SLVA505A February   2012  – July 2024 DRV8800 , DRV8801 , DRV8802 , DRV8803 , DRV8804 , DRV8805 , DRV8806 , DRV8811 , DRV8812 , DRV8813 , DRV8814 , DRV8818 , DRV8821 , DRV8823 , DRV8824 , DRV8828 , DRV8829 , DRV8830 , DRV8832 , DRV8832-Q1 , DRV8833 , DRV8834 , DRV8835 , DRV8836 , DRV8837 , DRV8840 , DRV8841 , DRV8842 , DRV8843 , DRV8844 , DRV8870 , DRV8871 , DRV8872

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Factors Limiting the Maximum Output Current of a Motor Driver
    1. 1.1 Thermal Limitations
    2. 1.2 Overcurrent Protection (OCP) Limitations
    3. 1.3 Silicon and Package Limitations
    4. 1.4 PCB Limitations and Thermal Management Techniques
      1. 1.4.1 Exposed Pad Packages
      2. 1.4.2 Continuous Copper Planes
      3. 1.4.3 Copper Thickness
      4. 1.4.4 Thermal Vias
      5. 1.4.5 Summary of Thermal Management Techniques
    5. 1.5 Thermal Estimations
  5. 2TI Motor Driver OCP Operation
  6. 3TI Motor Driver Data Sheet Ratings
    1. 3.1 Description
    2. 3.2 Absolute Maximum Ratings
    3. 3.3 Recommended Operating Conditions
    4. 3.4 Thermal Information
    5. 3.5 Electrical Characteristics
  7. 4References
  8. 5Revision History

1.4.5 Summary of Thermal Management Techniques

In summary, the thermal pad connection is the most efficient path for dissipating heat from the device die. To optimize this, use continuous top-layer pours from the thermal pad to the ground planes, and utilize 1.5-oz or 2-oz copper when possible for better heat conduction. Additionally, employ direct-connect thermal vias to further enhance thermal management (Figure 1-4). More on board layout best practices for motor drivers can be found at the following link: Best Practices for Board Layout of Motor Drivers., application note.