SNVA853C December   2019  – March 2024 LMZ10500 , LMZ10501 , LMZ20501 , LMZ20502 , LMZ21700 , LMZ21701 , LMZ30604 , LMZ31506 , LMZ31520 , LMZ31530 , LMZ31704 , LMZ31707 , LMZ31710 , LMZ34202 , LMZ35003 , LMZ36002 , LMZM23600 , LMZM23601 , LMZM33602 , LMZM33603 , LMZM33604 , LMZM33606 , TLVM13610 , TLVM13630 , TLVM13640 , TLVM13660 , TLVM23615 , TLVM23625 , TPS82085 , TPS82130 , TPSM265R1 , TPSM33615 , TPSM33625 , TPSM365R3 , TPSM365R6 , TPSM53604 , TPSM5601R5 , TPSM5601R5H , TPSM5601R5HE , TPSM560R6 , TPSM63603 , TPSM63604 , TPSM63606 , TPSM63608 , TPSM63610 , TPSM84424 , TPSM84624 , TPSM846C23 , TPSM846C24 , TPSM84824

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Package Types
    1. 2.1 MicroSiP
    2. 2.2 QFN Overmolded
    3. 2.3 QFN Open Frame
    4. 2.4 Leaded
    5. 2.5 QFN-FCMOD
  6. 3Package CAD/CAE Symbols and Footprints
  7. 4Soldering
    1. 4.1 MSL Ratings
    2. 4.2 Reflow Profile
    3. 4.3 Back Side PCB Mounting Considerations
      1. 4.3.1 Method 1 - Solder Surface Perimeter
      2. 4.3.2 Method 2 - Solder Surface Area
      3. 4.3.3 Back Side PCB Mounting Evaluation of TI Modules
      4. 4.3.4 Reflow Fixture
  8. 5Rework During Prototyping
  9. 6References
  10. 7Revision History

4.2 Reflow Profile

The maximum reflow temperature and number of allowed reflows can vary from device to device. The maximum temperature depends on the package volume and thickness. Refer to each data sheet of the device for the maximum reflow temperature and number of reflows. Refer to the MSL Ratings and Reflow Profiles Application Note for an example reflow profile based on J-STD-020 and additional soldering information.