CSD88599Q5DC
- Half-bridge power block
- High-density SON 5mm × 6mm footprint
- Low RDS(ON) for minimized conduction Losses
- 3.0W PLoss at 30A
- DualCool™ thermally Enhanced Package
- Ultra-low-inductance package
- RoHS compliant
- Halogen free
- Lead-free terminal plating
The CSD88599Q5DC 60V power block is an optimized design for high-current motor control applications, such as handheld, cordless garden and power tools. This device utilizes TI’s stacked die technology in order to minimize parasitic inductances while offering a complete half bridge in a space saving thermally enhanced DualCool™ 5mm × 6mm package. With an exposed metal top, this power block device allows for simple heat sink application to draw heat out through the top of the package and away from the PCB, for superior thermal performance at the higher currents demanded by many motor control applications.
Technical documentation
Design & development
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BOOSTXL-DRV8320H — DRV8320H Three-Phase Smart Gate Driver (Hardware Interface) Evaluation Module
BOOSTXL-DRV8320S — DRV8320S Three-Phase Smart Gate Driver (SPI Interface) Evaluation Module
BOOSTXL-DRV8323RH — DRV8323RH Three-Phase Smart Gate Driver With Buck, Shunt Amps (Hardware Interface) Evaluation Module
BOOSTXL-DRV8323RS — DRV8323RS three-phase smart gate driver with buck, shunt amps (SPI interface) evaluation module
The BOOSTXL-DRV8323RS is a 15A, 3-phase brushless DC drive stage based on the DRV8323RH gate driver and CSD88599Q5DC NexFETTM power blocks. The module has individual DC bus and phase voltage sense as well as individual low-side current shunt amplifiers, making this evaluation module ideal for (...)
BOOSTXL-DRV8320RS — DRV8320RS three-phase smart gate driver with buck and SPI interface evaluation module
CSD88599Q5DC Unencrypted PSpice Model Package (Rev. B)
SYNC-BUCK-FET-LOSS-CALC — Power Loss Calculation Tool for Synchronous Buck Converter
Supported products & hardware
Products
MOSFETs
TIDA-01485 — 36-V, 1-kW, 99% Efficient, 18-cm2 Power Stage Reference Design for Three-Phase BLDC Motors
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
VSON-CLIP (DMM) | 22 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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