TMUX7612
- Dual supply range: ±4.5 V to ±25 V
- Single supply range: 4.5 V to 50 V
- Asymmetric dual supply support (For example: V DD = 37.5 V, V SS = 12.5 V)
- Precision performance:
- Low on-resistance: 1.35 Ω (typical)
- Low capacitance: 35 pF (typical)
- Ultra-low on-resistance flatness: 0.01 Ω (typical)
- High current support: 470 mA (maximum)
- Low on-leakage current: 3.7 pA (typical), 0.5 nA (maximum)
- Low off-leakage current: 30 pA (typical), 0.25 nA (maximum)
- Ultra-low charge injection: 10 pC (typical)
- –40°C to +125°C operating temperature
- Rail-to-rail operation
- Bidirectional operation
- Break-before-make switching
The TMUX7612 is a complementary metal-oxide semiconductor (CMOS) switch device with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The device works with a single supply (4.5 V to 50 V), dual supplies (±4.5 V to ±25 V), or asymmetric supplies (such as V DD = 37.5 V, V SS = –12.5 V). The TMUX7612 supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from V SS to V DD.
The switches of the TMUX7612 are controlled with appropriate logic control inputs on the SELx pins. The TMUX7612 features a special architecture which allows for ultra-low charge injection. This feature helps prevent unwanted coupling from the control input to the analog output of the device and reduces AC noise and offset errors.
The TMUX7612 is a part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX7612 50 V, Low-RON, 1:1 (SPST), 4-Channel Precision Switches with 1.8-V Logic datasheet | PDF | HTML | 2023年 8月 8日 |
設計與開發
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TMUX-24PW-EVM — 適用於 16、20 和 24 針腳 PW 封裝的通用 TMUX 評估模組
TMUX-24PW-EVM 可對 TI 的 TMUX 產品系列進行快速原型設計和 DC 特性分析，這些產品使用 16、20 或 24 針腳 TSSOP 封裝 (PW)，並且額定用於高電壓操作。
TMUXRUM-RRPEVM — 適用於 16 針腳 RUM 和 RRP QFN 封裝的通用 TMUX 評估模組
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RUM) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。