ADC3649
- 14-bit, dual channel 250 and 500MSPS ADC
- Noise spectral density: -158.5dBFS/Hz
- Thermal Noise: 74.5dBFS
- Single core (non-interleaved) ADC architecture
- Power consumption:
- 300mW/channel (500MSPS)
- 250mW/channel (250MSPS)
- Buffered analog inputs
- Programmable 100Ω to 200Ω termination
- Input full scale: 2Vpp
- Full power input bandwidth (-3dB): 1.4GHz
- Spectral performance (fIN = 70MHz, -1dBFS):
- SNR: 73.8dBFS
- SFDR HD2,3: 84dBc
- SFDR worst spur: 90dBFS
- Digital down-converters (DDCs)
- Up to four independent DDCs
- Complex and real decimation
- Decimation: /2, /4 to /32768 decimation
- 48-bit NCO phase coherent frequency hopping
- DDR, Serial LVDS interface
- 14-bit Parallel DDR LVDS for DDC bypass
- 16-bit Serial LVDS for decimation
- 32-bit output option for high decimation
The ADC3648 and ADC3649 (ADC364x) are a 14-bit, 250MSPS and 500MSPS, dual channel analog to digital converter (ADC). The devices are designed for high signal-to-noise ratio (SNR) and deliver a noise spectral density of -158.5dBFS/Hz (500MSPS).
The power efficient ADC architecture consumes 300mW/ch at 500MSPS and provides power scaling with lower sampling rates (250mW/ch at 250MSPS).
The ADC364x includes an optional quad band digital down-converter (DDC) supporting wide band decimation by 2 to narrow band decimation by 32768. The DDC uses a 48-bit NCO which supports phase coherent and phase continuous frequency hopping.
The ADC364x is outfitted with a flexible LVDS interface. In decimation bypass mode, the device uses a 14-bit wide parallel DDR LVDS interface. When using decimation, the output data is transmitted using a serial LVDS interface reducing the number of lanes needed as decimation increases. For high decimation rates, the output resolution can be increased to 32-bit.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ADC364x Dual-Channel, 14-Bit 250MSPS and 500MSPS Analog-to-Digital Converter (ADC) datasheet | PDF | HTML | 2024年 12月 4日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ADC3669EVM — ADC3669 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFNP (RTD) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。