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DRA726

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1.5 GHz Arm Cortex-A15 with Graphics & DSP for Infotainment & Cluster

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Data sheet
Errata

DRA726

ACTIVE
Data sheet Order now

Product details

Arm CPU 1 Arm Cortex-A15 Arm (max) (MHz) 1500 Coprocessors 2 Dual Arm Cortex-M4 CPU 32-bit Graphics acceleration 1 2D, 1 3D Display type 1 HDMI, 3 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100/1000, 2-Port 1Gb switch PCIe 2 PCIe Gen 2 Hardware accelerators 1 Image Video Accelerator, 2 Viterbi Decoder, Audio Tracking Features Multimedia Operating system Android, Linux, RTOS Security Cryptography, Debug security, Device identity, Isolation firewalls, Secure boot, Secure storage & programming, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125
Arm CPU 1 Arm Cortex-A15 Arm (max) (MHz) 1500 Coprocessors 2 Dual Arm Cortex-M4 CPU 32-bit Graphics acceleration 1 2D, 1 3D Display type 1 HDMI, 3 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100/1000, 2-Port 1Gb switch PCIe 2 PCIe Gen 2 Hardware accelerators 1 Image Video Accelerator, 2 Viterbi Decoder, Audio Tracking Features Multimedia Operating system Android, Linux, RTOS Security Cryptography, Debug security, Device identity, Isolation firewalls, Secure boot, Secure storage & programming, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125
FCBGA (ABC) 760 529 mm² 23 x 23
  • Architecture designed for infotainment applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
    • 2D and 3D graphics
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Single-core PowerVR™ SGX544 3D GPU
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • HDQ/1-Wire® interface
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI)
  • Media Local Bus subsystem (MLBSS)
  • Real-Time Clock subsystem (RTCSS)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 subsystems with two 5-Gbps lanes
    • One 2-lane Gen2-compliant port
    • or two 1-lane Gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B Protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and Boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)
  • Architecture designed for infotainment applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
    • 2D and 3D graphics
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • Single-core PowerVR™ SGX544 3D GPU
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • HDQ/1-Wire® interface
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI)
  • Media Local Bus subsystem (MLBSS)
  • Real-Time Clock subsystem (RTCSS)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 subsystems with two 5-Gbps lanes
    • One 2-lane Gen2-compliant port
    • or two 1-lane Gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B Protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Device security features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and Boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)

DRA72x ("Jacinto™ 6 Eco") infotainment applications processors are developed on the same architecture as Jacinto 6 devices to meet the intense processing needs of the modern infotainment-enabled automobile experiences.

DRA72x devices offer upward scalability to DRA74x devices, while being pin-compatible across the family, allowing Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly implement innovative connectivity technologies, speech recognition, audio streaming, and more. Jacinto 6 and Jacinto 6 Eco devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution.

Programmability is provided by a single-core Arm® Cortex®-A15 RISC CPU with Neon™ extensions and a TI C66x VLIW floating-point DSP core. The Arm® processor lets developers keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm®, and DSP, including C compilers and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The DRA72x Jacinto 6 Eco processor family is qualified according to the AEC-Q100 standard.

DRA72x ("Jacinto™ 6 Eco") infotainment applications processors are developed on the same architecture as Jacinto 6 devices to meet the intense processing needs of the modern infotainment-enabled automobile experiences.

DRA72x devices offer upward scalability to DRA74x devices, while being pin-compatible across the family, allowing Original-Equipment Manufacturers (OEMs) and Original-Design Manufacturers (ODMs) to quickly implement innovative connectivity technologies, speech recognition, audio streaming, and more. Jacinto 6 and Jacinto 6 Eco devices bring high processing performance through the maximum flexibility of a fully integrated mixed processor solution.

Programmability is provided by a single-core Arm® Cortex®-A15 RISC CPU with Neon™ extensions and a TI C66x VLIW floating-point DSP core. The Arm® processor lets developers keep control functions separate from other algorithms programmed on the DSP and coprocessors, thus reducing the complexity of the system software.

Additionally, TI provides a complete set of development tools for the Arm®, and DSP, including C compilers and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The DRA72x Jacinto 6 Eco processor family is qualified according to the AEC-Q100 standard.
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Technical documentation

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Type Title Date
* Data sheet DRA72x Infotainment Applications Processor Silicon Revision 2.0 and 2.1 datasheet (Rev. H) PDF | HTML 24 Jul 2019
* Errata DRA72x and DRA71x SoC for Automotive Infortainment Silicon Errata (Rev. E) PDF | HTML 15 Feb 2021
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 Apr 2024
Application note Integrating virtual DRM between VISION SDK and PSDK on Jacinto6 SOC PDF | HTML 05 May 2021
Application note IVA-HD Sharing Between VISION-SDK and PSDKLA on Jacinto6 SoC PDF | HTML 24 Aug 2020
White paper Jump Start Upgrading Your Digital Cluster Design with Jacinto 6 Platform (Rev. A) 17 Aug 2020
Application note AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 06 Jan 2020
Application note Integrating New Cameras With Video Input Port on DRA7xx SoCs PDF | HTML 11 Jun 2019
User guide DRA71x and DRA72x Technical Reference Manual (Rev. D) 21 May 2019
Application note Achieving Early CAN Response on DRA7xx Devices 28 Nov 2018
Application note DRA74x_75x/DRA72x Performance (Rev. A) 31 Oct 2018
Application note Audio Post Processing Engine on Jacinto™ DRA7x Family of Devices 14 Sep 2018
Application note The Implementation of YUV422 Output for SRV 02 Aug 2018
Application note MMC DLL Tuning (Rev. B) 31 Jul 2018
Application note Integrating AUTOSAR on TI SoC: Fundamentals 18 Jun 2018
Application note ECC/EDC on TDAxx (Rev. B) 13 Jun 2018
Application note Tools and Techniques to Root Case Failures in Video Capture Subsystem 12 Jun 2018
Application note Sharing VPE Between VISIONSDK and PSDKLA 04 May 2018
Application note Android Boot Optimization on DRA7xx Devices (Rev. A) 13 Feb 2018
Technical article Jacinto™ DRA automotive processors drive digital cockpit solutions PDF | HTML 12 Jan 2018
Application note Flashing Utility - mflash 09 Jan 2018
Application note Using Peripheral Boot and DFU for Rapid Development on Jacinto 6 Devices (Rev. A) 30 Nov 2017
Application note Jacinto6 Spread Spectrum Clocking Configuration (Rev. A) 27 Nov 2017
Application note Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 07 Nov 2017
Application note A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 03 Nov 2017
Application note Robust Rear-View Camera (RVC) App Report 13 Sep 2017
Application note Optimization of GPU-Based Surround View on TI’s TDA2x SoC 12 Sep 2017
Application note Using DSS Write-Back Pipeline for RGB-to-YUV Conversion on DRA7xx Devices 14 Aug 2017
Application note Software Guidelines to EMIF/DDR3 Configuration on DRA7xx Devices 12 Jul 2017
White paper Revolutionize the automotive cockpit 02 Jun 2017
Application note Linux Boot Time Optimizations on DRA7xx Devices 31 Mar 2017
Application note Interfacing DRA75x and DRA74x Audio to Analog Codecs (Rev. A) 17 Feb 2017
Application note Early Splash Screen on DRA7x Devices 31 Jan 2017
User guide DM369 Camera Starter Kit (CSK) User's Guide 15 Dec 2016
Application note Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 15 Dec 2016
EVM User's guide DRA72x EVM CPU Board User's Guide 07 Dec 2016
Application note Gstreamer Migration Guidelines 26 Apr 2016
User guide Jacinto6 Android Video Decoder Software Design Specification User's Guide 21 Apr 2016
User guide Jacinto6 Android Video Encoder Software Design Specification User's Guide 21 Apr 2016
Application note Flashing Binaries to DRA7xx Factory Boards Using DFU 14 Apr 2016
Application note Tools and Techniques for Audio Debugging 13 Apr 2016
Application note Debugging Tools and Techniques With IPC3.x 30 Mar 2016
Technical article Infotainment for the Masses – Volkswagen MIB II Standard powered by TI PDF | HTML 17 Feb 2016
Application note Modifying Memory Usage for IPUMM Applications Loaded IPC 3.x for DRA75x, DRA74x (Rev. A) 15 Jan 2016
Technical article Securing the Scene PDF | HTML 16 Dec 2015
Application note Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 13 Aug 2014
White paper Today’s high-end infotainment soon becoming mainstream 02 Jun 2014

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