SPRACN9F May   2023  – August 2024 AM67 , AM67A , AM68 , AM68A , AM69 , AM69A , DRA821U , DRA821U-Q1 , DRA829J , DRA829J-Q1 , DRA829V , DRA829V-Q1 , TDA4AEN-Q1 , TDA4AH-Q1 , TDA4AL-Q1 , TDA4AP-Q1 , TDA4VE-Q1 , TDA4VEN-Q1 , TDA4VH-Q1 , TDA4VL-Q1 , TDA4VM , TDA4VM-Q1 , TDA4VP-Q1

 

  1.   1
  2.   Jacinto7 AM6x/TDA4x/DRA8x LPDDR4 Design Guidelines
  3.   Trademarks
  4. 1Overview
    1. 1.1 Supporting Documentation
    2. 1.2 Board Designs Supported
    3. 1.3 General Board Layout Guidelines
    4. 1.4 PCB Stack-Up
    5. 1.5 Bypass Capacitors
      1. 1.5.1 Bulk Bypass Capacitors
      2. 1.5.2 High-Speed Bypass Capacitors
    6. 1.6 Velocity Compensation
  5. 2LPDDR4 Board Design and Layout Guidance
    1. 2.1  LPDDR4 Introduction
    2. 2.2  LPDDR4 Device Implementations Supported
    3. 2.3  LPDDR4 Interface Schematics
    4. 2.4  Compatible JEDEC LPDDR4 Devices
    5. 2.5  Placement
    6. 2.6  LPDDR4 Keepout Region
    7. 2.7  Net Classes
    8. 2.8  LPDDR4 Signal Termination
    9. 2.9  LPDDR4 VREF Routing
    10. 2.10 LPDDR4 VTT
    11. 2.11 CK, CMD_ADDR, and CTRL Topologies
    12. 2.12 Data Group Topologies
    13. 2.13 CK, CMD_ADDR, and CTRL Routing Specification
    14. 2.14 Data Group Routing Specification
    15. 2.15 Channel, Byte, and Bit Swapping
  6. 3LPDDR4 Board Design Simulations
    1. 3.1 Board Model Extraction
    2. 3.2 Board-Model Validation
    3. 3.3 S-Parameter Inspection
    4. 3.4 Time Domain Reflectometry (TDR) Analysis
    5. 3.5 Simulation Integrity Analysis
      1. 3.5.1 Simulation Setup
      2. 3.5.2 Simulation Parameters
      3. 3.5.3 Simulation Targets
        1. 3.5.3.1 Waveform Quality
        2. 3.5.3.2 Eye Quality
        3. 3.5.3.3 Delay Report
        4. 3.5.3.4 Mask Report
    6. 3.6 Design Example
      1. 3.6.1 Stack-Up
      2. 3.6.2 Routing
      3. 3.6.3 Model Verification
      4. 3.6.4 Simulation Results
  7. 4Revision History

2.12 Data Group Topologies

The data line topology is always point-to-point for LPDDR4 implementations, and is broken up into four different byte lanes. It is recommended to minimize layer transitions during routing. If a layer transition is necessary, it is better to transition to a layer using the same reference plane. If this cannot be accommodated, ensure there are nearby ground vias to allow the return currents to transition between reference planes. The goal is to provide a low inductance path for the return current. To optimize the skew matching, TI recommends routing all nets within a single data routing group on one layer where all nets have the exact same number of vias and the same via barrel length.

DQSP and DQSN lines are point-to-point signals routed as a differential pair. Figure 2-9 illustrates the DQSP/N connection topology.

J722S, AM67x, TDA4VEN-Q1, TDA4AEN-Q1 LPDDR4 DQS TopologyFigure 2-9 LPDDR4 DQS Topology

DQ and DM lines are point-to-point signals routed as single-ended. Figure 2-10 illustrates the DQ and DM connection topology.

J722S, AM67x, TDA4VEN-Q1, TDA4AEN-Q1 LPDDR4 DQ/DM TopologyFigure 2-10 LPDDR4 DQ/DM Topology

There are no stubs or termination allowed on the nets of the data group topologies. All test and probe access points must be in line without any branches or stubs.