ISO7641FC
- Signaling Rate: 150 Mbps (M-Grade), 25 Mbps
(C-Grade) - Robust Design with Integrated Noise Filter
(C-Grade) - Low Power Consumption, Typical ICC per Channel
(3.3-V Supplies):- ISO7631FM: 2 mA at 10 Mbps
- ISO7631FC: 1.5 mA at 10 Mbps
- ISO7641FC: 1.3 mA at 10 Mbps
- Extremely-Low ICC_disable (C-Grade)
- Low Propagation Delay: 7 ns Typical (M-Grade)
- Output Defaults to Low-State in Fail-Safe Mode
- Wide Temperature Range: –40°C to 125°C
- 50 KV/µs Transient Immunity, Typical
- Long Life With SiO2 Isolation Barrier
- Operates From 2.7-V (M-Grade), 3.3-V and 5-V
Supply and Logic Levels - 2.7-V (M-Grade), 3.3-V and 5-V Level Translation
- Wide Body SOIC-16 Package
- Safety and Regulatory Approvals
- 2500 VRMS Isolation for 1 Minute per UL 1577
- 4242 VPK Basic Insulation per DIN V VDE V
0884-10 and DIN EN 61010-1 - CSA Component Acceptance Notice 5A, IEC
60950-1 and IEC 61010-1 End Equipment
Standards - CQC Certification per GB4943.1-2011
- TUV 3000 VRMS Reinforced Insulation
according to EN/UL/CSA 60950-1 and
EN/UL/CSA 61010-1
The ISO7631F and ISO7641F devices provide galvanic isolation up to 4242 VPK per VDE. The ISO7631F device has three channels, two of which operate in the forward direction and one which operates in the reverse direction. The ISO7641F device has 4 channels, three of which operate in the forward direction and one of which operates in the reverse direction. Suffix F indicates that output defaults to low-state in fail-safe conditions (see ). M-Grade devices are high-speed isolators capable of up to150-Mbps data rates with fast propagation delays, whereas C-Grade devices are capable of up to 25-Mbps data rates with low power consumption and integrated filters for noise-prone applications. C-Grade devices are recommended for lower-speed applications where input noise pulses of less than 6 ns duration must be suppressed, or when low-power consumption is critical.
Each isolation channel has a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. The devices have TTL input thresholds and can operate from 2.7-V (M-Grade), 3.3-V and 5-V supplies. All inputs are 5-V tolerant when supplied from 3.3-V or 2.7-V supplies.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ISO76x1 Low-Power Triple and Quad-Channels Digital Isolators datasheet (Rev. F) | PDF | HTML | 2016年 4月 22日 |
Certificate | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) | 2024年 1月 31日 | ||
White paper | Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) | PDF | HTML | 2023年 9月 7日 | |
Certificate | CSA Certificate for ISO76xxDW | 2023年 3月 3日 | ||
Certificate | CQC Certificate for ISO752xDW, ISO76xxDW (Rev. A) | 2023年 2月 7日 | ||
Certificate | ISO76x, ISO75xx TUV Certificate | 2022年 8月 8日 | ||
Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 4 | 2022年 8月 8日 | ||
White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021年 11月 16日 | ||
White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | 2021年 6月 11日 | |
EVM User's guide | Universal Digital Isolator Evaluation Module | PDF | HTML | 2021年 3月 4日 | |
Application brief | Considerations for Selecting Digital Isolators | 2018年 7月 24日 |
設計與開發
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DIGI-ISO-EVM — 通用數位隔離器評估模組
DIGI-ISO-EVM 是一款評估模組 (EVM),可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置,並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項,可用於評估具最少外部零組件的裝置。
ISO723X724XEVM — ISO723X724XEVM 評估模組
The ISO723X724X evaluation module (EVM) supports the rapid, parametric evaluation of the Triple and Quad Digital Isolators. The EVM will be delivered with an ISO7241C soldered on the board. If another device is desired, please order samples from www.ti.com. If you do not have the capability to (...)
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。