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デジタル信号プロセッサ (DSP)

TMS320LBC53S

新規設計での使用を推奨しません

デジタル・シグナル・プロセッサ

ご注文はこちら
データシート

TMS320LBC53S

新規設計での使用を推奨しません
データシート ご注文はこちら

製品詳細

Rating Catalog Operating temperature range (°C) to
Rating Catalog Operating temperature range (°C) to
LQFP (PZ) 100 256 mm² 16 x 16
  • Powerful 16-Bit TMS320C5x CPU
  • 20-, 25-, 35-, and 50-ns Single-Cycle Instruction Execution Time for 5-V Operation
  • 25-, 40-, and 50-ns Single-Cycle Instruction Execution Time for 3-V Operation
  • Single-Cycle 16 × 16-Bit Multiply/Add
  • 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
  • 2K, 4K, 8K, 16K, 32K × 16-Bit Single-Access On-Chip Program ROM
  • 1K, 3K, 6K, 9K × 16-Bit Single-Access On-Chip Program/ Data RAM (SARAM)
  • 1K Dual-Access On-Chip Program/ Data RAM (DARAM)
  • Full-Duplex Synchronous Serial Port for Coder/Decoder Interface
  • Time-Division-Multiplexed (TDM) Serial Port
  • Hardware or Software Wait-State Generation Capability
  • On-Chip Timer for Control Operations
  • Repeat Instructions for Efficient Use of Program Space
  • Buffered Serial Port
  • Host Port Interface
  • Multiple Phase-Locked Loop (PLL) Clocking Options (×1, ×2, ×3, ×4, ×5, ×9 Depending on Device)
  • Block Moves for Data/Program Management
  • On-Chip Scan-Based Emulation Logic
  • Boundary Scan
  • Five Packaging Options
    • 100-Pin Quad Flat Package (PJ Suffix)
    • 100-Pin Thin Quad Flat Package (PZ Suffix)
    • 128-Pin Thin Quad Flat Package (PBK Suffix)
    • 132-Pin Quad Flat Package (PQ Suffix)
    • 144-Pin Thin Quad Flat Package (PGE Suffix)
  • Low Power Dissipation and Power-Down Modes:
    • 47 mA (2.35 mA/ MIP) at 5 V, 40-MHz Clock (Average)
    • 23 mA (1.15 mA/ MIP) at 3 V, 40-MHz Clock (Average)
    • 10 mA at 5 V, 40-MHz Clock (IDLE1 Mode)
    • 3 mA at 5 V, 40-MHz Clock (IDLE2 Mode)
    • 5 mA at 5 V, Clocks Off (IDLE2 Mode)
  • High-Performance Static CMOS Technology
  • IEEE Standard 1149.1 Test-Access Port (JTAG)

TI is a trademark of Texas Instruments Incorporated.
IEEE Standard 1149.1\x961990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
References to 'C5x in this document include both TMS320C5x and TMS320LC5x devices unless specified otherwise.
  • Powerful 16-Bit TMS320C5x CPU
  • 20-, 25-, 35-, and 50-ns Single-Cycle Instruction Execution Time for 5-V Operation
  • 25-, 40-, and 50-ns Single-Cycle Instruction Execution Time for 3-V Operation
  • Single-Cycle 16 × 16-Bit Multiply/Add
  • 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
  • 2K, 4K, 8K, 16K, 32K × 16-Bit Single-Access On-Chip Program ROM
  • 1K, 3K, 6K, 9K × 16-Bit Single-Access On-Chip Program/ Data RAM (SARAM)
  • 1K Dual-Access On-Chip Program/ Data RAM (DARAM)
  • Full-Duplex Synchronous Serial Port for Coder/Decoder Interface
  • Time-Division-Multiplexed (TDM) Serial Port
  • Hardware or Software Wait-State Generation Capability
  • On-Chip Timer for Control Operations
  • Repeat Instructions for Efficient Use of Program Space
  • Buffered Serial Port
  • Host Port Interface
  • Multiple Phase-Locked Loop (PLL) Clocking Options (×1, ×2, ×3, ×4, ×5, ×9 Depending on Device)
  • Block Moves for Data/Program Management
  • On-Chip Scan-Based Emulation Logic
  • Boundary Scan
  • Five Packaging Options
    • 100-Pin Quad Flat Package (PJ Suffix)
    • 100-Pin Thin Quad Flat Package (PZ Suffix)
    • 128-Pin Thin Quad Flat Package (PBK Suffix)
    • 132-Pin Quad Flat Package (PQ Suffix)
    • 144-Pin Thin Quad Flat Package (PGE Suffix)
  • Low Power Dissipation and Power-Down Modes:
    • 47 mA (2.35 mA/ MIP) at 5 V, 40-MHz Clock (Average)
    • 23 mA (1.15 mA/ MIP) at 3 V, 40-MHz Clock (Average)
    • 10 mA at 5 V, 40-MHz Clock (IDLE1 Mode)
    • 3 mA at 5 V, 40-MHz Clock (IDLE2 Mode)
    • 5 mA at 5 V, Clocks Off (IDLE2 Mode)
  • High-Performance Static CMOS Technology
  • IEEE Standard 1149.1 Test-Access Port (JTAG)

TI is a trademark of Texas Instruments Incorporated.
IEEE Standard 1149.1\x961990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
References to 'C5x in this document include both TMS320C5x and TMS320LC5x devices unless specified otherwise.

The TMS320C5x generation of the Texas Instruments (TI™) TMS320 digital signal processors (DSPs) is fabricated with static CMOS integrated circuit technology; the architectural design is based upon that of an earlier TI DSP, the TMS320C25. The combination of advanced Harvard architecture, on-chip peripherals, on-chip memory, and a highly specialized instruction set is the basis of the operational flexibility and speed of the 'C5x devices. They execute up to 50 million instructions per second (MIPS).

The 'C5x devices offer these advantages:

  • Enhanced TMS320 architectural design for increased performance and versatility
  • Modular architectural design for fast development of spin-off devices
  • Advanced integrated-circuit processing technology for increased performance
  • Upward-compatible source code (source code for 'C1x and 'C2x DSPs is upward compatible with 'C5x DSPs.)
  • Enhanced TMS320 instruction set for faster algorithms and for optimized high-level language operation
  • New static-design techniques for minimizing power consumption and maximizing radiation tolerance

    • Table 1 provides a comparison of the devices in the 'C5x generation. It shows the capacity of on-chip RAM and ROM memories, number of serial and parallel I/O ports, execution time of one machine cycle, and type of package with total pin count.

    The TMS320C5x generation of the Texas Instruments (TI™) TMS320 digital signal processors (DSPs) is fabricated with static CMOS integrated circuit technology; the architectural design is based upon that of an earlier TI DSP, the TMS320C25. The combination of advanced Harvard architecture, on-chip peripherals, on-chip memory, and a highly specialized instruction set is the basis of the operational flexibility and speed of the 'C5x devices. They execute up to 50 million instructions per second (MIPS).

    The 'C5x devices offer these advantages:

  • Enhanced TMS320 architectural design for increased performance and versatility
  • Modular architectural design for fast development of spin-off devices
  • Advanced integrated-circuit processing technology for increased performance
  • Upward-compatible source code (source code for 'C1x and 'C2x DSPs is upward compatible with 'C5x DSPs.)
  • Enhanced TMS320 instruction set for faster algorithms and for optimized high-level language operation
  • New static-design techniques for minimizing power consumption and maximizing radiation tolerance

    • Table 1 provides a comparison of the devices in the 'C5x generation. It shows the capacity of on-chip RAM and ROM memories, number of serial and parallel I/O ports, execution time of one machine cycle, and type of package with total pin count.
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    技術資料

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    種類 タイトル 最新の英語版をダウンロード 日付
    * データシート Digital Signal Processors データシート (Rev. A) 1996年 4月 1日

    購入と品質

    記載されている情報：
    • RoHS
    • REACH
    • デバイスのマーキング
    • リード端子の仕上げ / ボールの原材料
    • MSL 定格 / ピーク リフロー
    • MTBF/FIT 推定値
    • 使用原材料
    • 認定試験結果
    • 継続的な信頼性モニタ試験結果
    記載されている情報：
    • ファブの拠点
    • 組み立てを実施した拠点