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SM320F2812-HT

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C2000™ High Temperature 32-bit MCU with 150 MHz, 256 KB Flash, EMIF

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Data sheet
Errata

SM320F2812-HT

ACTIVE
Data sheet Order now

Product details

Frequency (MHz) 150 Flash memory (kByte) 256 RAM (kByte) 36 ADC type 12-bit Number of GPIOs 56 UART 2 Features 2-pin oscillator, CAN, CPU timers, External memory interface, McBSP, Military qualified, Single zone code security, Watchdog timer Operating temperature range (°C) -55 to 220 Ethernet No PWM (Ch) 16 SPI 1 CAN (#) 1 Communication interface CAN, McBSP, SPI, UART
Frequency (MHz) 150 Flash memory (kByte) 256 RAM (kByte) 36 ADC type 12-bit Number of GPIOs 56 UART 2 Features 2-pin oscillator, CAN, CPU timers, External memory interface, McBSP, Military qualified, Single zone code security, Watchdog timer Operating temperature range (°C) -55 to 220 Ethernet No PWM (Ch) 16 SPI 1 CAN (#) 1 Communication interface CAN, McBSP, SPI, UART
CFP (HFG) 172 888.338025 mm² 29.805 x 29.805 DIESALE (KGD) — See data sheet
  • High-Performance Static CMOS Technology
    • 150 MHz (6.67 ns Cycle Time)
    • Low Power (1.8 V Core at 135 MHz, 1.9 V, Core at 150 MHz, 3.3 V I/O) Design
    • 3.3 V Flash Voltage
  • JTAG Boundary Scan SupportIEEE Standard 1149.1-1990, IEEE Standard Test-Access Port
  • High-Performance 32 Bit CPU (TMS320C28x)
    • 16 × 16 and 32 x 32 MAC Operations
    • 16 × 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • 4M Linear Program Address Reach
    • 4M Linear Data Address Reach
    • Code-Efficient (in C/C++ and Assembly)
    • TMS320F24x/LF240x Processor Source Code Compatible
  • On-Chip Memory
    • Flash Devices: Up to 128K × 16 Flash (Four 8K × 16 and Six 16K × 16 Sectors)
    • ROM Devices: Up to 128K × 16 ROM
    • 1K × 16 OTP ROM
    • L0 and L1: 2 Blocks of 4K × 16 Each Single-Access RAM (SARAM)
    • H0: 1 Block of 8K × 16 SARAM
    • M0 and M1: 2 Blocks of 1K × 16 Each SARAM
  • Boot ROM (4K × 16)
    • With Software Boot Modes
    • Standard Math Tables
  • External Interface
    • Up to 1M Total Memory
    • Programmable Wait States
    • Programmable Read/Write Strobe Timing
    • Three Individual Chip Selects
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • Three External Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts
  • 128 Bit Security Key/Lock
    • Protects Flash/ROM/OTP and L0/L1 SARAM
    • Prevents Firmware Reverse Engineering
  • Three 32 Bit CPU Timers
  • Motor Control Peripherals
    • Two Event Managers (EVA, EVB)
    • Compatible to 240xA Devices
  • Serial Port Peripherals
    • Serial Peripheral Interface (SPI)
    • Two Serial Communications Interfaces (SCIs), Standard UART
    • Multichannel Buffered Serial Port (McBSP) With SPI Mode
  • 12 Bit ADC, 16 Channels
    • 2 × 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 80 ns/12.5 MSPS
  • Up to 56 Individually Programmable, Multiplexed General-Purpose Input / Output (GPIO) Pins
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Tools Include
    • ANSI C/C++ Compiler/Assembler/Linker
    • Supports TMS320C24x/240x Instructions
    • Code Composer Studio IDE
    • DSP/BIOS
    • JTAG Scan Controllers [Texas Instruments (TI) or Third-Party]
    • Evaluation Modules
    • Broad Third-Party Digital Motor Control Support
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extreme (–55°C/220°C) Temperature Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
    • Texas Instruments high temperature products utilize highly optimized silicon (die)
      solutions with design and process enhancements to maximize performance over
      extended temperatures.

(1) Custom temperature ranges available
  • High-Performance Static CMOS Technology
    • 150 MHz (6.67 ns Cycle Time)
    • Low Power (1.8 V Core at 135 MHz, 1.9 V, Core at 150 MHz, 3.3 V I/O) Design
    • 3.3 V Flash Voltage
  • JTAG Boundary Scan SupportIEEE Standard 1149.1-1990, IEEE Standard Test-Access Port
  • High-Performance 32 Bit CPU (TMS320C28x)
    • 16 × 16 and 32 x 32 MAC Operations
    • 16 × 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • 4M Linear Program Address Reach
    • 4M Linear Data Address Reach
    • Code-Efficient (in C/C++ and Assembly)
    • TMS320F24x/LF240x Processor Source Code Compatible
  • On-Chip Memory
    • Flash Devices: Up to 128K × 16 Flash (Four 8K × 16 and Six 16K × 16 Sectors)
    • ROM Devices: Up to 128K × 16 ROM
    • 1K × 16 OTP ROM
    • L0 and L1: 2 Blocks of 4K × 16 Each Single-Access RAM (SARAM)
    • H0: 1 Block of 8K × 16 SARAM
    • M0 and M1: 2 Blocks of 1K × 16 Each SARAM
  • Boot ROM (4K × 16)
    • With Software Boot Modes
    • Standard Math Tables
  • External Interface
    • Up to 1M Total Memory
    • Programmable Wait States
    • Programmable Read/Write Strobe Timing
    • Three Individual Chip Selects
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • Three External Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts
  • 128 Bit Security Key/Lock
    • Protects Flash/ROM/OTP and L0/L1 SARAM
    • Prevents Firmware Reverse Engineering
  • Three 32 Bit CPU Timers
  • Motor Control Peripherals
    • Two Event Managers (EVA, EVB)
    • Compatible to 240xA Devices
  • Serial Port Peripherals
    • Serial Peripheral Interface (SPI)
    • Two Serial Communications Interfaces (SCIs), Standard UART
    • Multichannel Buffered Serial Port (McBSP) With SPI Mode
  • 12 Bit ADC, 16 Channels
    • 2 × 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 80 ns/12.5 MSPS
  • Up to 56 Individually Programmable, Multiplexed General-Purpose Input / Output (GPIO) Pins
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Tools Include
    • ANSI C/C++ Compiler/Assembler/Linker
    • Supports TMS320C24x/240x Instructions
    • Code Composer Studio IDE
    • DSP/BIOS
    • JTAG Scan Controllers [Texas Instruments (TI) or Third-Party]
    • Evaluation Modules
    • Broad Third-Party Digital Motor Control Support
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extreme (–55°C/220°C) Temperature Range(1)
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability
    • Texas Instruments high temperature products utilize highly optimized silicon (die)
      solutions with design and process enhancements to maximize performance over
      extended temperatures.

(1) Custom temperature ranges available

The SM320F2812 device, member of the C28xE DSP generation, is a highly integrated, high-performance solution for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.

Throughout this document SM320F2812 is abbreviated as F2812.

The SM320F2812 device, member of the C28xE DSP generation, is a highly integrated, high-performance solution for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.

Throughout this document SM320F2812 is abbreviated as F2812.
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Technical documentation

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Type Title Date
* Data sheet Digital Signal Processor. datasheet (Rev. B) 27 Jun 2011
* Errata SM320F2812-HT AVSSREFBG and AVDDREFBG Die Pad X-Center PDF | HTML 11 Nov 2021
* Radiation & reliability report SM320F2812HFGS150 Reliability Report 13 Aug 2012

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