SNOAA35F April   2019  – December 2024 LM2901 , LM2901B , LM2901B-Q1 , LM2903 , LM2903-Q1 , LM2903B , LM2903B-Q1 , LM339 , LM339-N , LM393 , LM393-N , LM393B , LM397 , TL331 , TL331-Q1 , TL331B

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Devices Covered in Application Note
    1. 1.1 Base Part Numbers
    2. 1.2 Input Voltage Offset Grades
    3. 1.3 Maximum Supply Voltage
    4. 1.4 High Reliability Options
  5. 2 The New TL331B, TL391B, LM339B, LM393B, LM2901B and LM2903B B Versions
  6. 3 PCN's to Change Classic Die to a New Die Design
    1. 3.1 PCN #1 for Single and Dual (TL331 and LMx93/LM2903)
    2. 3.2 PCN #2 for Single and Dual (TL331 and LMx93/LM2903)
    3. 3.3 PCN For Quad (LMx39, LM2901)
    4. 3.4 PCN for B Devices (including -Q1's)
    5. 3.5 Device PCN Summary
    6. 3.6 Determining Die Version Used
      1. 3.6.1 Determine Die Used for Single TL331 and Dual LM293, LM393, and LM2903 - PCN #1 (Ji3)
      2. 3.6.2 Determine Die Used for Single TL331 and Dual LM293, LM393, and LM2903 - PCN #2 (TiB)
      3. 3.6.3 Determine Die Used for Quad LM139, LM239, LM339, and LM2901
      4. 3.6.4 Determine Die Used for Post-PCN B Devices
  7. 4 Changes to Package Top Markings
  8. 5 Roughened Leadframe Finish
  9. 6 Input Considerations
    1. 6.1  Input Stage Schematic – The Classic LM339 Family
    2. 6.2  Input Stage Schematic - New "B" and TiB Devices
    3. 6.3  Differences Between the Classic, "B" and Tib Die Devices
    4. 6.4  Input Voltage Range
    5. 6.5  Input Voltage Range vs. Common Mode Voltage Range
    6. 6.6  Reason for Input Range Headroom Limitation
    7. 6.7  Input Voltage Range Feature
    8. 6.8  Both Inputs Above Input Range Behavior
    9. 6.9  Negative Input Voltages
      1. 6.9.1 Maximum Input Current
      2. 6.9.2 Phase Reversal or Inversion
      3. 6.9.3 Protecting Inputs from Negative Voltages
        1. 6.9.3.1 Simple Resistor and Diode Clamp
        2. 6.9.3.2 Voltage Divider with Clamp
          1. 6.9.3.2.1 Split Voltage Divider with Clamp
    10. 6.10 Power-Up Behavior
    11. 6.11 Capacitors and Hysteresis
    12. 6.12 Output to Input Cross-Talk
  10. 7 Output Stage Considerations
    1. 7.1 Output VOL and IOL
    2. 7.2 Pull-Up Resistor Selection
    3. 7.3 Short Circuit Sinking Current
    4. 7.4 Pulling Output Up Above Vcc
    5. 7.5 Negative Voltages Applied to Output
    6. 7.6 Adding Large Filter Capacitors To Output
  11. 8 Power Supply Considerations
    1. 8.1 Supply Bypassing
      1. 8.1.1 Low VCC Guidance
      2. 8.1.2 Split Supply use
  12. 9 General Comparator Usage
    1. 9.1 Unused Comparator Connections
      1. 9.1.1 Do Not Connect Inputs Directly to Ground
      2. 9.1.2 Unused Comparator Input Connections
      3. 9.1.3 Leave Outputs Floating
      4. 9.1.4 Prototyping
  13. 10PSpice and TINA TI Models
  14. 11Conclusion
  15. 12Related Documentation
    1. 12.1 Related Links
  16. 13Revision History

5 Roughened Leadframe Finish

Texas Instruments is implementing a new single-side roughened leadframe. These leadframes are etched prior to plating to purposely roughen the lead surface. Roughening improves the solder adhesion (solderability) of the leads.

This roughening can make the leads look tarnished, corroded, or take on a gray or greenish appearance compared to the traditional smooth plated leadframes.

Classic (Shiny) LeadframeFigure 5-1 Classic (Shiny) Leadframe
Roughened (Tarnished) LeadframeFigure 5-2 Roughened (Tarnished) Leadframe

The darker or "tarnished" appearance is due to refraction of light on the rough surface as opposed to the traditional "shiny" mirror-like smooth plating. The light color and spectral purity can influence the appearance. Figure 5-2 shows a rather extreme close-up example of a roughened leadframe.

While the DIP package is shown as an example, the roughening is occurring across multiple package families (SC-70, SOT-23, SOIC, SOP, MSOP, VSSOP, TSSOP, as well as leadless packages).

The roughened leadframes go through the same plating process as the smooth leadframes and have passed or exceeded all the required JEDEC and AEC package qualifications. These roughened leadframes are being adopted across TI products and are not just exclusive to the LM339 family.