開發模組 (EVM) 的 GUI
FDC1004-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Input range: ±15pF
- Measurement resolution: 0.5fF
- Maximum offset capacitance: 100pF
- Programmable output rates: 100/200/400 S/s
- Maximum shield load: 400pF
- Supply voltage: 3.3V
- Temperature range: –40° to 125°C
- Current consumption:
- Active: 750µA
- Standby: 29µA
- Interface: I2C
- Number of channels: 4
Capacitive sensing with grounded capacitor sensors is a very low-power, low-cost, high-resolution contact-less sensing technique that can be applied to a variety of applications ranging from proximity sensing and gesture recognition to material analysis and remote liquid level sensing. The sensor in a capacitive sensing system is any metal or conductor, allowing for low cost and highly flexible system design.
The FDC1004-Q1 is a high-resolution, AEC-Q100 qualified, 4-channel capacitance-to-digital converter for implementing capacitive sensing solutions. Each channel has a full scale range of ±15pF and can handle a sensor offset capacitance of up to 100pF, which can be either programmed internally or can be an external capacitor for tracking environmental changes over time and temperature. The large offset capacitance capability allows for the use of remote sensors.
The FDC1004-Q1 also includes shield drivers for sensor shields, which can reduce EMI interference and help focus the sensing direction of a capacitive sensor. The small footprint of the FDC1004-Q1 allows for use in space-constrained applications. The FDC1004-Q1 is available in a 10-pin VSSOP package, which allows for optical inspection in production, and features an I2C interface for interfacing to an MCU.
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開發板
FDC1004QEVM — 汽車 4 通道電容轉數位轉換器評估模組
The FDC1004Q evaluation module is used to evaluate the FDC1004-Q1, automotive 4-channel capacitive-to-digital converter. The evaluation modules features a breakable PCB composed of three sections: a USB to I²C converter based on the MSP430F5528 microcontroller, the FDC1004-Q1, and two sensor (...)
使用指南: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。