SN74ACT244-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of up to -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- 4.5-V to 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 9.5 ns at 5 V
- Inputs Are TTL Compatible
(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
您可能會感興趣的類似產品
引腳對引腳且具備與所比較裝置相同的功能
功能相同，但引腳輸出與所比較的裝置不同
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SN74ACT244-EP datasheet (Rev. B) | 2006年 3月 3日 | |
| * | Radiation & reliability report | SN74ACT244-EP Reliability Report | 2018年 1月 16日 | |
| * | VID | SN74ACT244-EP VID V6204620 | 2016年 6月 21日 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
| Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||
| Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
| Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
| SOP (NS) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點