SNOAA35E December 2023 – June 2024 LM2901 , LM2901B , LM2901B-Q1 , LM2903 , LM2903-Q1 , LM2903B , LM2903B-Q1 , LM339 , LM339-N , LM393 , LM393-N , LM393B , LM397 , TL331 , TL331-Q1 , TL331B
Device PCN Summary summarizes the differences between the pre-PCN and post-PCN behavior.
Device Family (Including -Q1) | Chip Site Origin Packing Label Field (20L) CSO : _ _ _ | Chip Country Origin Packing Label Field (21L) CCO : _ _ _ | Die Process | Both Inputs Above Input Range Ouptut Behavior |
---|---|---|---|---|
LM139/239/339 (Pre PCN) | SHE | USA | Ji1 | Low |
LM139/239/339 (Post PCN) | RFB | USA | TiB | Low |
LM339B | RFB | USA | TiB | High |
LM2901 (Pre PCN) | SHE | USA | Ji1 | Low |
LM2901 (Post PCN) | RFB | USA | TiB | Low |
LM2901B | RFB | USA | TiB | High |
LM193/293/393 (Pre PCN) | SHE | USA | Ji1 | Low |
LM193/293/393 (Post PCN #1) | CU3 | CHN | Ji3 | High |
LM193/293/393 (Post PCN #2) | RFB | USA | TiB | Low |
LM393B | CU3 | CHN | Ji3 | High |
LM2903 (Pre PCN) | SHE | USA | Ji1 | Low |
LM2903 (Post PCN #1) | CU3 | CHN | Ji3 | High |
LM2903 (Post PCN #2) | RFB | USA | TiB | Low |
LM2903B | CU3 | CHN | Ji3 | High |
TL331 (Pre PCN) | SHE | USA | Ji1 | Low |
TL331 (Post PCN #1) | CU3 | CHN | Ji3 | High |
TL331 (Post PCN #2) | RFB | USA | TiB | Low |
TL331B | CU3 | CHN | Ji3 | High |
Die Process Note: