SLAAE70A December   2022  – February 2023 MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507 , MSPM0L1105 , MSPM0L1106 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   Trademarks
  2. 1MSPM0 Overview
    1. 1.1 Portfolio
    2. 1.2 Ecosystem
  3. 2MSPM0 Design Resources
    1. 2.1 Training Resources
      1. 2.1.1 MSP Academy
      2. 2.1.2 Precision Labs
    2. 2.2 Development Tools
      1. 2.2.1 Integrated Development Environments (IDEs)
      2. 2.2.2 SysConfig Code Generation Tools
      3. 2.2.3 Analog Config Tool
      4. 2.2.4 Compilers
      5. 2.2.5 Debugging and Programming Tools
        1. 2.2.5.1 Debuggers/Programmers
          1. 2.2.5.1.1 XDS110
          2. 2.2.5.1.2 MSP-GANG – TI Production Programmer
          3. 2.2.5.1.3 Segger J-Link and Other Third-Party Arm Debuggers
        2. 2.2.5.2 Software Programming Tools
          1. 2.2.5.2.1 Uniflash
          2. 2.2.5.2.2 Bootstrap Loader (BSL)
    3. 2.3 Embedded Software Resources
      1. 2.3.1 MSPM0 Software Development Kit (SDK)
        1. 2.3.1.1 Code Examples
        2. 2.3.1.2 Driver Library (DriverLib)
      2. 2.3.2 Real-Time Operating System (RTOS)
      3. 2.3.3 Subsystem Examples
    4. 2.4 Hardware Tools and EVMs
      1. 2.4.1 Development Boards
  4. 3MSPM0 Application Resources
    1. 3.1 Application Notes
    2. 3.2 Application-Specific Resources
  5. 4Acronyms and Definitions
  6. 5Revision History

1.1 Portfolio

TI’s scalable portfolio of MSPM0 MCUs is based on the enhanced Arm® Cortex®-M0+ 32-bit processor operating at speeds up to 80 MHz. The Cortex-M0+ processor is the most energy-efficient Arm processor available for embedded applications. These cost-optimized MCUs offer pin-to-pin compatibility across a wide range of memory and package sizes as shown in #GUID-1CB952CF-5F16-4B1E-BB3F-D0DEDC1ADE0F. Software development can be re-used across the entire MSPM0 portfolio. An overview of the MSPM0 MCUs and key features is shown in Table 1-1. Refer to the device-specific data sheet to learn more about additional device-specific features.

GUID-DB02B091-F332-4C43-9944-3A9D995B324F-low.pngFigure 1-1 MSPM0 Portfolio
Table 1-1 Key Features
FeatureMSPM0Gx SeriesMSPM0Lx Series
Core / FrequencyCM0+ / 80 MHzCM0+ / 32 MHz
Supply Voltage1.62 V to 3.6 V1.62 V to 3.6 V
Temperature-40°C to 125°C-40°C to 125°C
Memory128KB to 32KB64KB to 8KB
RAMUp to 32KBUp to 4KB
GPIO (max)6028
Analog2x 4-Msps 12-bit ADC1x 1-Msps 12-bit ADC
3x high-speed comparators1x high-speed comparator
2x op amps2x op amps
1x 12-bit DAC
Communication (max)2x SPI1x SPI
2x I2C Fast+2x I2C Fast+
4x UART (LIN)2x UART (LIN)
1x CAN-FD
Timers74
Advance Timers[HJ2]Yes (2x)No
Hardware AcceleratorOptionalN/A
SecurityCRC, TRNG, AES256CRC
Low powerActive: 85 µA/MHzActive: 85 µA/MHz
Standby (RTC): 1.5 µAStandby: 1.5 µA