Product details

Processor External MCU Type Module, Wireless network processor Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Throughput (max) (MBits) 16 Security Cryptographic acceleration, Device identity, FIPS 140-2 Level 1, Networking security (WPA3), Secure FW and SW update, Secure storage Features 16 secure sockets, 2.4-GHz coexistence, 4 STAs, 802.11abgn, IPv4 & IPv6 Certifications CE, FCC, ISED, MIC, Wi-Fi CERTIFIED Chip Operating temperature range (°C) -40 to 85 Rating Catalog
Processor External MCU Type Module, Wireless network processor Protocols Wi-Fi 2.4 GHz, Wi-Fi 5 GHz Throughput (max) (MBits) 16 Security Cryptographic acceleration, Device identity, FIPS 140-2 Level 1, Networking security (WPA3), Secure FW and SW update, Secure storage Features 16 secure sockets, 2.4-GHz coexistence, 4 STAs, 802.11abgn, IPv4 & IPv6 Certifications CE, FCC, ISED, MIC, Wi-Fi CERTIFIED Chip Operating temperature range (°C) -40 to 85 Rating Catalog
QFM (MOB) 63 358.75 mm² 20.5 x 17.5
  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4 GHz and 5 GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4 GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4 GHz and 5 GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4 GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3 V to 3.6 V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5 µA
      • Low-power deep sleep (LPDS): 115 µA
      • Idle connected (MCU in LPDS): 710 µA
      • RX traffic (MCU active): 53 mA
      • TX traffic (MCU active): 223 mA
  • Wi-Fi TX power
    • 2.4 GHz: 16 dBm at 1 DSSS
    • 5 GHz: 15.1 dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4 GHz: –94.5 dBm at 1 DSSS
    • 5 GHz: –89 dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0 MHz crystal with internal oscillator
    • 32.768 kHz crystal (RTC)
    • 32 Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem
  • Fully integrated and green/RoHS module includes all required clocks, serial peripheral interface (SPI) flash, and passives
  • Integrated Wi-Fi® and internet protocols
  • 802.11a/b/g/n: 2.4 GHz and 5 GHz
  • FCC, IC/ISED, ETSI/CE, and MIC certified
  • FIPS 140-2 Level 1 validated IC inside
  • Rich set of IoT security features helps developers protect data
  • Low-power modes for battery powered application
  • Coexistence with 2.4 GHz radios
  • Industrial temperature: –40°C to +85°C
  • Wi-Fi network processor subsystem:
    • Wi-Fi core:
      • 802.11 a/b/g/n 2.4 GHz and 5 GHz
      • Modes:
        • Access Point (AP)
        • Station (STA)
        • Wi-Fi Direct (only supported on 2.4 GHz)
      • Security:
        • WEP
        • WPA™/ WPA2™ PSK
        • WPA2 Enterprise
        • WPA3™ Personal
        • WPA3™ Enterprise
    • Internet and application protocols:
      • HTTPs server, mDNS, DNS-SD, DHCP
      • IPv4 and IPv6 TCP/IP stack
      • 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
    • Built-in power management subsystem:
      • Configurable low-power profiles (always on, intermittently connected, tag)
      • Advanced low-power modes
      • Integrated DC/DC regulators
  • Application throughput
    • UDP: 16 Mbps
    • TCP: 13 Mbps
  • Multilayered Security Features:
    • Separate execution environments
    • Networking security
    • Device identity and key
    • Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
    • File system security (encryption, authentication, access control)
    • Initial secure programming
    • Software tamper detection
    • Secure boot
    • Certificate signing request (CSR)
    • Unique per device key pair
  • Recovery mechanism – ability to recover to factory defaults
  • Power-Management Subsystem:
    • Integrated DC/DC converters support a wide range of supply voltage:
      • Single wide-voltage supply, VBAT: 2.3 V to 3.6 V
    • Advanced low-power modes:
      • Shutdown: 1 µA, hibernate: 5.5 µA
      • Low-power deep sleep (LPDS): 115 µA
      • Idle connected (MCU in LPDS): 710 µA
      • RX traffic (MCU active): 53 mA
      • TX traffic (MCU active): 223 mA
  • Wi-Fi TX power
    • 2.4 GHz: 16 dBm at 1 DSSS
    • 5 GHz: 15.1 dBm at 6 OFDM
  • Wi-Fi RX sensitivity
    • 2.4 GHz: –94.5 dBm at 1 DSSS
    • 5 GHz: –89 dBm at 6 OFDM
  • Additional integrated components on module
    • 40.0 MHz crystal with internal oscillator
    • 32.768 kHz crystal (RTC)
    • 32 Mbit SPI Serial Flash
    • RF filters, diplexer, and passive components
  • QFM package
    • 1.27-mm pitch, 63-pin, 20.5-mm × 17.5-mm QFM package for easy assembly and low-cost PCB design
  • Module supports SimpleLink Developers Ecosystem

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth ® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

The CC3135MOD is an FCC, IC/ISED, ETSI/CE, MIC, and Wi-Fi CERTIFIED™ module that dramatically simplifies the implementation of Internet connectivity. This dual-band Wi-Fi network processor module can be added to any low-cost, low-power microcontroller unit (MCU); it integrates all protocols for Wi-Fi® and Internet, which greatly minimize host MCU software requirements.

This ROM-based subsystem includes an 802.11 a/b/g/n dual-band 2.4 GHz and 5 GHz radio, baseband, and MAC with powerful hardware cryptographic engine. With built-in security protocols, the CC3135MOD solution provides a robust and simple security experience. The CC3135MOD is available in an LGA package that is easy to lay out with all required components including serial Flash, RF filters, diplexer, crystal, and passive components that are fully integrated.

This generation introduces new capabilities that further simplify the connectivity of things to the Internet. The main new features of CC3135MOD include:

  • 802.11 a/b/g/n: 2.4 GHz and 5 GHz support
  • 2.4 GHz Coexistence with Bluetooth low energy radio
  • Antenna diversity
  • Enhanced security with FIPS 140-2 level 1 validated IC inside: certification
  • More concurrent secure sockets, up to 16
  • Unique device identifier with ability to generate certificate signing request (CSR)
  • Online certificate status protocol (OCSP)
  • Wi-Fi Alliance certified for IoT low power capabilities
  • Hostless mode for offloading template packet transmissions
  • Improved fast scan

The CC3135MOD device is part of the SimpleLink™ MCU platform—a common, easy-to-use development environment based on a single-core software development kit (SDK) with a rich tool set and reference designs. The E2E™ community supports Wi-Fi®, Bluetooth ® low energy, Sub-1 GHz, and host MCUs. For more information, visit www.ti.com/SimpleLink.

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Technical documentation

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Type Title Date
* Data sheet SimpleLink™ Wi-Fi CC3135MOD Dual-Band Network Processor Module datasheet (Rev. D) PDF | HTML 13 May 2021
* Radiation & reliability report CC3135MOD Reliability Data – Reliability Estimate 25 Jun 2019
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 20 Oct 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mar 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mar 2022
Selection guide 無線連線技術選擇指南 (Rev. B) 07 Mar 2022
Selection guide 무선 연결 기술 선택 가이드 (Rev. B) 07 Mar 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 Feb 2022
Cybersecurity advisory TI-PSIRT-2021-100117 Integrated HTTP Server Ping Utility Vulnerability PDF | HTML 15 Jan 2022
Application note TI Wi-Fi Test Strategy Overview (Rev. A) 01 Jul 2021
Certificate CC3135MODRNMMOB EC Declaration of Conformity (DoC) (Rev. A) 03 Mar 2021
User guide SimpleLink™ Wi-Fi® CC3x20, CC3x3x Network Processor (Rev. M) PDF | HTML 30 Sep 2020
Application note CC3x20, CC3x35 SimpleLink™ Wi-Fi® Internet-on-a chip™ Solution Built-In Security (Rev. C) 29 Sep 2020
Application brief Wi-Fi® Enabled Electronic Smart Lock Security Application Brief (Rev. A) 29 Sep 2020
Application note SimpleLink™ Wi-Fi® CC3x20, CC3x3x Device Provisioning (Rev. C) PDF | HTML 18 Sep 2020
Application note SimpleLink™ Wi-Fi® CC3x20, CC3x3x Over-the-Air Update (Rev. B) 17 Sep 2020
Application note CE Compliance Test Procedure for TI’s WiFi Devices PDF | HTML 19 Aug 2020
Application note SimpleLink™ Wi-Fi® CC313x, CC323x BLE Coexistence (Rev. A) 17 Aug 2020
User guide SimpleLink™ Wi-Fi® CC3x20 and CC3x3x Provisioning for Mobile Applications (Rev. B) 17 Aug 2020
User guide SimpleLink™ Wi-Fi® CC3x20, CC3x3x Radio Tool User Guide (Rev. B) 17 Aug 2020
Application note SimpleLink™ Wi-Fi® CC3x3x Networking Subsystem Power Management (Rev. A) 17 Aug 2020
Application note SimpleLink™ Wi-Fi® CC3x3x Serial Flash (Rev. B) 17 Aug 2020
User guide UniFlash CC3x20, CC3x3x SimpleLink™ Wi-Fi® and IoC™ Solution ImageCreator (Rev. H) 17 Aug 2020
Certificate Product Information for CC3xxx Devices as Per Annex-E of EN 300 328 10 Aug 2020
Certificate Product Information for CC3xxx Devices as Per Annex-G of EN 301 893 10 Aug 2020
User guide CC3x35 Hardware Design Checklist (Rev. A) 17 Feb 2020
Application note Module Reliability for CC2xxxMODx, CC3xxxMODx, CC3xxxMODAx, and WL18xxMOD (Rev. A) 06 Feb 2020
Application note Transfer of TI Wi-Fi® Alliance Certifications to Products Using WFA Cert Policy (Rev. F) PDF | HTML 30 Jan 2020
Application note FIPS Compliant vs. FIPS Validated (Rev. A) 26 Jun 2019
White paper Low-Power Internet Connectivity Over Wi-Fi (Rev. A) 23 May 2019
White paper A primer to Wi-Fi® provisioning for IoT applications (Rev. A) 31 Jan 2019
Application note CC3135MOD Production Line Guide 12 Dec 2018
Application note CC3135MOD BoosterPack Hardware Design Files 12 Sep 2018
User guide CC3135MOD OEM Integrator’s Guide 12 Sep 2018
Application note CC313x and CC323x Simplelink™ Wi-Fi® Embedded Programming User's Guide 21 Mar 2018
User guide CC3135 SimpleLink™ Wi-Fi® BoosterPack™ Plug-in Module Hardware User’s Guide 01 Mar 2018

Design & development

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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