SN74LV244AT
- Inputs Are TTL-Voltage Compatible
- 4.5-V to 5.5-V VCC Operation
- Typical tpd = 5.4 ns at 5 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 5 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 5 V, TA = 25°C - Supports Mixed-Mode Voltage Operation on All Ports
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74LV244AT is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN74LV244AT datasheet (Rev. C) | 2005年 8月 5日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 |
設計與開發
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14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
14-24-NL-LOGIC-EVM — 適用於 14 針腳至 24 針腳無引線封裝的邏輯產品通用評估模組
14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM),設計用途可支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 20 | Ultra Librarian |
SOP (NS) | 20 | Ultra Librarian |
TSSOP (PW) | 20 | Ultra Librarian |
VQFN (RGY) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點