SLVA505A February   2012  – July 2024 DRV8800 , DRV8801 , DRV8802 , DRV8803 , DRV8804 , DRV8805 , DRV8806 , DRV8811 , DRV8812 , DRV8813 , DRV8814 , DRV8818 , DRV8821 , DRV8823 , DRV8824 , DRV8828 , DRV8829 , DRV8830 , DRV8832 , DRV8832-Q1 , DRV8833 , DRV8834 , DRV8835 , DRV8836 , DRV8837 , DRV8840 , DRV8841 , DRV8842 , DRV8843 , DRV8844 , DRV8870 , DRV8871 , DRV8872

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Factors Limiting the Maximum Output Current of a Motor Driver
    1. 1.1 Thermal Limitations
    2. 1.2 Overcurrent Protection (OCP) Limitations
    3. 1.3 Silicon and Package Limitations
    4. 1.4 PCB Limitations and Thermal Management Techniques
      1. 1.4.1 Exposed Pad Packages
      2. 1.4.2 Continuous Copper Planes
      3. 1.4.3 Copper Thickness
      4. 1.4.4 Thermal Vias
      5. 1.4.5 Summary of Thermal Management Techniques
    5. 1.5 Thermal Estimations
  5. 2TI Motor Driver OCP Operation
  6. 3TI Motor Driver Data Sheet Ratings
    1. 3.1 Description
    2. 3.2 Absolute Maximum Ratings
    3. 3.3 Recommended Operating Conditions
    4. 3.4 Thermal Information
    5. 3.5 Electrical Characteristics
  7. 4References
  8. 5Revision History

1.4 PCB Limitations and Thermal Management Techniques

While thermal limitations exist for the device, several other considerations must be made when designing a printed circuit board (PCB) to meet specified motor driver current ratings.

Thermal management and heat dissipation in PCB design, significantly impact current ratings and motor driver reliability. As motor drivers become more powerful and compact, managing heat is essential in preventing overheating which can make sure operation within safe temperature ranges. Implementing strategic heat dissipation strategies such as proper thermal pad pours and connections, copper thickness, and use of thermal vias can help to enhance PCB performance and improve motor driver current ratings.