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Módulos de alimentación (inductor integrado)

TPSM63610

ACTIVO

Módulo de alimentación de 8 A de alta densidad, entrada de 36 V, salida de 1 V a 20 V, QFN HotRod™ m

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TPSM63610

ACTIVO
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Detalles del producto

Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Synchronous Buck Type Module Iout (max) (A) 8 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 20 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features EMI Tested, Enable, Frequency synchronization, Low Noise, Overcurrent protection, Power good, Spread Spectrum Control mode Peak-Current Duty cycle (max) (%) 98
Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Synchronous Buck Type Module Iout (max) (A) 8 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 20 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features EMI Tested, Enable, Frequency synchronization, Low Noise, Overcurrent protection, Power good, Spread Spectrum Control mode Peak-Current Duty cycle (max) (%) 98
B3QFN (RDF) 22 48.75 mm² 7.5 x 6.5
  • Functional Safety-Capable
  • Versatile 36-VIN, 8-AOUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 20 V
    • 6.5-mm × 7.5-mm × 4-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 95%+
    • External bias option for improved efficiency
    • Exposed pad for low thermal impedance. EVM θJA = 18.2 °C/W.
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
    • Pin compatible with the TPSM63608 (36 V, 6 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63610 with the WEBENCH Power Designer
  • Functional Safety-Capable
  • Versatile 36-VIN, 8-AOUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 20 V
    • 6.5-mm × 7.5-mm × 4-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • Peak efficiency of 95%+
    • External bias option for improved efficiency
    • Exposed pad for low thermal impedance. EVM θJA = 18.2 °C/W.
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 Class B emissions
  • Designed for scalable power supplies
    • Pin compatible with the TPSM63608 (36 V, 6 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63610 with the WEBENCH Power Designer

Deriving from a family of synchronous buck modules, the TPSM63610 is a highly integrated 36-V, 8-A DC/DC design that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the TPSM63610 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total design requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63610 device offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The device can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

Deriving from a family of synchronous buck modules, the TPSM63610 is a highly integrated 36-V, 8-A DC/DC design that combines power MOSFETs, a shielded inductor, and passives in an enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 20 V, the TPSM63610 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total design requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63610 device offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum for improved EMI. Along with integrated VCC, bootstrap and input capacitors for increased reliability and higher density. The device can be configured for constant switching frequency over the full load current range (FPWM), or variable frequency (PFM) for higher light load efficiency. Including a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.
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TPSM63610E ACTIVO Módulo de alimentación de alta densidad, entrada de 36 V, salida de 1 V a 20 V y 8 A Extended cold temperature range
Pin por pin con la misma funcionalidad que el dispositivo comparado
TLVM13610 ACTIVO Módulo de alimentación de 36 V de entrada, de 1 V a 10 V de salida y 8 A en QFN HotRod™ de 7.5 mm x  Reduced feature set and output voltage range
TPSM63608 ACTIVO Módulo de alimentación de alta densidad de 36 V de entrada, 1 V a 20 V de salida y 6 A en QFN HotRod Lower output current

Documentación técnica

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Tipo Título Fecha
* Data sheet TPSM63610 High-Density, 3-V to 36-V Input, 1-V to 20-V Output , 8-A (10-A Peak) Synchronous Buck DC/DC Power Module With Enhanced HotRod™ QFN Package datasheet (Rev. A) PDF | HTML 13 dic 2023
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 14 mar 2024
Application note Dynamic Output Voltage Control Using TPSM63610 for USB Type-C Applications PDF | HTML 14 dic 2023
Application note Using the TPSM636xx for an Inverting Buck-Boost Application PDF | HTML 11 oct 2023
Application note How to Implement a Simple Constant Current Regulation Scheme to a PCM Based Buck PDF | HTML 16 ago 2023
EVM User's guide TPSM63610EVM Buck Regulator Evaluation Module's User's Guide (Rev. A) PDF | HTML 31 oct 2022
Functional safety information TPSM63608 and TPSM63610/E Functional Safety FIT Rate, FMD and Pin FMA PDF | HTML 12 oct 2022
Certificate TPSM63610EVM EU RoHS Declaration of Conformity (DoC) 09 ago 2022

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TPSM63610EVM — Placa de evaluación TPSM63610 para módulo de alimentación reductor de 36 V de entrada, 1 V a 20 V, 8

Este módulo de evaluación (EVM) permite evaluar fácilmente el módulo de alimentación TPSM63610 a través del uso de puentes y puntos de prueba para configurar y probar las características del dispositivo sobre la marcha. Además de evaluar el rendimiento eléctrico del dispositivo, este EVM sirve (...)
Guía del usuario: PDF | HTML
No disponible en TI.com
Modelo de simulación

TPSM63610 PSPICE Transient Model

SLVMDZ4.ZIP (269 KB) - PSpice Model
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Símbolo CAD/CAE

TPSM63610EVM Design Files

SLVRBM6.ZIP (3938 KB)
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Herramienta de cálculo

TPSM63610-DESIGN-CALC — TPSM63610 power module quickstart design tool

The TPSM6310 quick-start calculator is a standalone tool that facilitates and assists the power-supply engineer with the design of a DC/DC buck regulator based on a family of synchronous buck power modules, including TPSM6310, TPSM63610E and TPSM63608. The user can quickly arrive at an optimized (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Módulos de alimentación (inductor integrado)
TPSM63608 — Módulo de alimentación de alta densidad de 36 V de entrada, 1 V a 20 V de salida y 6 A en QFN HotRod TPSM63610 — Módulo de alimentación de 8 A de alta densidad, entrada de 36 V, salida de 1 V a 20 V, QFN HotRod™ m TPSM63610E — Módulo de alimentación de alta densidad, entrada de 36 V, salida de 1 V a 20 V y 8 A
Descargar
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
B3QFN (RDF) 22 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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