24-pin (DW) package image

SN74ABT8996DW 現行

10 位元可定址掃描埠多點可定址 IEEE 標準 1194.1 (JTAG) TAP 收發器

定價

數量 價格
+

品質資訊

等級 Military
RoHS
REACH
引腳鍍層 / 焊球材質 NIPDAU
MSL 等級 / 迴焊峰值 Level-1-260C-UNLIM
品質、可靠性
及包裝資訊

內含資訊:

  • RoHS
  • REACH
  • 產品標記
  • 引腳鍍層 / 焊球材質
  • MSL 等級 / 迴焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
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其他製造資訊

內含資訊:

  • 晶圓廠位置
  • 組裝地點
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出口分類

*僅供參考

  • 美國 ECCN:EAR99

更多SN74ABT8996資訊

封裝資訊

封裝 | 針腳 SOIC (DW) | 24
操作溫度範圍 (°C) -40 to 85
包裝數量 | 運送業者 25 | TUBE

SN74ABT8996 的特色

  • Members of Texas Instruments Broad Family of Testability Products Supporting IEEE Std 1149.1-1990 (JTAG) Test Access Port (TAP) and Boundary-Scan Architecture
  • Extend Scan Access From Board Level to Higher Levels of System Integration
  • Promote Reuse of Lower-Level (Chip/Board) Tests in System Environment
  • Switch-Based Architecture Allows Direct Connect of Primary TAP to Secondary TAP
  • Primary TAP Is Multidrop for Minimal Use of Backplane Wiring Channels
  • Simple Addressing (Shadow) Protocol Is Received/Acknowledged on Primary TAP
  • Shadow Protocols Can Occur in Any of Test-Logic-Reset, Run-Test/Idle, Pause-DR, and Pause-IR TAP States to Provide for Board-to-Board Test and Built-In Self-Test
  • 10-Bit Address Space Provides for Up to 1021 User-Specified Board Addresses
  • Bypass (BYP\) Pin Forces Primary-to-Secondary Connection Without Use of Shadow Protocols
  • Connect (CON\) Pin Provides Indication of Primary-to-Secondary Connection
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL) Support Backplane Interface at Primary and High Fanout at Secondary
  • Package Options Include Plastic Small- Outline (DW) and Thin Shrink Small- Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic DIPs (JT)

SCOPE is a trademark of Texas Instruments Incorporated.

SN74ABT8996 的說明

The 'ABT8996 10-bit addressable scan ports (ASP) are members of the Texas Instruments (TITM) SCOPETM testability integrated-circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit assemblies. Unlike most SCOPETM devices, the ASP is not a boundary-scannable device, rather, it applies TI's addressable-shadow-port technology to the IEEE Standard 1149.1-1990 (JTAG) test access port (TAP) to extend scan access beyond the board level.

Conceptually, the ASP is a simple switch that can be used to directly connect a set of multidrop primary TAP signals to a set of secondary TAP signals - for example, to interface backplane TAP signals to a board-level TAP. The ASP provides all signal buffering that might be required at these two interfaces. When primary and secondary TAPs are connected, only a moderate propagation delay is introduced - no storage/retiming elements are inserted. This minimizes the need for reformatting board-level test vectors for in-system use.

Most operations of the ASP are synchronous to the primary test clock (PTCK) input. This PTCK signal always is buffered directly onto the secondary test clock (STCK) output.

Upon power up of the device, the ASP assumes a condition in which the primary TAP is disconnected from the secondary TAP (unless the bypass signal is used, as below). This reset condition also can be entered by the assertion of the primary test reset (PTRST\) input or by use of shadow protocol. The PTRST\ signal is always buffered directly onto the secondary test reset (STRST\) output, ensuring that the ASP and its associated secondary TAP can be reset simultaneously.

When connected, the primary test data input (PTDI) and primary test mode select (PTMS) input are buffered onto the secondary test data output (STDO) and secondary test mode select (STMS) output, respectively, while the secondary test data input (STDI) is buffered onto the primary test data output (PTDO). When disconnected, STDO is at high impedance, while PTDO is at high impedance, except during acknowledgement of a shadow protocol. Upon disconnect of the secondary TAP, STMS holds its last low or high level, allowing the secondary TAP to be held in its last stable state. Upon reset of the ASP, STMS is high, allowing the secondary TAP to be synchronously reset to the Test-Logic-Reset state.

In system, primary-to-secondary connection is based on shadow protocols that are received and acknowledged on PTDI and PTDO, respectively. These protocols can occur in any of the stable TAP states other than Shift-DR or Shift-IR (i.e., Test-Logic-Reset, Run-Test/Idle, Pause-DR or Pause-IR). The essential nature of the protocols is to receive/transmit an address via a serial bit-pair signaling scheme. When an address is received serially at PTDI that matches that at the parallel address inputs (A9-A0), the ASP serially retransmits its address at PTDO as an acknowledgement and then assumes the connected (ON) status, as above. If the received address does not match that at the address inputs, the ASP immediately assumes the disconnected (OFF) status without acknowledgement.

The ASP also supports three dedicated addresses that can be received globally (that is, to which all ASPs respond) during shadow protocols. Receipt of the dedicated disconnect address (DSA) causes the ASP to disconnect in the same fashion as a non-matching address. Reservation of this address for global use ensures that at least one address is available to disconnect all receiving ASPs. The DSA is especially useful when the secondary TAPs of multiple ASPs are to be left in different stable states. Receipt of the reset address (RSA) causes the ASP to assume the reset condition, as above. Receipt of the test-synchronization address (TSA) causes the ASP to assume a connect status (MULTICAST) in which PTDO is at high impedance but the connections from PTMS to STMS and PTDI to STDO are maintained to allow simultaneous operation of the secondary TAPs of multiple ASPs. This is useful for multicast TAP-state movement, simultaneous test operation (such as in Run-Test/Idle state), and scanning of common test data into multiple like scan chains. The TSA is valid only when received in the Pause-DR or Pause-IR TAP states.

Alternatively, primary-to-secondary connection can be selected by assertion of a low level at the bypass (BYP\) input. This operation is asynchronous to PTCK and is independent of PTRST\ and/or power-up reset. This bypassing feature is especially useful in the board-test environment, since it allows the board-level automated test equipment (ATE) to treat the ASP as a simple transceiver. When the BYP\ input is high, the ASP is free to respond to shadow protocols. Otherwise, when BYP\ is low, shadow protocols are ignored.

Whether the connected status is achieved by use of shadow protocol or by use of BYP\, this status is indicated by a low level at the connect (CON\) output. Likewise, when the secondary TAP is disconnected from the primary TAP, the CON\ output is high.

The SN54ABT8996 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT8996 is characterized for operation from -40°C to 85°C.

定價

數量 價格
+

包裝類型選項

您可依零件數量選擇不同包裝類型選項,包含完整捲盤、客製化捲盤、剪切捲帶、承載管或盤。

客製化捲盤是從一個捲盤上剪切下來的連續剪切捲帶,以維持批次和日期代碼可追溯性,依要求剪切至確切數量。依照業界標準,銅墊片會在剪切捲帶兩側連接 18 英吋前後導帶,以直接送至自動組裝機器。針對客製化捲盤訂單,TI 將酌收捲帶封裝費用。

剪切捲帶是從捲盤剪切下來的一段捲帶。TI 可能使用多條剪切捲帶或承載盒,以滿足訂單要求數量。

TI 常以盒裝或管裝、盤裝方式運送承載管裝置,視現有庫存而定。所有捲帶、管或樣本盒之封裝,皆符合公司內部靜電放電與防潮保護包裝要求。

進一步了解

可提供批次和日期代碼選擇

在購物車中加入數量,並開始結帳流程以檢視可用選項,從現有庫存中選擇批次或日期代碼。

進一步了解