제품 상세 정보

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 15 CON (typ) (pF) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -55 to 125 Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 15 CON (typ) (pF) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -55 to 125 Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6
  • Wide analog-input-voltage range: 0 V – 10 V
  • Low ON resistance:
    • VCC = 4.5 V: 25 Ω
    • VCC = 9 V: 15 Ω
  • Fast switching and propagation delay times
  • Low OFF leakage current
  • Wide operating temperature range: –55°C to 125°C
  • HC types:
    • 2 V to 10 V operation
    • High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V and 10 V
  • HCT types:
    • Direct LSTTL input logic compatibility, VIL= 0.8 V (maximum), VIH = 2 V (minimum)
    • CMOS input compatibility, Il ≤ 1 µA at VOL, VOH
  • Wide analog-input-voltage range: 0 V – 10 V
  • Low ON resistance:
    • VCC = 4.5 V: 25 Ω
    • VCC = 9 V: 15 Ω
  • Fast switching and propagation delay times
  • Low OFF leakage current
  • Wide operating temperature range: –55°C to 125°C
  • HC types:
    • 2 V to 10 V operation
    • High noise immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5 V and 10 V
  • HCT types:
    • Direct LSTTL input logic compatibility, VIL= 0.8 V (maximum), VIH = 2 V (minimum)
    • CMOS input compatibility, Il ≤ 1 µA at VOL, VOH

The ’HC4066 and CD74HCT4066 devices contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

These switches feature the characteristic linear ON resistance of the metal-gate CD4066B device. Each switch is turned on by a high-level voltage on its control input.

The ’HC4066 and CD74HCT4066 devices contain four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

These switches feature the characteristic linear ON resistance of the metal-gate CD4066B device. Each switch is turned on by a high-level voltage on its control input.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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14개 모두 보기
유형 직함 날짜
* Data sheet High-Speed CMOS Logic Quad Bilateral Switch datasheet (Rev. E) PDF | HTML 2024/07/16
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022/06/02
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021/12/01
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996/05/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

사용 설명서: PDF
TI.com에서 구매 불가
패키지 CAD 기호, 풋프린트 및 3D 모델
PDIP (N) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

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품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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