Startseite Mikrocontroller (MCUs) & Prozessoren Digitale Signalprozessoren (DSPs)
Startseite
Mikrocontroller (MCUs) & Prozessoren
Digitale Signalprozessoren (DSPs)

66AK2L06

AKTIV

System-on-Chip (SoC) mit Multicore-DSP + ARM KeyStone II

Jetzt bestellen
Datenblatt
Fehlerverzeichnis

66AK2L06

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

DSP type 4 C66x DSP (max) (MHz) 1200 CPU 32-/64-bit Operating system Integrity, Linux, SYS/BIOS, VxWorks Security Cryptographic acceleration, Device identity, Secure boot Ethernet MAC 4-port 1Gb Switch PCIe 2 PCIe Gen2 Rating Catalog Operating temperature range (°C) 0 to 0
DSP type 4 C66x DSP (max) (MHz) 1200 CPU 32-/64-bit Operating system Integrity, Linux, SYS/BIOS, VxWorks Security Cryptographic acceleration, Device identity, Secure boot Ethernet MAC 4-port 1Gb Switch PCIe 2 PCIe Gen2 Rating Catalog Operating temperature range (°C) 0 to 0
FCBGA (CMS) 900 625 mm² 25 x 25
  • Four TMS320C66x DSP Core Subsystems (C66x
    CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point
      DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2
        GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D PerCorePac
      • 1024K Byte Local L2 Per CorePac
  • ARM CorePac
    • Two ARM® Cortex®-A15 MPCore™ Processors
      at Up to 1.2 GHz
    • 1MB L2 Cache Memory Shared by Two ARM
      Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC for Low
      Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by Four DSP
      CorePacs and One ARM CorePac
    • Memory Protection Unit for Both MSM SRAM
      and DDR3_EMIF
  • On-chip Standalone RAM (OSR) - 1MB On-Chip
    SRAM for Additional Shared Memory
  • Hardware Coprocessors
    • Two Fast Fourier Transform Coprocessors
      • Support Up to 1200 Msps at FFT Size 1024
      • Support Max FFT Size 8192
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • Packet-Based DMA for Zero-Overhead
      Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security AcceleratorEngine Enables Support for
      • IPSec, SRTP, and SSL/TLS Security
      • ECB, CBC, CTR, F8,CCM, GCM, HMAC,
        CMAC, GMAC, AES, DES, 3DES, SHA-1,
        SHA-2 (256-bit Hash), MD5
      • Up to 6.4 Gbps IPSec
    • Ethernet Subsystem
    • Peripherals
      • DigitalFront End (DFE) Subsystem
        • Support up to Four Lane JESD204A/B (7.37
          Gbps Line Rate Max.) Interface to Multiple
          Data Converters
        • Integration of Digital Down/Up-Conversion
          (DDC/DUC) Module
      • IQNet Subsystem
        • Transporting data streams to an integrated
          Digital Front End (DFE)
      • Two One-Lane PCIe Gen2 Interfaces
        • Supports Up to 5 GBaud
      • Three Enhanced Direct Memory Access (EDMA)
        Controllers
      • 72-Bit DDR3 Interface, Speeds Up to 1600 MHz
      • EMIF16 Interface
      • USB 3.0 Interface
      • USIM Interface
      • Four UART Interfaces
      • Three I2C Interfaces
      • 64 GPIO Pins
      • Three SPI Interfaces
      • Semaphore Module
      • Fourteen 64-Bit Timers
    • Commercial Case Temperature:
      • 0°C to 100°C
    • Extended Case Temperature:
      • –40°C to 100°C
  • Four TMS320C66x DSP Core Subsystems (C66x
    CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed/Floating-Point
      DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2
        GHz
    • Memory
      • 32K Byte L1P Per CorePac
      • 32K Byte L1D PerCorePac
      • 1024K Byte Local L2 Per CorePac
  • ARM CorePac
    • Two ARM® Cortex®-A15 MPCore™ Processors
      at Up to 1.2 GHz
    • 1MB L2 Cache Memory Shared by Two ARM
      Cores
    • Full Implementation of ARMv7-A Architecture
      Instruction Set
    • 32KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE)
      Master Port, Connected to MSMC for Low
      Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 2 MB SRAM Memory Shared by Four DSP
      CorePacs and One ARM CorePac
    • Memory Protection Unit for Both MSM SRAM
      and DDR3_EMIF
  • On-chip Standalone RAM (OSR) - 1MB On-Chip
    SRAM for Additional Shared Memory
  • Hardware Coprocessors
    • Two Fast Fourier Transform Coprocessors
      • Support Up to 1200 Msps at FFT Size 1024
      • Support Max FFT Size 8192
  • Multicore Navigator
    • 8k Multi-Purpose Hardware Queues with Queue
      Manager
    • Packet-Based DMA for Zero-Overhead
      Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • 1 Gbps Wire Speed Throughput at 1.5
        MPackets Per Second
    • Security AcceleratorEngine Enables Support for
      • IPSec, SRTP, and SSL/TLS Security
      • ECB, CBC, CTR, F8,CCM, GCM, HMAC,
        CMAC, GMAC, AES, DES, 3DES, SHA-1,
        SHA-2 (256-bit Hash), MD5
      • Up to 6.4 Gbps IPSec
    • Ethernet Subsystem
    • Peripherals
      • DigitalFront End (DFE) Subsystem
        • Support up to Four Lane JESD204A/B (7.37
          Gbps Line Rate Max.) Interface to Multiple
          Data Converters
        • Integration of Digital Down/Up-Conversion
          (DDC/DUC) Module
      • IQNet Subsystem
        • Transporting data streams to an integrated
          Digital Front End (DFE)
      • Two One-Lane PCIe Gen2 Interfaces
        • Supports Up to 5 GBaud
      • Three Enhanced Direct Memory Access (EDMA)
        Controllers
      • 72-Bit DDR3 Interface, Speeds Up to 1600 MHz
      • EMIF16 Interface
      • USB 3.0 Interface
      • USIM Interface
      • Four UART Interfaces
      • Three I2C Interfaces
      • 64 GPIO Pins
      • Three SPI Interfaces
      • Semaphore Module
      • Fourteen 64-Bit Timers
    • Commercial Case Temperature:
      • 0°C to 100°C
    • Extended Case Temperature:
      • –40°C to 100°C

The 66AK2L06 KeyStone SoC is a member of the C66x family based on TI's new KeyStone II Multicore SoC Architecture and is a low-power solution with integrated JESD204B lanes that meets the more stringent power, size, and cost requirements of applications requiring connectivity with ADC and DAC based applications. The device’s ARM and DSP cores deliver exceptional processing power on platforms requiring high signal and control processing.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (ARM CorePac, C66x CorePacs, IP network, Digital Front End, and FFT processing) and uses a queue-based communication system that allows the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

The addition of the ARM CorePac in the 66AK2L06 device enables the ability for complex control code processing on-chip. Operations such as housekeeping and management processing can be performed with the Cortex-A15 processor.

TI’s new C66x core launches a new era of DSP technology by combining fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x CorePac incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2L06 contains many coprocessors to offload the bulk of the processing demands of higher layers of application. This keeps the cores free for algorithms and other differentiating functions. The SoC contains multiple copies of key coprocessors such as the FFTC. The architectural elements of the SoC (Multicore Navigator) ensure that data is processed without any CPU intervention or overhead, allowing the system to make optimal use of its resources.

TI’s scalable multicore SoC architecture solutions provide developers with a range of software-compatible and hardware-compatible devices to minimize development time and maximize reuse.

The 66AK2L06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows and Linux debugger interface for visibility into source code execution.

The 66AK2L06 KeyStone SoC is a member of the C66x family based on TI's new KeyStone II Multicore SoC Architecture and is a low-power solution with integrated JESD204B lanes that meets the more stringent power, size, and cost requirements of applications requiring connectivity with ADC and DAC based applications. The device’s ARM and DSP cores deliver exceptional processing power on platforms requiring high signal and control processing.

TI’s KeyStone II Architecture provides a programmable platform integrating various subsystems (ARM CorePac, C66x CorePacs, IP network, Digital Front End, and FFT processing) and uses a queue-based communication system that allows the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet switch that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high-speed IO, to each operate at maximum efficiency with no blocking or stalling.

The addition of the ARM CorePac in the 66AK2L06 device enables the ability for complex control code processing on-chip. Operations such as housekeeping and management processing can be performed with the Cortex-A15 processor.

TI’s new C66x core launches a new era of DSP technology by combining fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is an industry-leading 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x CorePac incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2L06 contains many coprocessors to offload the bulk of the processing demands of higher layers of application. This keeps the cores free for algorithms and other differentiating functions. The SoC contains multiple copies of key coprocessors such as the FFTC. The architectural elements of the SoC (Multicore Navigator) ensure that data is processed without any CPU intervention or overhead, allowing the system to make optimal use of its resources.

TI’s scalable multicore SoC architecture solutions provide developers with a range of software-compatible and hardware-compatible devices to minimize development time and maximize reuse.

The 66AK2L06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows and Linux debugger interface for visibility into source code execution.
filter Andere Digitale Signalprozessoren (DSPs) suchen
Herunterladen Video mit Transkript ansehen Video
Support through a third party

This product does not have ongoing direct design support from TI. For support while working through your design, you may contact the following third party: Azcom Technology.

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 67
Typ Titel Datum
* Data sheet 66AK2L06 Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet 21 Apr 2015
* Errata 66AK2Lxx Multicore DSP+ARM KeyStone II SOC (Silicon Revision 1.0) 20 Apr 2015
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 07 Jul 2022
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 25 Jun 2021
Application note Using Arm ROM Bootloader on Keystone II Devices PDF | HTML 04 Jun 2019
User guide KeyStone II Architecture Universal Serial Bus 3.0 (USB 3.0) (Rev. A) 21 Aug 2017
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 14 Aug 2017
User guide Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 26 Jul 2017
Design guide Wideband Receiver With 66AK2L06 JESD204B Attach to ADC32RF80 Reference Design 23 Sep 2016
Application note Keystone EDMA FAQ 01 Sep 2016
Third party document Download XEVMK2LX schematics, bill of materials and design guide 03 Aug 2016
Third party document XEVMK2LX Quick Setup Guide 03 Aug 2016
User guide Serializer/Deserializer (SerDes) for KeyStone II Devices User Guide (Rev. A) 27 Jul 2016
Application note Power Management of KS2 Device (Rev. C) 15 Jul 2016
Application note 66AK2L06 JESD Attach to ADC12J4000/DAC38J84 Getting Started Guide (Rev. B) 20 Jun 2016
Technical article How to complete your RF sampling solution PDF | HTML 18 Mai 2016
Application note SERDES Link Commissioning on KeyStone I and II Devices 13 Apr 2016
Technical article Accelerating the Fast Fourier Transform (FFT/iFFT) by 10x and more PDF | HTML 02 Mär 2016
White paper Multicore SoCs stay a step ahead of SoC FPGAs 23 Feb 2016
Application note TI DSP Benchmarking 13 Jan 2016
Application note Throughput Performance Guide for KeyStone II Devices (Rev. B) 22 Dez 2015
White paper Optimizing Modern Radar Systems using Low- Latency, High-Performance FFT Coproce 17 Dez 2015
Technical article Are 66AK2L06 SoCs an answer to miniaturization of test and measurement equipment? PDF | HTML 02 Dez 2015
White paper Optimizing your test and measurement solution by leveraging the most integrated 03 Nov 2015
Design guide 66AK2L06 JESD Attach to ADC12J4000 / DAC38J84 Design Guide (Rev. A) 22 Okt 2015
Application note Keystone II DDR3 Debug Guide 16 Okt 2015
Application note System solution for avionics & defense 23 Sep 2015
Application note TPS544Bxx/TPS544Cxx Powering TCI6630K2L in Smart Reflex Class 0 TC Mode 18 Sep 2015
Technical article Summertime showdown: DSPs vs FPGAs PDF | HTML 09 Jul 2015
User guide Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) 06 Mai 2015
Technical article Wireless infrastructure - Now simpler and more accessible! PDF | HTML 05 Mai 2015
User guide Gigabit Ethernet (GbE) Switch SS for K2E & K2L Devices User's Guide (Rev. A) 28 Apr 2015
Product overview 66AK2L06 SoC Product Bulletin 15 Apr 2015
User guide Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 09 Apr 2015
White paper Optimizing synthetic aperture radar design with TI's integrated 66AK2L06 SoC 09 Apr 2015
User guide DDR3 Memory Controller for KeyStone II Devices User's Guide (Rev. C) 27 Mär 2015
User guide Digital Front End (DFE) for Keystone II Devices User's Guide (Rev. A) 23 Mär 2015
White paper Ready to make the jump to JESD204B? White Paper (Rev. B) 19 Mär 2015
User guide Fast Fourier Transform Coprocessor (FFTC) for KeyStone II Devices User's Guide (Rev. A) 11 Feb 2015
Application note Keystone II DDR3 Initialization 26 Jan 2015
User guide IQN2 for KeyStone II Devices User's Guide (Rev. A) 01 Okt 2014
User guide Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 04 Sep 2014
User guide Packet Accelerator 2 (PA2) for K2E and K2L Devices User's Guide 19 Aug 2014
User guide Security Accelerator 2 (SA2) for K2E and K2L Devices User's Guide 19 Aug 2014
User guide Network Coprocessor (NETCP) for K2E and K2L Devices User's Guide 13 Aug 2014
Application note Hardware Design Guide for KeyStone II Devices 24 Mär 2014
User guide Debug and Trace for KeyStone II Devices User's Guide 26 Jul 2013
User guide DSP Bootloader for KeyStone Architecture User's Guide (Rev. C) 15 Jul 2013
User guide C66x CorePac User's Guide (Rev. C) 28 Jun 2013
User guide Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 28 Jun 2013
User guide Multicore Shared Memory Controller (MSMC) User Guide for KeyStone II Devices 12 Nov 2012
User guide ARM CorePac User Guide for KeyStone II Devices 31 Okt 2012
Application note Multicore Programming Guide (Rev. B) 29 Aug 2012
User guide Semaphore2 Hardware Module for KeyStone Devices User's Guide (Rev. A) 24 Apr 2012
User guide Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 30 Mär 2012
User guide Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 27 Mär 2012
User guide 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 22 Mär 2012
Application note PCIe Use Cases for KeyStone Devices 13 Dez 2011
Application note Introduction to TMS320C6000 DSP Optimization 06 Okt 2011
User guide Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 02 Sep 2011
User guide External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 24 Mai 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 Mai 2011
User guide C66x CPU and Instruction Set Reference Guide 09 Nov 2010
User guide C66x DSP Cache User's Guide 09 Nov 2010
Application note Clocking Design Guide for KeyStone Devices 09 Nov 2010
User guide General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 09 Nov 2010
Application note Optimizing Loops on the C66x DSP 09 Nov 2010

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Debug-Tastkopf

TMDSEMU200-U — XDS200-USB-Debug-Tastkopf

Die XDS200 ist eine Debug-Sonde (Emulator) zum Debuggen von Embedded-Bausteinen von TI. Die XDS200 bietet ein ausgewogenes Preis-Leistungsverhältnis im Vergleich zum preiswerten XDS110 und dem leistungsstarken XDS560v2 und unterstützt zahlreiche Standards (IEEE1149,1, IEEE1149,7, SWD) in einem (...)

Nicht verfügbar auf TI.com
Debug-Tastkopf

TMDSEMU560V2STM-U — XDS560v2 System-Trace-USB-Debug-Tastkopf

Der XDS560v2 ist die leistungsstärkste Debug-Sonde aus der XDS560™ Familie von Debug-Sonden und unterstützt sowohl den traditionellen JTAG-Standard (IEEE1149.1) als auch cJTAG (IEEE1149.7).  Bitte beachten: Diese Lösung unterstützt kein Serial Wire Debug (SWD).

Alle XDS-Debug-Tastköpfe unterstützen (...)

Nicht verfügbar auf TI.com
Debug-Tastkopf

TMDSEMU560V2STM-UE — XDS560v2 System-Trace-USB-und Ethernet-Debug-Tastkopf

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

Nicht verfügbar auf TI.com
Software-Entwicklungskit (SDK)

BIOSLINUXMCSDK-K2 — MCSDK supporting SYS/BIOS RTOS and Linux OS for KeyStone II ARM A15 + DSP C66x

NOTE: K2x, C665x and C667x devices are now actively maintained on the Processor-SDK release stream. See links above.

Our Multicore Software Development Kits (MCSDK) provide highly-optimized bundles of foundational, platform-specific drivers to enable development on selected TI ARM and DSP devices. (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
ARM-basierte Prozessoren
66AK2E05 — Hochleistungs-Multicore DSP+Arm – 4x Arm A15-Kerne, 1x C66x DSP-Kern, NetCP, 10 GbE 66AK2H06 — Hochleistungs-Multicore-DSP+Arm – 2x Arm A15-Kerne, 4x C66x-DSP-Kerne 66AK2H12 — Hochleistungs-Multicore-DSP+Arm – 4x Arm A15-Kerne, 8x C66x-DSP-Kerne 66AK2H14 — Hochleistungs-Multicore-DSP+Arm – 4x Arm A15-Kerne, 8x C66x DSP-Kerne, 10 GbE AM5K2E02 — Sitara-Prozessor: Dual-Arm Cortex-A15 AM5K2E04 — Sitara-Prozessor: Vierfach-Arm Cortex-A15
Digitale Signalprozessoren (DSPs)
66AK2L06 — System-on-Chip (SoC) mit Multicore-DSP + ARM KeyStone II
Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-LINUX-K2L — Linux Processor SDK for K2L

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
Digitale Signalprozessoren (DSPs)
66AK2L06 — System-on-Chip (SoC) mit Multicore-DSP + ARM KeyStone II
Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-LINUX-RT-K2L — Linux-RT Processor SDK for K2L

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
Digitale Signalprozessoren (DSPs)
66AK2L06 — System-on-Chip (SoC) mit Multicore-DSP + ARM KeyStone II
Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-RTOS-K2L — RTOS Processor SDK for K2L

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
Digitale Signalprozessoren (DSPs)
66AK2L06 — System-on-Chip (SoC) mit Multicore-DSP + ARM KeyStone II
Download-Optionen
Software-Entwicklungskit (SDK)

RFSDK — Radio-Frequenz-Software Developer Kit (RFSDK)

Texas Instruments Radio Frequency Software Development Kit (RFSDK) is a collection of highly optimized APIs and highly abstracted commands to control, configure and manage the JESD204B interface, digital front end (DFE), analog front end (AFE) and high speed data converters (ADC/DAC). The RFSDK (...)
View Options
Treiber oder Bibliothek

MATHLIB — DSP-Mathematikbibliothek für Fließkommabausteine

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
View Options
Treiber oder Bibliothek

SPRC264 — TMS320C5000/6000-Bildbibliothek (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Benutzerhandbuch: PDF
View Options
Treiber oder Bibliothek

SPRC265 — TMS320C6000-DSP-Bibliothek (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Benutzerhandbuch: PDF
View Options
IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Diese Designressource unterstützt die meisten Produkte in diesen Kategorien.

Informationen zum Support sind der Seite mit den Produktdetails zu entnehmen.
Start Download-Optionen
Software-Codec

C66XCODECS — CODECS – Video, Sprache – für C66x-basierte Geräte

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)
View Options
Simulationsmodell

66AK2L06 Power Consumption Model

SPRM656.ZIP (169 KB) - Power Model
Herunterladen
Simulationsmodell

KeyStone II IBIS AMI Models

SPRM743.ZIP (265889 KB) - IBIS-AMI Model
lock = Nur mit Exportgenehmigung (1 Minute)
lock Herunterladen
Simulationsmodell

TCI6632K2L TCI6631K2L and TCI6630K2L AAW IBIS Model

SPRM589.ZIP (3192 KB) - IBIS Model
Herunterladen
Referenzdesigns

TIDEP0081 — Breitband-Empfänger mit 66AK2L06 JESD204B-Anbindung an ADC32RF80 – Referenzdesign

For wideband receiver system developers currently using FPGA or ASIC to connect High Speed data converters to a baseband processor, who need faster time to market with increased performance and significant reduction in cost, power, and size. This reference design includes the first widely available (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDEP0060 — Optimiertes Radarsystem-Referenzdesign mit DSP + ARM SoC

For modern radar system developers currently using an FPGA or ASIC to connect to high speed data converters, who need faster time to market with increased performance and significant reduction in cost, power, and size, this reference design includes the first widely available processor integrating (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDEP0034 — 66AK2L06 DSP+ARM-Prozessor mit JESD204B-Anbindung an Breitband-A/D-Wandler und -D/A-Wandler

For developers currently using an FPGA or ASIC to connect to high speed data converters who need faster time to market with increased performance and significant reduction in cost, power, and size this reference design includes the first widely available processor integrating a JESD204B interface (...)
Design guide: PDF
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCBGA (CMS) 900 Ultra Librarian
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos