支援軟體
DRV8814
- 8 V to 45 V Operating Supply Voltage Range
- 2.5 A Maximum Drive Current at 24 V and TA = 25°C
- Dual H-Bridge Current-Control Motor Driver
- Drives Two DC Motors
- Four Level Winding Current Control
- Multiple Decay Modes
- Slow Decay
- Fast Decay
- Industry Standard Parallel Digital Control Interface
- Low Current Sleep Mode
- Built-In 3.3-V Reference Output
- Small Package and Footprint
- Protection Features
- Overcurrent Protection (OCP)
- Thermal Shutdown (TSD)
- VM Undervoltage Lockout (UVLO)
- Fault Condition Indication Pin (nFAULT)
The DRV8814 provides an integrated motor driver solution for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers, and is intended to drive DC motors. The output driver block for each consists of N-channel power MOSFET’s configured as H-bridges to drive the motor windings. The DRV8814 can supply up to 2.5-A peak or 1.75-A RMS output current (with proper heatsinking at 24 V and 25°C) per H-bridge.
A simple parallel digital control interface is compatible with industry-standard devices. Decay mode is programmable to allow braking or coasting of the motor when disabled.
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage lockout, and over temperature.
The DRV8814 is available in a 28-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).
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檢視所有 8 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DRV8814 DC Motor Driver IC datasheet (Rev. E) | PDF | HTML | 2015年 11月 30日 |
| Application note | Understanding Motor Driver Current Ratings (Rev. A) | PDF | HTML | 2024年 7月 5日 | |
| Application note | Best Practices for Board Layout of Motor Drivers (Rev. B) | PDF | HTML | 2021年 10月 14日 | |
| Application note | Calculating Power Dissipation for a H-Bridge or Half Bridge Driver (Rev. A) | PDF | HTML | 2021年 7月 22日 | |
| Application note | Methods to Configure Current Regulation for Brushed and Stepper Motors (Rev. B) | PDF | HTML | 2021年 1月 19日 | |
| Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
| User guide | DRV88xx EVM GUI (Rev. C) | 2017年 4月 27日 | ||
| Application brief | PowerPAD™ Made Easy (Rev. B) | 2004年 5月 12日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTSSOP (PWP) | 28 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。