JAJSD84K March   2017  – July 2024 TLV9061 , TLV9062 , TLV9064

PRODMIX  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: TLV9061
    5. 5.5  Thermal Information: TLV9061S
    6. 5.6  Thermal Information: TLV9062
    7. 5.7  Thermal Information: TLV9062S
    8. 5.8  Thermal Information: TLV9064
    9. 5.9  Thermal Information: TLV9064S
    10. 5.10 Electrical Characteristics
    11. 5.11 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Rail-to-Rail Input
      2. 6.3.2 Rail-to-Rail Output
      3. 6.3.3 EMI Rejection
      4. 6.3.4 Overload Recovery
      5. 6.3.5 Shutdown Function
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Low-Side Current Sense Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Input and ESD Protection
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9 Revision History

Changes from Revision J (September 2019) to Revision K (July 2024)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • 「製品情報」の表を更新Go
  • 「製品情報」表で TLV9062S (YCK、DSBGA) パッケージのプレビュー版の注を追加Go
  • Added YCK packages to the Device Comparison tableGo
  • Added TLV9062S YCK (DSBGA) pinout drawing to Pin Configuration and Functions sectionGo

Changes from Revision I (May 2019) to Revision J (September 2019)

  • データシート全体にわたって TLV9062IDDFR (SOT-23、8) パッケージのプレビュー版の注を削除Go
  • Added industry standard package names to Device Comparison Table Go
  • Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–Go
  • Added link to Shutdown Function section in SHDN pin function rowsGo
  • Added EMI Rejection section to the Feature Description sectionGo
  • Changed Shutdown Function section to add more clarification Go

Changes from Revision H (April 2019) to Revision I (May 2019)

  • Added DDF (SOT-23) thermal information to replace TBDsGo

Changes from Revision G (December 2018) to Revision H (April 2019)

  • 「製品情報」に (SOT-23、8) の情報を追加Go
  • Added DDF package column to Device Comparison Table Go
  • Added DDF (SOT-23) package, to Pin Functions Go
  • Added DDF (SOT-23) package to Thermal Information Go
  • Added TLV9062 RUG (X2QFN) thermal information to replace TBDsGo

Changes from Revision F (September 2018) to Revision G (December 2018)

  • 「製品情報」表で TLV9064 RUC パッケージの名前を(WQFN、14) から(X2QFN、14) に変更Go
  • Added RUC (X2QFN) package, pinout information to Pin Functions: TLV9064 tableGo
  • Added TLV9064 RUC (X2QFN) pinout drawing to Pin Configuration and Functions sectionGo
  • Added RUC (X2QFN) to Thermal Information: TLV9064 tableGo

Changes from Revision E (July 2018) to Revision F (September 2018)

  • データシートのヘッダーからシャットダウン型番を削除Go
  • 「製品情報」表から TLV9062 の (X2QFN、10) パッケージを削除Go
  • 「概要」セクションにシャットダウン型番の参照を追加Go
  • データシート全体にわたって TLV906xS シリーズを TLV906xS ファミリに変更Go
  • Added Shutdown devices to Device Comparison Table Go
  • Changed pin namings for all pinout drawings to reflect updated nomenclature Go
  • Added TLV9061S Thermal Information TableGo
  • Added TLV9064S Thermal Information TableGo
  • Deleted Partial Shutdown Amplifier Enable TimeGo
  • Added clarification on selecting resistors for a current sensing application in the Typical Applications Section Go
  • Changed wording of third bullet in Layout GuidelinesGo

Changes from Revision D (June 2018) to Revision E (July 2018)

  • 「製品情報」表に TLV9061S デバイスを追加Go
  • 「製品情報」表に TLV9064S デバイスを追加Go
  • Added RUC and RUG packages to the Device Comparison tableGo
  • Added TLV9061S DBV (SOT-23) pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9061S DBV (SOT-23) package, pinout information to Pin Functions: TLV9061S tableGo
  • Added TLV9062S RUG (VSSOP) package, pinout drawing to Pin Configuration and Functions sectionGo
  • Added TLV9064 RTE pinout information to Pin Functions: TLV9064 tableGo
  • Added TLV9064S RTE (WQFN) pinout drawing to Pin Configuration and Functions section Go
  • Added TLV9062S RUG (VSSOP) package, pinout information to Pin Functions: TLV9062S tableGo
  • Added TLV9064 RTE (WQFN) pinout drawing to Pin Configuration and Functions section Go

Changes from Revision C (March 2018) to Revision D (June 2018)

  • ドキュメントのタイトルの「TLV906x」にシャットダウン接尾辞を追加Go
  • 「特長」の箇条書き一覧に「シャットダウン バージョン」項目を追加 Go
  • 「製品情報」表に TLV9062S デバイスを追加Go
  • 「概要 (続き)」セクションにシャットダウンのテキストを追加Go
  • Added "(VS = [V+] – [V–]) supply voltage parameter in Absolute Maximum Ratings tableGo
  • Added "input voltage range" and "output voltage range" parameters and values to Recommended Operating Conditions tableGo
  • Added shutdown pin recommended operating conditions in Recommended Operating Conditions tableGo
  • Added "TA" symbol to "specified temperature" parameter to Recommended Operating Conditions table Go
  • Added Thermal Information: TLV9062S thermal table dataGo
  • Added Thermal Information: TLV9062S thermal table dataGo
  • Added shutdown section to Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8V to 5.5V tableGo
  • Added Shutdown Function section Go

Changes from Revision B (October 2017) to Revision C (March 2018)

  • デバイスのステータスを「量産データ / 混在ステータス」から「量産データ」に変更Go
  • 「製品情報」表で TLV9061 (DPW、X2SON) パッケージのプレビュー版の注を削除Go
  • Deleted package, preview note from TLV9061 DPW (X2SON) package, pinout drawing Go
  • Changed formatting of ESD Ratings table to show different results for all packages Go
  • Deleted package preview note from DPW (X2SON) package in Thermal Information: TLV9061 table Go
  • Deleted package preview note from DPW (X2SON) package in Thermal Information: TLV9061 table Go

Changes from Revision A (June 2017) to Revision B (October 2017)

  • Added 8-pin PW package, to Pin Configuration and Functions section Go
  • Added DSG (WSON) package to Thermal Information tableGo
  • Added PW (TSSOP) to TLV9062 Thermal Information table Go
  • Changed maximum input offset voltage value from ±1.6mV to 2mVGo
  • Changed maximum input offset voltage value from ±1.5 to ±1.6mVGo
  • Changed minimum common-mode rejection ratio input voltage range from 86dB to 80dB Go
  • Changed typical input current noise density value from 10 to 23fA/√ Hz Go
  • Changed THD + N test conditions from VS = 5V to VS = 5.5VGo
  • Added VCM = 2.5V test condition to THD + N parameter in Electrical Characteristics table Go
  • Added maximum output voltage swing value from 25mV to 60mVGo
  • Changed maximum output voltage swing value from 15mV to 20mV Go

Changes from Revision * (March 2017) to Revision A (June 2017)

  • デバイス ステータスを「事前情報」から「量産データ」に変更Go