SLAT162 February 2023 MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507 , MSPM0L1105 , MSPM0L1106 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346
In an embedded system, MCUs have three core responsibilities: they must accurately and reliably measure the real world, process measurement data to make critical decisions, and act on the decisions with output modules or communication interfaces. It is this combination of critical functions in one integrated circuit makes device selection challenging. Choosing an MCU that does all three aspects well often brings negative trade-offs in scalability, cost, or ease-of-use. TI’s scalable, cost optimized, and simple to use portfolio of MSPM0 MCUs is all about doing all three core responsibilities of an MCU better without compromises, enabling unlimited possibilities.
MCU application requirements also evolve over time. New projects often require changes to support cost reduction, the addition of a new feature, or improved supply continuity. MSPM0's broad scalability takes engineers from the starting point all the way to the destination with hardware and software re-use, whether the destination requires a lower cost device or a higher performance device. Developed from the ground up for both pin-to-pin compatibility and software compatibility, MSPM0 enables designers to not only scale across flash memory options but also across the broadest range of analog peripherals, digital peripherals, and compute performance.
| More options. | Unlimited possibilities. |
|
|
Appliances: Implement everything from simple sensor and user interface modules up to FOC motor drives |
| Building automation: Leverage on-chip analog and low-power architecture to enable more accurate building security and fire safety systems | |
| Factory automation: Design with the smallest package sizes and support for 125°C ambient temperature with scalable memory options | |
| Grid infrastructure: Industry-leading cold start-up time for circuit monitoring applications, pairable with TI metrology front-end for energy metering and monitoring | |
| Lighting: Add support for the DALI protocol, build with FreeRTOS, and leverage up to 100,000 flash program-erase cycles for data storage | |
| Medical: Reduce bill of materials in health monitoring applications with integrated chopper amplifiers | |
| Motor drives: Implement trapezoidal and FOC algorithms with more CPU performance to process data from faster and more accurate ADCs | |
| Power delivery: Integrate low-side current sensing for programmable charging and gauging applications | |
| Wired communication: Bridge CAN-FD, LIN, DALI, Smart card, Manchester, IrDA, SM-BUS, 1-wire, and more |
Start your next MCU design with MSPM0 MCUs and get to market faster and at the lowest cost, while building on top of the industry's most optimized software and largest investment in low cost MCU manufacturing capacity.