SLVA505A February   2012  – July 2024 DRV8800 , DRV8801 , DRV8802 , DRV8803 , DRV8804 , DRV8805 , DRV8806 , DRV8811 , DRV8812 , DRV8813 , DRV8814 , DRV8818 , DRV8821 , DRV8823 , DRV8824 , DRV8828 , DRV8829 , DRV8830 , DRV8832 , DRV8832-Q1 , DRV8833 , DRV8834 , DRV8835 , DRV8836 , DRV8837 , DRV8840 , DRV8841 , DRV8842 , DRV8843 , DRV8844 , DRV8870 , DRV8871 , DRV8872

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Factors Limiting the Maximum Output Current of a Motor Driver
    1. 1.1 Thermal Limitations
    2. 1.2 Overcurrent Protection (OCP) Limitations
    3. 1.3 Silicon and Package Limitations
    4. 1.4 PCB Limitations and Thermal Management Techniques
      1. 1.4.1 Exposed Pad Packages
      2. 1.4.2 Continuous Copper Planes
      3. 1.4.3 Copper Thickness
      4. 1.4.4 Thermal Vias
      5. 1.4.5 Summary of Thermal Management Techniques
    5. 1.5 Thermal Estimations
  5. 2TI Motor Driver OCP Operation
  6. 3TI Motor Driver Data Sheet Ratings
    1. 3.1 Description
    2. 3.2 Absolute Maximum Ratings
    3. 3.3 Recommended Operating Conditions
    4. 3.4 Thermal Information
    5. 3.5 Electrical Characteristics
  7. 4References
  8. 5Revision History

Exposed Pad Packages

Certain motor driver packages have exposed pads that are referred to as a thermal pad or PowerPAD™. These thermal pads are located on the bottom of the motor driver and can connect to the landing pad of the PCB. This thermal pad is responsible for most of the device's heat dissipation by creating a low thermally resistive path to dissipate heat away from the die to the landing pad of the PCB. The landing pad is located on the top of the PCB and the size must be the same size or larger than the exposed PowerPad™ of the motor driver. It should also be firmly connected to the bottom ground plane with multiple thermal vias positioned directly underneath.

DRV88XX Cross Section of Thermal Pad™
                    Package Mounted to PCB and Resulting Heat Transfer Figure 1-1 Cross Section of Thermal Pad™ Package Mounted to PCB and Resulting Heat Transfer