SPRACP4A December   2019  – June 2024 AM67 , AM67A , AM68 , AM69 , DRA829J , DRA829V , TDA4AEN-Q1 , TDA4VEN-Q1 , TDA4VH-Q1 , TDA4VM , TDA4VM-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Overview
    2. 1.2 Supporting Documentation
  5. 2High-Speed Interface Design Guidance
    1. 2.1  Trace Impedance
    2. 2.2  Trace Lengths
    3. 2.3  Differential Signal Length Matching
    4. 2.4  Signal Reference Planes
    5. 2.5  Differential Signal Spacing
    6. 2.6  Additional Differential Signal Rules
    7. 2.7  Symmetry in the Differential Pairs
    8. 2.8  Connectors and Receptacles
    9. 2.9  Via Discontinuity Mitigation
    10. 2.10 Back-Drill Via Stubs
    11. 2.11 Via Anti-Pad Diameter
    12. 2.12 Equalize Via Count
    13. 2.13 Surface-Mount Device Pad Discontinuity Mitigation
    14. 2.14 Signal Bending
    15. 2.15 ESD and EMI Considerations
    16. 2.16 ESD and EMI Layout Rules
  6. 3Interface-Specific Design Guidance
    1. 3.1 USB Board Design and Layout Guidelines
      1. 3.1.1 USB Interface Schematic
        1. 3.1.1.1 Support Components
      2. 3.1.2 Routing Specifications
    2. 3.2 DisplayPort Board Design and Layout Guidelines
      1. 3.2.1 DP Interface Schematic
        1. 3.2.1.1 Support Components
      2. 3.2.2 Routing Specifications
    3. 3.3 PCIe Board Design and Layout Guidelines
      1. 3.3.1 PCIe Interface Schematic
        1. 3.3.1.1 Polarity Inversion
        2. 3.3.1.2 Lane Swap
        3. 3.3.1.3 REFCLK Connections
        4. 3.3.1.4 Coupling Capacitors
      2. 3.3.2 Routing Specifications
    4. 3.4 MIPI® D-PHY (CSI2, DSI) Board Design and Layout Guidelines
      1. 3.4.1 CSI-2®, DSI® Interface Schematic
      2. 3.4.2 Routing Specifications
      3. 3.4.3 Frequency-Domain Specification Guidelines
    5. 3.5 UFS Board Design and Layout Guidelines
      1. 3.5.1 UFS Interface Schematic
      2. 3.5.2 Routing Specifications
    6. 3.6 Q/SGMII Board Design and Layout Guidelines
      1. 3.6.1 Q/SGMII Interface Schematic
        1. 3.6.1.1 Coupling Capacitors
      2. 3.6.2 Routing Specifications
  7. 4Board Design Simulations
    1. 4.1 Board Model Extraction
    2. 4.2 Board-Model Validation
    3. 4.3 S-Parameter Inspection
    4. 4.4 Time Domain Reflectometry (TDR) Analysis
    5. 4.5 Simulation Integrity Analysis
      1. 4.5.1 Simulator Settings and Model Usage
      2. 4.5.2 Simulation Parameters
      3. 4.5.3 Simulation Methodology
    6. 4.6 Reviewing Simulation Results
  8. 5References
  9. 6Revision History

4.4 Time Domain Reflectometry (TDR) Analysis

As a lot of the design fixes are targeted towards maintaining uniform trace impedance, an important analysis method used in assessing the quality of the design is the Time Domain Reflectometry (TDR) Analysis. This plots the impedance of a trace as a function of its length. An example of this is shown in Figure 4-1.

TDR Plot Example With Impedance MismatchFigure 4-1 TDR Plot Example With Impedance Mismatch

As shown in Figure 4-1 (TDR plot example), the TDR plot highlights impedance discontinuities in the trace from one end to the other. This method depends on a reflected waveform from the far-end of the trace. The delay in the plot corresponding to a particular point in the trace actually corresponds to 2 times the distance of that point from the source, owing to the round trip time. This needs to be factored in for assessing the source of impedance discontinuities.

The TDR plot can be generated by reading in the S-parameter models generated by the extraction tool and assessing them in “Time-Domain” mode. A standard EDA simulator such as HyperLynx can perform this function. It is recommended to optimize the design to within a ± 5% deviation from the nominal trace impedance.