FDC2214-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- EMI-resistant architecture
- Maximum output rates (one active channel):
- 13.3kSPS (FDC2112-Q1, FDC2114-Q1)
- 4.08kSPS (FDC2212-Q1, FDC2214-Q1)
- Maximum input capacitance: 250nF (at 10kHz with 1mH inductor)
- Sensor excitation frequency: 10kHz to 10MHz
- Number of channels: 2, 4
- Resolution: up to 28 bits
- RMS noise: 0.3fF at 100SPS and fSENSOR = 5MHz
- Supply voltage: 2.7V to 3.6V
- power consumption: active: 2.1mA
- Low-power sleep mode: 35µA
- Shutdown: 200nA
- Interface: I2C
- Temperature range: –40°C to +125°C
Capacitive sensing is a low-power, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 resonant sensing architecture, performance can be maintained even in presence of fluorescent light.
The FDC2x1x-Q1 is a multi-channel family of high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
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設計與開發
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FDC2214EVM — 具有兩個電容式感測器的 FDC2214 評估模組
The FDC2214 evaluation module demonstrates capacitive sensing technology to detect the presence of a conductive or non-conductive target. The evaluation module includes two PCB capacitive sensors that connect to two of the four channels of the FDC2214. An MSP430 microcontroller is used to interface (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RGH) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
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建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。