TPS2HCS10-Q1
Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI
TPS2HCS10-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Withstands 35-V load dump
- Functional Safety-Compliant Development
- Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
- Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
- Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
- Protection against persistent overload condition
- Improve system level reliability through SPI programmable adjustable overcurrent protection
- Overcurrent protection threshold: 10 to 70 A
- SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
- Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short-to-ground
- Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Digital sense output via SPI can be configured to measure:
- Load current accurately with integrated ADC
- Output or supply voltage, FET temperature
- Provides full fault diagnostics through SPI interface and indication through FLT pin
- Detection of open load and short-to-battery
The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.
The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.
The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.
The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
Documentación técnica
Diseño y desarrollo
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
HSS-2HCS10EVM — Tarjeta secundaria TPS2HCS10-Q1 para interruptor de lado alto con fusible inteligente
El HSS-2HCS10EVM es una tarjeta secundaria diseñada para su uso con el HSS-HCMOTHERBRDEVM. Esta tarjeta secundaria muestra la funcionalidad de la gama de fusibles inteligentes de Texas Instruments.
HSS-HCMOTHERBRDEVM — Smart fuse evaluation module
The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a (...)
HSS-HCS-BLANKEVM — Módulo de evaluación despoblado para la gama de interruptores de fusibles inteligentes
HSS-SMART-CONFIGURATOR — Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches
Productos y hardware compatibles
Productos
Interruptores del lado de la alimentación
Desarrollo de hardware
Placa de evaluación
HCS-HEADER-FILES — C Header files for smart fuse high-side switches with register definitions
Productos y hardware compatibles
Productos
Interruptores del lado de la alimentación
Desarrollo de hardware
Placa de evaluación
Tarjeta secundaria
PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI
TIDA-020079 — Diseño de referencia de zona
Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
Pedidos y calidad
- RoHS
- REACH
- Marcado del dispositivo
- Acabado de plomo/material de la bola
- Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
- Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
- Contenido del material
- Resumen de calificaciones
- Monitoreo continuo de confiabilidad
- Lugar de fabricación
- Lugar de ensamblaje
Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.
Soporte y capacitación
Foros de TI E2E™ con asistencia técnica de los ingenieros de TI
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI.