Gehäuseinformationen
| Gehäuse | Pins TSSOP (PW) | 20 |
| Betriebstemperaturbereich (°C) -40 to 85 |
| Gehäusemenge | Träger 70 | TUBE |
Merkmale von BQ28400
- Fully Integrated Gas Gauge and Analog Monitoring with Protection in a Single Package
- 2-Series Cell Li-Ion or Li-Polymer Battery Packs
- Flexible Memory Architecture with Integrated Flash Memory
- Zero-Volt and Pre-Charge Mode
- Full Array of Programmable Protection:
- OV (Overvoltage)
- UV (Undervoltage)
- SC (Short Circuit)
- OT (Overtemperature)
- CIM (Cell Imbalance)
- Accurate CEDV Gauging Algorithm with Self Discharge Compensation
- High Accuracy Analog Interface with Two Independent ADCs:
- High Resolution 16-Bit Integrator for Coulomb Counting
- 16-Bit Delta-Sigma ADC with a 16-Channel Multiplexer for Voltage, Current, and Temperature
- High Side Protection FET Drive
- Fully Integrated Internal Clock Synthesizer with No External Components Required
- Two-Wire SMBus v1.1 Compliant Communications
- Reduced Power Modes (Typical Battery Pack Operating Range Conditions)
- Low Power
- Shutdown
- 20-Pin TSSOP Package (RoHS-Compliant)
- JEITA/Enhanced Charging
- Supports SHA-1 Authentication Responder
- APPLICATIONS
- Tablet PCs
- Slate PCs
- Netbooks/Notebooks
- Smartbooks
Beschreibung von BQ28400
The bq28400 device is a fully integrated gas gauge and analog monitoring management solution that provides protection and control for 2-series cell Li-Ion battery packs in a single TSSOP package.
Implementing the optimum balance of quick response analog hardware-based monitoring and control along with an integrated fast CPU provides the ideal pack-based or in-system Li-Ion battery solution. The bq28400 also provides flexible user programmable settings stored in flash memory for control of critical system parameters such as overcurrent, short circuit, under/overvoltage, and over/undertemperature conditions.
The bq28400 communicates with the system host via a two-wire SMBus 1.1 compatible interface, providing high-accuracy reporting and control of battery pack operation. The FET drive and TSSOP package enable a lower cost and small footprint solution along with a simple layout and routing on narrow pack PCBs.