SNVA853C December   2019  – March 2024 LMZ10500 , LMZ10501 , LMZ20501 , LMZ20502 , LMZ21700 , LMZ21701 , LMZ30604 , LMZ31506 , LMZ31520 , LMZ31530 , LMZ31704 , LMZ31707 , LMZ31710 , LMZ34202 , LMZ35003 , LMZ36002 , LMZM23600 , LMZM23601 , LMZM33602 , LMZM33603 , LMZM33604 , LMZM33606 , TLVM13610 , TLVM13630 , TLVM13640 , TLVM13660 , TLVM23615 , TLVM23625 , TPS82085 , TPS82130 , TPSM265R1 , TPSM33615 , TPSM33625 , TPSM365R3 , TPSM365R6 , TPSM53604 , TPSM5601R5 , TPSM5601R5H , TPSM5601R5HE , TPSM560R6 , TPSM63603 , TPSM63604 , TPSM63606 , TPSM63608 , TPSM63610 , TPSM84424 , TPSM84624 , TPSM846C23 , TPSM846C24 , TPSM84824

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Package Types
    1. 2.1 MicroSiP
    2. 2.2 QFN Overmolded
    3. 2.3 QFN Open Frame
    4. 2.4 Leaded
    5. 2.5 QFN-FCMOD
  6. 3Package CAD/CAE Symbols and Footprints
  7. 4Soldering
    1. 4.1 MSL Ratings
    2. 4.2 Reflow Profile
    3. 4.3 Back Side PCB Mounting Considerations
      1. 4.3.1 Method 1 - Solder Surface Perimeter
      2. 4.3.2 Method 2 - Solder Surface Area
      3. 4.3.3 Back Side PCB Mounting Evaluation of TI Modules
      4. 4.3.4 Reflow Fixture
  8. 5Rework During Prototyping
  9. 6References
  10. 7Revision History

4.3.3 Back Side PCB Mounting Evaluation of TI Modules

Table 4-1 contains the back side PCB mounting feasibility evaluation of several TI module families, considering the following:

  • Maximum mass / pad area ≤ 47 mg/mm2
  • Maximum mass / pad perimeter ≤ 22 mg/mm
Table 4-1 Back Side Feasibility With Second Reflow
DEVICE FEASIBILITY
WITHOUT FIXTURE		 PACKAGE
TYPE		 MASS
(mg)		 MASS / A
(mg/mm²)		 MASS / P
(mg/mm)
LMZ10500 Y MicroSiP 37.4 12.4 1.8
LMZ10501 Y MicroSiP 37.4 12.4 1.8
LMZ21700 Y MicroSiP 48 10.7 2.0
LMZ21701 Y MicroSiP 48 10.7 2.0
LMZ30602 Y QFN Overmolded 850 31.4 8.5
LMZ30604 Y QFN Overmolded 850 31.4 8.5
LMZ30606 Y QFN Overmolded 850 31.4 8.5
LMZ31503 Y QFN Overmolded 1260 38.8 10.2
LMZ31506 Y QFN Overmolded 1260 38.8 10.2
LMZ31520 N QFN Overmolded 4960 67.2 25.5
LMZ31530 N QFN Overmolded 4960 67.2 25.5
LMZ31704 N QFN Overmolded 1430 68.2 13.8
LMZ31707 N QFN Overmolded 1430 68.2 13.8
LMZ31710 N QFN Overmolded 1430 68.2 13.8
LMZ34002 Y QFN Overmolded 891 26.3 9.8
LMZ34202 N QFN Overmolded 1475 52.7 13.7
LMZ35003 Y QFN Overmolded 891 26.3 9.8
LMZ36002 N QFN Overmolded 1475 52.7 13.7
LMZM23600 Y MicroSiP 48.5 12.2 1.9
LMZM23601 Y MicroSiP 48.5 12.2 1.9
LMZM33602 Y QFN Overmolded 468 25.6 4.7
LMZM33603 Y QFN Overmolded 468 25.6 4.7
LMZM33604 N QFN Overmolded 1990 57.7 11.9
LMZM33606 N QFN Overmolded 1990 57.7 11.9
TPS82084 Y MicroSiP 53.5 14.5 2.6
TPS82085 Y MicroSiP 53.5 14.5 2.6
TPS82130 Y MicroSiP 62.5 16.9 3.1
TPS82140 Y MicroSiP 62.5 16.9 3.1
TPS82150 Y MicroSiP 62.5 16.9 3.1
TPSM265R1 Y MicroSiP 37.7 13.9 1.6
TPSM41615

Y

QFN Open Frame

1319

28.5

6.4
TPSM41625

Y

QFN Open Frame

1319

28.5

6.4
TPSM53602 Y QFN Overmolded 429 37.3 10.5
TPSM53603 Y QFN Overmolded 429 37.3 10.5
TPSM53604 Y QFN Overmolded 429 37.3 10.5
TPSM560R6 Y QFN Overmolded 429 37.3 10.5
TPSM5601R5 Y QFN Overmolded 429 37.3 10.5

TPSM5D1806

Y

QFN Overmolded

235

14.6

1.7
TLVM13630 Y QFN Overmolded 123 13.1 1.9
TPSM63603 Y QFN Overmolded 123 13.1 1.9
209 Y QFN Overmolded 110 13.2 2.9
TPSM84424 N QFN Open Frame 678(1) 170(1) 42.4(1)
TPSM84624 N QFN Open Frame 678(1) 170(1) 42.4(1)
TPSM846C23 N QFN Open Frame 2900(1) 125(1) 75.5(1)
TPSM846C24 N QFN Open Frame 2900(1) 125(1) 75.5(1)
TPSM84824 N QFN Open Frame 678 (1) 170(1) 42.4(1)
TPSM84A21 Y QFN Overmolded 725 13.6 7.1
TPSM84A22 Y QFN Overmolded 725 13.6 7.1
TPSM63602 Y QFN Overmolded 123 9.8 1.5
TPSM63603 Y QFN Overmolded 123 9.8 1.5
TPSM63604 N QFN Overmolded 429 64.5 9.6
TPSM63606 N QFN Overmolded 429 64.5 9.6
TPSM63608 N QFN Overmolded 429 64.5 9.6
TLVM13640 N QFN Overmolded 429 64.5 9.6
TLVM13660 N QFN Overmolded 748 64.5 9.6
TPSM365R6 Y QFN- FCMOD 103 19 3
TPSM365R3 Y QFN- FCMOD 103 19 3
TPSM365R15 Y QFN- FCMOD 103 19 3
TPSM365R1 Y QFN- FCMOD 103 19 3
TPSM33615 Y QFN- FCMOD 103 19 3
TPSM33625 Y QFN- FCMOD 103 19 3
(1) Calculation is based on the mass of the exposed inductor, which is the heavy component likely to fall off first.