Product details

Technology family CD4000 Operating temperature range (°C) -55 to 125 Rating Military
Technology family CD4000 Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • Fully static operation
  • Shifting rates up to 12 MHz @ 10 V (typ.)
  • Permanent register storage with clock line high or low - no information recirculation required
  • 100% tested for quiescent current at 20 V
  • Standardized, symmetrical output characteristics
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 uA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
    1 V at VDD = 5 V
    2 V at VDD = 10 V
    2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' series CMOS Devices"
  • Applications
    • Serial shift registers
    • Frequency division
    • Time delay circuits
  • Fully static operation
  • Shifting rates up to 12 MHz @ 10 V (typ.)
  • Permanent register storage with clock line high or low - no information recirculation required
  • 100% tested for quiescent current at 20 V
  • Standardized, symmetrical output characteristics
  • 5-V, 10-V, and 15-V parametric ratings
  • Maximum input current of 1 uA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
    1 V at VDD = 5 V
    2 V at VDD = 10 V
    2.5 V at VDD = 15 V
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' series CMOS Devices"
  • Applications
    • Serial shift registers
    • Frequency division
    • Time delay circuits

CD4006B types are composed of 4 separate shift register sections: two sections of four stages and two sections of five stages with an output tap at the fourth stage. Each section has an independent single-rail data path.

A common clock signal is used for all stages. Data are shifted to the next stage on negative-going transitions of the clock. Through appropriate connections of inputs and outputs, multiple register sections of 4, 5, 8, and 9 stages or single register sections of 10, 12, 13, 14, 16, 17 and 18 stages can be implemented using one CD4006B package. Longer shift register sections can be assembled by using more than one CD4006B.

To facilitate cascading stages when clock rise and fall times are slow, an optional output (D1+4') that is delayed one-half clock-cycle, is provided (see Truth Table for Output from Term. 2).

The CD4006B types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), and in chip form (H suffix).

CD4006B types are composed of 4 separate shift register sections: two sections of four stages and two sections of five stages with an output tap at the fourth stage. Each section has an independent single-rail data path.

A common clock signal is used for all stages. Data are shifted to the next stage on negative-going transitions of the clock. Through appropriate connections of inputs and outputs, multiple register sections of 4, 5, 8, and 9 stages or single register sections of 10, 12, 13, 14, 16, 17 and 18 stages can be implemented using one CD4006B package. Longer shift register sections can be assembled by using more than one CD4006B.

To facilitate cascading stages when clock rise and fall times are slow, an optional output (D1+4') that is delayed one-half clock-cycle, is provided (see Truth Table for Output from Term. 2).

The CD4006B types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), and in chip form (H suffix).

Download

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet CMOS 18-Stage Static Shift Register datasheet 19 Nov 1998

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​