Detalles del producto

Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Throughput (max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Operating temperature range (°C) -40 to 105 Rating Catalog
DSBGA (YFV) 130 22.87520000000000493 mm² 4.640000000000001 x 4.93
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

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Documentación técnica

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Tipo Título Fecha
* Data sheet WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 14 may 2021
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 22 ago 2023
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 02 ago 2023
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 20 oct 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 mar 2022
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 20 dic 2021
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 27 may 2021
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 19 may 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 ene 2021
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 27 oct 2020
White paper Charging stations: Toward an EV support infrastructure 09 may 2017

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

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The Altos V2 is a four-chip cascaded imaging radar design that is based on TI AWR2243 MMIC and TDA4 processor. It features a customized 12TX and 16TX antenna array design, complete signal processing pipeline, (...)

Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-AM335X Linux Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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WL1807MOD Combinación industrial de doble banda, módulo Wi-Fi MIMO 2x2 de WILink™ 8 WL1831 Wi-Fi® industrial de banda única WILink™ 8, Bluetooth® y transceptor de Bluetooth Low Energy WL1837MOD Módulo de WILink™ 8 de banda doble industrial, Wi-Fi® MIMO 2x2, Bluetooth® y Bluetooth Smart
Procesadores basados en Arm
AM3351 Procesador Sitara: ARM Cortex-A8, Ethernet 1 GB, pantalla AM3352 Procesador Sitara: ARM Cortex-A8, Ethernet de 1 GB, pantalla, CAN AM3354 Procesador Sitara: Arm Cortex-A8, gráficos 3D, CAN AM3356 Procesador Sitara: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Procesador Sitara: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Procesador Sitara: ARM Cortex-A8, gráficos 3D, PRU-ICSS, CAN AM3359 Procesador Sitara: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN
Desarrollo de hardware
Placa de evaluación
TMDSICE3359 Motor de comunicaciones industriales AM3359 TMDSSK3358 Kit básico AM335x TMDXEVM3358 Módulo de evaluación AM335x
Opciones de descarga
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-LINUX-RT-AM335X Linux-RT Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Productos y hardware compatibles

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WL1807MOD Combinación industrial de doble banda, módulo Wi-Fi MIMO 2x2 de WILink™ 8 WL1831 Wi-Fi® industrial de banda única WILink™ 8, Bluetooth® y transceptor de Bluetooth Low Energy WL1837MOD Módulo de WILink™ 8 de banda doble industrial, Wi-Fi® MIMO 2x2, Bluetooth® y Bluetooth Smart
Procesadores basados en Arm
AM3351 Procesador Sitara: ARM Cortex-A8, Ethernet 1 GB, pantalla AM3352 Procesador Sitara: ARM Cortex-A8, Ethernet de 1 GB, pantalla, CAN AM3354 Procesador Sitara: Arm Cortex-A8, gráficos 3D, CAN AM3356 Procesador Sitara: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Procesador Sitara: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Procesador Sitara: ARM Cortex-A8, gráficos 3D, PRU-ICSS, CAN AM3359 Procesador Sitara: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN
Desarrollo de hardware
Placa de evaluación
TMDSICE3359 Motor de comunicaciones industriales AM3359 TMDXEVM3358 Módulo de evaluación AM335x
Opciones de descarga
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-AM335X TI-RTOS Processor SDK for AM335x and AMIC110 devices (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Productos y hardware compatibles

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Productos Wi-Fi
WL1807MOD Combinación industrial de doble banda, módulo Wi-Fi MIMO 2x2 de WILink™ 8 WL1831 Wi-Fi® industrial de banda única WILink™ 8, Bluetooth® y transceptor de Bluetooth Low Energy WL1837MOD Módulo de WILink™ 8 de banda doble industrial, Wi-Fi® MIMO 2x2, Bluetooth® y Bluetooth Smart
Procesadores basados en Arm
AM3351 Procesador Sitara: ARM Cortex-A8, Ethernet 1 GB, pantalla AM3352 Procesador Sitara: ARM Cortex-A8, Ethernet de 1 GB, pantalla, CAN AM3354 Procesador Sitara: Arm Cortex-A8, gráficos 3D, CAN AM3356 Procesador Sitara: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Procesador Sitara: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Procesador Sitara: ARM Cortex-A8, gráficos 3D, PRU-ICSS, CAN AM3359 Procesador Sitara: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN AMIC110 Procesador Sitara: m Cortex-A8, más de 10 protocolos Ethernet
Desarrollo de hardware
Placa de evaluación
TMDSICE3359 Motor de comunicaciones industriales AM3359 TMDSSK3358 Kit básico AM335x TMDXEVM3358 Módulo de evaluación AM335x TMDXICE110 Motor de comunicaciones industriales (ICE) AMIC110
Opciones de descarga
Software de aplicación y estructura

WILINK-BT_WIFI-WIRELESS_TOOLS — Herramientas inalámbricas de WILink™ para módulos WL18XX

This package includes the following applications:
  • WLAN Real-Time Tuning Tool (RTTT)
  • Bluetooth® Logger
  • WLAN gLogger
  • Link Quality Monitor (LQM)
  • HCITester Tool
    • BTSout
    • BTSTransform
    • ScriptPad

The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)

Guía del usuario: PDF | HTML
Software de aplicación y estructura

WILINK-WIFI_MESH_VISUALIZATION_TOOL — Herramientas de visualización de malla de WILink™ para módulos WL18XX

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Guía del usuario: PDF
Controlador o biblioteca

TI-BT-STACK-LINUX-ADDON — Complemento de TI Bluetooth Linux para AM335x EVM, AM437x EVM y BeagleBone con WL18xx y CC256x

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Controlador o biblioteca

WILINK8-WIFI-NLCP WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

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Opciones de descarga
Controlador o biblioteca

WL18XX-BT-SP — Service Pack de Bluetooth para WL18xx

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not (...)

Guía del usuario: PDF
Soporte de software

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CLRNX-3P-CLARINOX-BLUE — Pila de protocolos Bluetooth® integrada ClarinoxBlue

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Desde: Clarinox
Soporte de software

CLRNX-3P-CLARINOX-WIFI — Pila de protocolos Wi-Fi integrada ClarinoxWiFi

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Herramienta de diseño

3P-WIRELESS-MODULES — Herramienta de búsqueda de módulos inalámbricos de terceros

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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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