Inicio Microcontroladores (MCU) y procesadores Procesadores digitales de señales (DSP)
Inicio
Microcontroladores (MCU) y procesadores
Procesadores digitales de señales (DSP)

TMS320C6655

ACTIVO

DSP de punto fijo y flotante C66x de hasta 1.25 GHz, un solo núcleo y alto rendimiento

Haga su pedido ahora
Hoja de datos
Errata

TMS320C6655

ACTIVO
Hoja de datos Haga su pedido ahora

Detalles del producto

DSP type 1 C66x DSP (max) (MHz) 1000, 1250 CPU 32-/64-bit Operating system DSP/BIOS Ethernet MAC 10/100/1000 PCIe 2 PCIe Gen2 Rating Catalog Operating temperature range (°C) -40 to 100
DSP type 1 C66x DSP (max) (MHz) 1000, 1250 CPU 32-/64-bit Operating system DSP/BIOS Ethernet MAC 10/100/1000 PCIe 2 PCIe Gen2 Rating Catalog Operating temperature range (°C) -40 to 100
FCBGA (CZH) 625 441 mm² 21 x 21 FCBGA (GZH) 625 441 mm² 21 x 21
  • One (C6655) or Two (C6657) TMS320C66x™ DSP Core Subsystems (CorePacs), Each With
    • 850 MHz (C6657 only), 1.0 GHz, or 1.25 GHz C66x Fixed- and Floating-Point CPU Core
      • 40 GMAC per Core for Fixed Point @ 1.25 GHz
      • 20 GFLOP per Core for Floating Point @ 1.25 GHz
  • Multicore Shared Memory Controller (MSMC)
    • 1024KB MSM SRAM Memory
      (Shared by Two DSP C66x CorePacs for C6657)
    • Memory Protection Unit for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 8192 Multipurpose Hardware Queues with Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Hardware Accelerators
    • Two Viterbi Coprocessors
    • One Turbo Coprocessor Decoder
  • Peripherals
    • Four Lanes of SRIO 2.1
      • 1.24, 2.5, 3.125, and 5 GBaud Operation Supported Per Lane
      • Supports Direct I/O, Message Passing
      • Supports Four 1×, Two 2×, One 4×, and Two 1× + One 2× Link Configurations
    • PCIe Gen2
      • Single Port Supporting 1 or 2 Lanes
      • Supports up to 5 GBaud Per Lane
    • HyperLink
      • Supports Connections to Other KeyStone Architecture Devices Providing Resource Scalability
      • Supports up to 40 Gbaud
    • Gigabit Ethernet (GbE) Subsystem
      • One SGMII Port
      • Supports 10-, 100-, and 1000-Mbps Operation
    • 32-Bit DDR3 Interface
      • DDR3-1333
      • 4GB of Addressable Memory Space
    • 16-Bit EMIF
    • Universal Parallel Port
      • Two Channels of 8 Bits or 16 Bits Each
      • Supports SDR and DDR Transfers
    • Two UART Interfaces
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • I2C Interface
    • 32 GPIO Pins
    • SPI Interface
    • Semaphore Module
    • Up to Eight 64-Bit Timers
    • Two On-Chip PLLs
  • Commercial Temperature:
    • 0°C to 85°C
  • Extended Temperature:
    • –40°C to 100°C
  • One (C6655) or Two (C6657) TMS320C66x™ DSP Core Subsystems (CorePacs), Each With
    • 850 MHz (C6657 only), 1.0 GHz, or 1.25 GHz C66x Fixed- and Floating-Point CPU Core
      • 40 GMAC per Core for Fixed Point @ 1.25 GHz
      • 20 GFLOP per Core for Floating Point @ 1.25 GHz
  • Multicore Shared Memory Controller (MSMC)
    • 1024KB MSM SRAM Memory
      (Shared by Two DSP C66x CorePacs for C6657)
    • Memory Protection Unit for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 8192 Multipurpose Hardware Queues with Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Hardware Accelerators
    • Two Viterbi Coprocessors
    • One Turbo Coprocessor Decoder
  • Peripherals
    • Four Lanes of SRIO 2.1
      • 1.24, 2.5, 3.125, and 5 GBaud Operation Supported Per Lane
      • Supports Direct I/O, Message Passing
      • Supports Four 1×, Two 2×, One 4×, and Two 1× + One 2× Link Configurations
    • PCIe Gen2
      • Single Port Supporting 1 or 2 Lanes
      • Supports up to 5 GBaud Per Lane
    • HyperLink
      • Supports Connections to Other KeyStone Architecture Devices Providing Resource Scalability
      • Supports up to 40 Gbaud
    • Gigabit Ethernet (GbE) Subsystem
      • One SGMII Port
      • Supports 10-, 100-, and 1000-Mbps Operation
    • 32-Bit DDR3 Interface
      • DDR3-1333
      • 4GB of Addressable Memory Space
    • 16-Bit EMIF
    • Universal Parallel Port
      • Two Channels of 8 Bits or 16 Bits Each
      • Supports SDR and DDR Transfers
    • Two UART Interfaces
    • Two Multichannel Buffered Serial Ports (McBSPs)
    • I2C Interface
    • 32 GPIO Pins
    • SPI Interface
    • Semaphore Module
    • Up to Eight 64-Bit Timers
    • Two On-Chip PLLs
  • Commercial Temperature:
    • 0°C to 85°C
  • Extended Temperature:
    • –40°C to 100°C

The C665x are high performance fixed- and floating-point DSPs that are based on TI’s KeyStone multicore architecture. Incorporating the new and innovative C66x DSP core, this device can run at a core speed of up to 1.25 GHz. For developers of a broad range of applications, both C665x DSPs enable a platform that is power-efficient and easy to use. In addition, the C665x DSPs are fully backward compatible with all existing C6000™ family of fixed- and floating-point DSPs.

TI’s KeyStone architecture provides a programmable platform integrating various subsystems (C66x cores, memory subsystem, peripherals, and accelerators) and uses several innovative components and techniques to maximize intradevice and interdevice communication that lets the various DSP resources operate efficiently and seamlessly. Central to this architecture are key components such as Multicore Navigator that allows for efficient data management between the various device components. The TeraNet is a nonblocking switch fabric enabling fast and contention-free internal data movement. The multicore shared memory controller allows access to shared and external memory directly without drawing from switch fabric capacity.

For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64x+ cores. In addition, the C66x core integrates floating-point capability and the per-core raw computational performance is an industry-leading 40 GMACS per core and 20 GFLOPS per core (@1.25 GHz operating frequency). The C66x core can execute 8 single precision floating-point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE 754 compliant. The C66x core incorporates 90 new instructions (compared to the C64x+ core) targeted for floating-point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backward code-compatible with TI’s previous generation C6000 fixed- and floating-point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.

The C665x DSP integrates a large amount of on-chip memory. In addition to 32KB of L1 program and data cache, 1024KB of dedicated memory can be configured as mapped RAM or cache. The device also integrates 1024KB of Multicore Shared Memory that can be used as a shared L2 SRAM and/or shared L3 SRAM. All L2 memories incorporate error detection and error correction. For fast access to external memory, this device includes a 32-bit DDR-3 external memory interface (EMIF) running at a rate of 1333 MHz and has ECC DRAM support.

This family supports a number of high-speed standard interfaces including RapidIO ver 2, PCI Express Gen2, and Gigabit Ethernet. This family of DSPs also includes I2C, UART, Multichannel Buffered Serial Port (McBSP), Universal Parallel Port (uPP), and a 16-bit asynchronous EMIF, along with general-purpose CMOS IO. For high throughput, low latency communication between devices or with an FPGA, a 40-Gbaud full-duplex interface called HyperLink is included.

The C665x devices have a complete set of development tools, which includes: an enhanced C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

TI’s KeyStone Multicore Architecture provides a high performance structure for integrating RISC and DSP cores with application-specific coprocessors and I/O. The KeyStone architecture is the first of its kind that provides adequate internal bandwidth for nonblocking access to all processing cores, peripherals, coprocessors, and I/O. This internal bandwidth is achieved with four main hardware elements: Multicore Navigator, TeraNet, Multicore Shared Memory Controller, and HyperLink.

Multicore Navigator is an innovative packet-based manager that controls 8192 queues. When tasks are allocated to the queues, Multicore Navigator provides hardware-accelerated dispatch that directs tasks to the appropriate available hardware. The packet-based system on a chip (SoC) uses the two Tbps capacity of the TeraNet switched central resource to move packets. The Multicore Shared Memory Controller lets processing cores access shared memory directly without drawing from the capacity of TeraNet, so packet movement cannot be blocked by memory access.

HyperLink provides a 40-Gbaud chip-level interconnect that lets SoCs work in tandem. The low-protocol overhead and high throughput of HyperLink make an ideal interface for chip-to-chip interconnections. Working with Multicore Navigator, HyperLink dispatches tasks to tandem devices transparently and executes tasks as if they are running on local resources.

The C665x are high performance fixed- and floating-point DSPs that are based on TI’s KeyStone multicore architecture. Incorporating the new and innovative C66x DSP core, this device can run at a core speed of up to 1.25 GHz. For developers of a broad range of applications, both C665x DSPs enable a platform that is power-efficient and easy to use. In addition, the C665x DSPs are fully backward compatible with all existing C6000™ family of fixed- and floating-point DSPs.

TI’s KeyStone architecture provides a programmable platform integrating various subsystems (C66x cores, memory subsystem, peripherals, and accelerators) and uses several innovative components and techniques to maximize intradevice and interdevice communication that lets the various DSP resources operate efficiently and seamlessly. Central to this architecture are key components such as Multicore Navigator that allows for efficient data management between the various device components. The TeraNet is a nonblocking switch fabric enabling fast and contention-free internal data movement. The multicore shared memory controller allows access to shared and external memory directly without drawing from switch fabric capacity.

For fixed-point use, the C66x core has 4× the multiply accumulate (MAC) capability of C64x+ cores. In addition, the C66x core integrates floating-point capability and the per-core raw computational performance is an industry-leading 40 GMACS per core and 20 GFLOPS per core (@1.25 GHz operating frequency). The C66x core can execute 8 single precision floating-point MAC operations per cycle and can perform double- and mixed-precision operations and is IEEE 754 compliant. The C66x core incorporates 90 new instructions (compared to the C64x+ core) targeted for floating-point and vector math oriented processing. These enhancements yield sizeable performance improvements in popular DSP kernels used in signal processing, mathematical, and image acquisition functions. The C66x core is backward code-compatible with TI’s previous generation C6000 fixed- and floating-point DSP cores, ensuring software portability and shortened software development cycles for applications migrating to faster hardware.

The C665x DSP integrates a large amount of on-chip memory. In addition to 32KB of L1 program and data cache, 1024KB of dedicated memory can be configured as mapped RAM or cache. The device also integrates 1024KB of Multicore Shared Memory that can be used as a shared L2 SRAM and/or shared L3 SRAM. All L2 memories incorporate error detection and error correction. For fast access to external memory, this device includes a 32-bit DDR-3 external memory interface (EMIF) running at a rate of 1333 MHz and has ECC DRAM support.

This family supports a number of high-speed standard interfaces including RapidIO ver 2, PCI Express Gen2, and Gigabit Ethernet. This family of DSPs also includes I2C, UART, Multichannel Buffered Serial Port (McBSP), Universal Parallel Port (uPP), and a 16-bit asynchronous EMIF, along with general-purpose CMOS IO. For high throughput, low latency communication between devices or with an FPGA, a 40-Gbaud full-duplex interface called HyperLink is included.

The C665x devices have a complete set of development tools, which includes: an enhanced C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

TI’s KeyStone Multicore Architecture provides a high performance structure for integrating RISC and DSP cores with application-specific coprocessors and I/O. The KeyStone architecture is the first of its kind that provides adequate internal bandwidth for nonblocking access to all processing cores, peripherals, coprocessors, and I/O. This internal bandwidth is achieved with four main hardware elements: Multicore Navigator, TeraNet, Multicore Shared Memory Controller, and HyperLink.

Multicore Navigator is an innovative packet-based manager that controls 8192 queues. When tasks are allocated to the queues, Multicore Navigator provides hardware-accelerated dispatch that directs tasks to the appropriate available hardware. The packet-based system on a chip (SoC) uses the two Tbps capacity of the TeraNet switched central resource to move packets. The Multicore Shared Memory Controller lets processing cores access shared memory directly without drawing from the capacity of TeraNet, so packet movement cannot be blocked by memory access.

HyperLink provides a 40-Gbaud chip-level interconnect that lets SoCs work in tandem. The low-protocol overhead and high throughput of HyperLink make an ideal interface for chip-to-chip interconnections. Working with Multicore Navigator, HyperLink dispatches tasks to tandem devices transparently and executes tasks as if they are running on local resources.
filter Buscar otro/a Procesadores digitales de señales (DSP)
Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 71
Tipo Título Fecha
* Data sheet TMS320C6655 and TMS320C6657 Fixed and Floating-Point Digital Signal Processor datasheet (Rev. D) PDF | HTML 04 sep 2019
* Errata TMS320C6652/54/55/57 Multicore Fixed and Floating-Point DSP SR1.0 (Rev. C) 19 may 2016
Application note DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 07 jul 2022
Application note Keystone Error Detection and Correction EDC ECC (Rev. A) 25 jun 2021
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 19 may 2021
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 01 jun 2020
Application note Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 11 jun 2019
Application note Keystone Bootloader Resources and FAQ 29 may 2019
Application note Keystone Multicore Device Family Schematic Checklist PDF | HTML 17 may 2019
Application note Hardware Design Guide for KeyStone Devices (Rev. D) 21 mar 2019
Application note KeyStone I DDR3 interface bring-up 06 mar 2019
Application note Thermal Design Guide for DSP and Arm Application Processors (Rev. B) 14 ago 2017
User guide Phase-Locked Loop (PLL) for KeyStone Devices User's Guide (Rev. I) 26 jul 2017
Application note KeyStone I DDR3 Initialization (Rev. E) 28 oct 2016
Product overview TMS320C6657/55/54 Power efficient high performance for process-intensive apps (Rev. A) 23 may 2016
Application note SERDES Link Commissioning on KeyStone I and II Devices 13 abr 2016
Application note TI DSP Benchmarking 13 ene 2016
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 13 ago 2015
User guide Enhanced Direct memory Access 3 (EDMA3) for KeyStone Devices User's Guide (Rev. B) 06 may 2015
User guide Multicore Navigator (CPPI) for KeyStone Architecture User's Guide (Rev. H) PDF | HTML 09 abr 2015
White paper TI’s processors leading the way in embedded analytics 03 mar 2015
User guide DDR3 Memory Controller for KeyStone I Devices User's Guide (Rev. E) 20 ene 2015
Application note TI Keystone DSP Hyperlink SerDes IBIS-AMI Models 09 oct 2014
Application note TI Keystone DSP PCIe SerDes IBIS-AMI Models 09 oct 2014
User guide Power Sleep Controller (PSC) for KeyStone Devices User's Guide (Rev. C) 04 sep 2014
User guide Serial RapidIO (SRIO) for KeyStone Devices User's Guide (Rev. C) 03 sep 2014
More literature KeyStone Lab Manual - Training 05 jun 2014
User guide System Analyzer User's Guide (Rev. F) 18 nov 2013
User guide PCI Express (PCIe) for KeyStone Devices User's Guide (Rev. D) 30 sep 2013
User guide DSP Bootloader for KeyStone Architecture User's Guide (Rev. C) 15 jul 2013
White paper Accelerating high-performance computing development with Desktop Linux SDK 08 jul 2013
User guide C66x CorePac User's Guide (Rev. C) 28 jun 2013
User guide Memory Protection Unit (MPU) for KeyStone Devices User's Guide (Rev. A) 28 jun 2013
User guide HyperLink for KeyStone Devices User's Guide (Rev. C) 28 may 2013
Product overview OpenMP Programming for TMS320C66x Multicore DSPs (Rev. A) 05 nov 2012
Application note SerDes Implementation Guidelines for KeyStone I Devices 31 oct 2012
Product overview TMS320C66x high-performance multicore DSPs for video surveillance 06 sep 2012
Application note Multicore Programming Guide (Rev. B) 29 ago 2012
User guide TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 21 ago 2012
User guide TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 21 ago 2012
User guide Ethernet Media Access Controller (EMAC) User's Guide for KeyStone Devices 12 jul 2012
User guide Universal Parallel Port (uPP) for KeyStone Architecture User's Guide 11 jun 2012
User guide Multichannel Buffered Serial Port (MCBSP) User's Guide for KeyStone Devices 25 may 2012
White paper Leveraging multicore processors for machine vision applications 09 may 2012
User guide Serial Peripheral Interface (SPI) for KeyStone Devices User’s Guide (Rev. A) 30 mar 2012
User guide Chip Interrupt Controller (CIC) for KeyStone Devices User's Guide (Rev. A) 27 mar 2012
White paper Superior performance at breakthrough size, weight & power 26 mar 2012
User guide 64-Bit Timer (Timer64) for KeyStone Devices User's Guide (Rev. A) 22 mar 2012
White paper Maximizing Multicore Efficiency with Navigator Runtime 23 feb 2012
Application note PCIe Use Cases for KeyStone Devices 13 dic 2011
User guide Multicore Shared Memory Controller (MSMC) for KeyStone Devices User's Guide (Rev. A) 15 oct 2011
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
User guide Debug and Trace for KeyStone I Devices User's Guide (Rev. A) 22 sep 2011
User guide Inter-Integrated Circuit (I2C) for KeyStone Devices User's Guide 02 sep 2011
White paper KeyStone Multicore SoC Tool Suite: one platform for all needs 17 jun 2011
User guide Viterbi-Decoder Coprocessor 2 (VCP2) for KeyStone Devices User's Guide (Rev. A) 10 jun 2011
User guide External Memory Interface (EMIF16) for KeyStone Devices User's Guide (Rev. A) 24 may 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 may 2011
Application note TMS320C66x DSP Generation of Devices (Rev. A) 25 abr 2011
White paper Software-Based Ultrasound Phase Rotation Beamforming on Multicore DSP 16 mar 2011
White paper Software-Based Ultrasound Beamforming on Multicore DSPs 06 mar 2011
White paper KeyStone Memory Architecture White Paper (Rev. A) 21 dic 2010
User guide Turbo Decoder Coprocessor 3 (TCP3D) for KeyStone Devices User's Guide 18 nov 2010
User guide C66x CPU and Instruction Set Reference Guide 09 nov 2010
User guide C66x DSP Cache User's Guide 09 nov 2010
Application note Clocking Design Guide for KeyStone Devices 09 nov 2010
User guide General-Purpose Input/Output (GPIO) forKeyStone Devices User's Guide 09 nov 2010
Application note Optimizing Loops on the C66x DSP 09 nov 2010
User guide Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices UG 09 nov 2010
User guide Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 23 may 2005
Application note AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 01 may 2004

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMDSEVM6657 — Módulos de evaluación TMS320C6657 Lite

The TMS3206657 Lite Evaluation Module (EVM), is an easy-to-use, cost-efficient development tool that helps developers quickly get started with designs using the C6657 or C6655 or C6654 family of DSPs. The EVM includes an on-board, single C6657 processor with robust connectivity options that allows (...)

No disponible en TI.com
Tarjeta secundaria

SHELD-3P-DSP-SOMS — Placas DSP-FPGA Sheldon

Sheldon Instruments designs and manufactures DSP based, COTS data acquisition and control hardware for PCIe/PCI, PCI104e/PCI104, XMC/PMC, and CompactPCI systems, along with drivers and real time development software for a variety of applications and markets.

Learn more about Sheldon Instruments at (...)
Desde: Sheldon Instruments, Inc.
View Options
Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. El XDS200 presenta un equilibrio de bajo costo con buen rendimiento en comparación con el XDS110 de bajo costo y el XDS560v2 de alto rendimiento. Es compatible con una amplia (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-C665X — SDK de procesador para procesadores C665x: Compatibilidad con TI-RTOS

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
View Options
Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
View Options
Controlador o biblioteca

SPRC264 — TMS320C5000/6000 Biblioteca de imágenes (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
View Options
Controlador o biblioteca

SPRC265 — TMS320C6000 Biblioteca DSP (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
View Options
Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
View Options
IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
Iniciar Opciones de descarga
Códec de software

C66XCODECS — CÓDECS (video, voz) para dispositivos basados en C66x

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)
View Options
Códec de software

VOCAL-3P-DSPVOIPCODECS — Códecs de tecnologías vocales DSP VoIP

With over 25 years of assembly and C code development, VOCAL modular software suite is available for a wide variety of TI DSPs. Products include ATAs, VoIP servers and gateways, HPNA-based IPBXs, video surveillance, voice and video conferencing, voice and data RF devices, RoIP gateways, secure (...)
Desde: VOCAL Technologies, Ltd.
Visitar el sitio del socio
Modelo de simulación

C6655 Power Consumption Model

SPRM601.ZIP (176 KB) - Power Model
Descargar
Modelo de simulación

KeyStone I SerDes IBIS AMI Models

SPRM742.ZIP (969314 KB) - IBIS Model
lock = Requiere aprobación de exportación (1 minuto)
lock Descargar
Modelo de simulación

TMS320C6655/57 CYP IBIS Model (revision 1.2)

SPRM570.ZIP (415 KB) - IBIS Model
Descargar
Modelo de simulación

TMS320C6657/55/54 CZH BSDL Model (Silicon Revision 1)

SPRM572.ZIP (21 KB) - BSDL Model
Descargar
Esquema

TMS320C6655/57 ORCAD Capture Library Files

SPRR178.ZIP (12 KB)
Descargar
Diseños de referencia

TIDEP-0099 — Diseño de referencia del sistema de preprocesamiento de audio para aplicaciones basadas en voz

This reference design uses multiple microphones, a beamforming algorithm, and other processes to extract clear speech and audio amidst noise and other clutter.  The rapid increase in applications that are used in noise-prone environments for voice activated digital assistants creates demand (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDEP0045 — Diseño de referencia de implementación de un algoritmo de radar de apertura sintética (SAR) en tiemp

This reference design shows a real-time synthetic aperture radar (SAR) running on a multicore TMS320C6678 digital signal processor (DSP). One of the main challenges of  SAR is to generate high-resolution images in real-time, since forming the image involves computationally-demanding signal (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDEP0036 — Diseño de referencia con TMS320C6657 para implementar una solución de códec OPUS eficaz

The TIDEP0036 reference design provides an example of the ease of running TI optimized Opus encoder/decoder on the TMS320C6657 device. Since Opus supports a a wide range of bit rates, frame sizes and sampling rates, all with low delay, it has applicability for voice communications, networked audio (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
FCBGA (CZH) 625 Ultra Librarian
FCBGA (GZH) 625 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

Ver todos los temas del foro en inglés

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos