r_on) Characteristics Over Operating Range (r_on = 4 Ω Typical)
Rail-to-Rail Switching on Data I/O Ports
- 0- to 5-V Switching With 3.3-V V_CC
- 0- to 3.3-V Switching With 2.5-V V_CC
Bidirectional Data Flow With Near-Zero Propagation Delay
Low Input/Output Capacitance Minimizes Loading and Signal Distortion (C_io(OFF) = 3.5 pF Typical)
Fast Switching Frequency (f_OE = 20 MHz Max)
Data and Control Inputs Provide Undershoot Clamp Diodes
Low Power Consumption (I_CC= 0.6 mA Typical)
V_CC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signal Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
Control Inputs Can be Driven by TTL or 5-V and 3.3-V CMOS Outputs
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface Bus Isolation, Low-Distortion Signal Gating ⁽¹⁾

⁽¹⁾ For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report CBT-C, CB3T, and CB3Q Signal-Switch Families, (SCDA008).

High-Bandwidth Data Path (Up to 500 MHz) ⁽¹⁾
5-V Tolerant I/Os With Device Powered Up or Powered Down
Low and Flat ON-State Resistance (r_on) Characteristics Over Operating Range (r_on = 4 Ω Typical)
Rail-to-Rail Switching on Data I/O Ports
- 0- to 5-V Switching With 3.3-V V_CC
- 0- to 3.3-V Switching With 2.5-V V_CC
Bidirectional Data Flow With Near-Zero Propagation Delay
Low Input/Output Capacitance Minimizes Loading and Signal Distortion (C_io(OFF) = 3.5 pF Typical)
Fast Switching Frequency (f_OE = 20 MHz Max)
Data and Control Inputs Provide Undershoot Clamp Diodes
Low Power Consumption (I_CC= 0.6 mA Typical)
V_CC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signal Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
Control Inputs Can be Driven by TTL or 5-V and 3.3-V CMOS Outputs
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface Bus Isolation, Low-Distortion Signal Gating ⁽¹⁾

⁽¹⁾ For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report CBT-C, CB3T, and CB3Q Signal-Switch Families, (SCDA008).

The SN74CB3Q3253 device is a high-bandwidth FET bus switch using a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (r_on). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input and output (I/O) ports.

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	Type	Title		Date
*	Data sheet	SN74CB3Q3253 Dual 1-of-4 FET Multiplexer – Demultiplexer 2.5-V – 3.3-V Low-Voltage High-Bandwidth Bus Switch datasheet (Rev. C)	PDF \| HTML	27 Jun 2018
	Application note	Selecting the Correct Texas Instruments Signal Switch (Rev. E)	PDF \| HTML	02 Jun 2022
	Application note	Multiplexers and Signal Switches Glossary (Rev. B)	PDF \| HTML	01 Dec 2021
	Application note	CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C)	PDF \| HTML	19 Nov 2021
	Application brief	Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C)	PDF \| HTML	06 Jan 2021
	Selection guide	Logic Guide (Rev. AB)		12 Jun 2017
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		02 Dec 2015
	User guide	LOGIC Pocket Data Book (Rev. B)		16 Jan 2007
	More literature	Digital Bus Switch Selection Guide (Rev. A)		10 Nov 2004
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		08 Jul 2004
	User guide	Signal Switch Data Book (Rev. A)		14 Nov 2003
	Application note	Bus FET Switch Solutions for Live Insertion Applications		07 Feb 2003

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

User guide: PDF

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Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.

User guide: PDF