SLVA505A February 2012 – July 2024 DRV8800 , DRV8801 , DRV8802 , DRV8803 , DRV8804 , DRV8805 , DRV8806 , DRV8811 , DRV8812 , DRV8813 , DRV8814 , DRV8818 , DRV8821 , DRV8823 , DRV8824 , DRV8828 , DRV8829 , DRV8830 , DRV8832 , DRV8832-Q1 , DRV8833 , DRV8834 , DRV8835 , DRV8836 , DRV8837 , DRV8840 , DRV8841 , DRV8842 , DRV8843 , DRV8844 , DRV8870 , DRV8871 , DRV8872
Certain motor driver packages have exposed pads that are referred to as a thermal pad or PowerPAD™. These thermal pads are located on the bottom of the motor driver and can connect to the landing pad of the PCB. This thermal pad is responsible for most of the device's heat dissipation by creating a low thermally resistive path to dissipate heat away from the die to the landing pad of the PCB. The landing pad is located on the top of the PCB and the size must be the same size or larger than the exposed PowerPad™ of the motor driver. It should also be firmly connected to the bottom ground plane with multiple thermal vias positioned directly underneath.