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Productos Wi-Fi

WL1801

ACTIVO

Transceptor Wi-Fi® industrial de banda única WiLink™ 8

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NUEVO CC3301MOD PRESENTACIÓN PRELIMINAR Módulo complementario SimpleLink™ Wi-Fi 6 y Bluetooth® baja energía Certified modules with upgraded functionality of Wi-Fi 6 and Bluetooth Low Energy

WL1801

ACTIVO
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Detalles del producto

Processor External MPU Type Transceiver Protocols Wi-Fi 2.4 GHz Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
Processor External MPU Type Transceiver Protocols Wi-Fi 2.4 GHz Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
DSBGA (YFV) 130 22.87520000000000493 mm² 4.640000000000001 x 4.93
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.
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Documentación técnica

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Tipo Título Fecha
* Data sheet WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 14 may 2021
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 22 ago 2023
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 02 ago 2023
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 20 dic 2021
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 27 may 2021
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 19 may 2021

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Kit de desarrollo de software (SDK)

PROCESSOR-SDK-AM335X — SDK de procesador para procesadores AM335x Sitara: Compatibilidad con Linux y TI-RTOS

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
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Software de aplicación y estructura

WILINK-BT_WIFI-WIRELESS_TOOLS — Herramientas inalámbricas de WILink™ para módulos WL18XX

This package includes the following applications:
  • WLAN Real-Time Tuning Tool (RTTT)
  • Bluetooth® Logger
  • WLAN gLogger
  • Link Quality Monitor (LQM)
  • HCITester Tool
    • BTSout
    • BTSTransform
    • ScriptPad

The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)

Guía del usuario: PDF | HTML
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Software de aplicación y estructura

WILINK-WIFI_MESH_VISUALIZATION_TOOL — Herramientas de visualización de malla de WILink™ para módulos WL18XX

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Guía del usuario: PDF
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Controlador o biblioteca

WILINK8-WIFI-NLCP — WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Productos Wi-Fi
WL1801 — Transceptor Wi-Fi® industrial de banda única WiLink™ 8 WL1801MOD — Módulo Wi-Fi® de banda única WILink™ 8 WL1805MOD — Módulo Wi-Fi® de banda única y MIMO 2x2 de WILink™ 8 WL1807MOD — Combinación industrial de doble banda, módulo Wi-Fi MIMO 2x2 de WILink™ 8 WL1831 — Wi-Fi® industrial de banda única WILink™ 8, Bluetooth® y transceptor de Bluetooth Low Energy WL1831MOD — Módulo de Wi-Fi industrial WILink™ 8, Bluetooth y Bluetooth Smart (de baja energía) WL1835MOD — Módulo de combinación de banda única de Wi-Fi® MIMO 2x2 de WILink™ 8, Bluetooth® y Bluetooth Smart WL1837MOD — Módulo de WILink™ 8 de banda doble industrial, Wi-Fi® MIMO 2x2, Bluetooth® y Bluetooth Smart
Opciones de descarga
Herramienta de diseño

3P-WIRELESS-MODULES — Herramienta de búsqueda de módulos inalámbricos de terceros

The third party wireless module search tool helps developers to identify products that meet their end equipment specifications and procure production ready wireless modules. The third party module vendors included in the search tool are independent third party companies with expertise in designing (...)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFV) 130 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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