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TMUX4052 ACTIVO Multiplexor de +/-12 V, 4:1, 2 canales con lógica compatible de 1.8 V 24-V mux with 1.8-V logic and smaller package options

Detalles del producto

Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Power supply voltage - dual (V) +/-10, +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 18 ON-state leakage current (max) (µA) 0.3 Supply current (typ) (µA) 0.04 Bandwidth (MHz) 25 Operating temperature range (°C) -55 to 125 Features Break-before-make Input/output continuous current (max) (mA) 10 Rating Catalog Drain supply voltage (max) (V) 20 Supply voltage (max) (V) 20 Negative rail supply voltage (max) (V) 0
Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 3.3, 5, 12, 16, 20 Power supply voltage - dual (V) +/-10, +/-2.5, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 18 ON-state leakage current (max) (µA) 0.3 Supply current (typ) (µA) 0.04 Bandwidth (MHz) 25 Operating temperature range (°C) -55 to 125 Features Break-before-make Input/output continuous current (max) (mA) 10 Rating Catalog Drain supply voltage (max) (V) 20 Supply voltage (max) (V) 20 Negative rail supply voltage (max) (V) 0
PDIP (N) 16 181.42 mm² 19.3 x 9.4 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Wide range of digital and analog signal levels:
    • Digital: 3V to 20V
    • Analog: ≤ 20VP-P
  • Low ON resistance, 125Ω (typical) over 15VP-P signal input range for VDD – VEE = 18V
  • High OFF resistance, channel leakage of ±10pA (typical) at VDD – VEE = 18V
  • Logic-level conversion for digital addressing signals of 3V to 20V (VDD – VSS = 3V to 20V) to switch analog signals to 20VP-P (VDD – VEE = 20V) matched switch characteristics, rON = 5Ω (typical) for VDD – VEE = 15V very low quiescent power dissipation under all digital-control input and supply conditions, 0.2µW (typical) at VDD – VSS = VDD – VEE = 10V
  • Binary address decoding on chip
  • 5V, 10V, and 15V parametric ratings
  • 100% tested for quiescent current at 20V
  • Maximum input current of 1µA at 18V over full package temperature range, 100nA at 18V and 25°C
  • Break-before-make switching eliminates channel overlap
  • Wide range of digital and analog signal levels:
    • Digital: 3V to 20V
    • Analog: ≤ 20VP-P
  • Low ON resistance, 125Ω (typical) over 15VP-P signal input range for VDD – VEE = 18V
  • High OFF resistance, channel leakage of ±10pA (typical) at VDD – VEE = 18V
  • Logic-level conversion for digital addressing signals of 3V to 20V (VDD – VSS = 3V to 20V) to switch analog signals to 20VP-P (VDD – VEE = 20V) matched switch characteristics, rON = 5Ω (typical) for VDD – VEE = 15V very low quiescent power dissipation under all digital-control input and supply conditions, 0.2µW (typical) at VDD – VSS = VDD – VEE = 10V
  • Binary address decoding on chip
  • 5V, 10V, and 15V parametric ratings
  • 100% tested for quiescent current at 20V
  • Maximum input current of 1µA at 18V over full package temperature range, 100nA at 18V and 25°C
  • Break-before-make switching eliminates channel overlap

The CD405xB analog multiplexers and demultiplexers are digitally-controlled analog switches having low ON impedance and very low OFF leakage current. These multiplexer circuits dissipate extremely low quiescent power over the full VDD – VSS and VDD – VEE supply-voltage ranges, independent of the logic state of the control signals.

The CD405xB analog multiplexers and demultiplexers are digitally-controlled analog switches having low ON impedance and very low OFF leakage current. These multiplexer circuits dissipate extremely low quiescent power over the full VDD – VSS and VDD – VEE supply-voltage ranges, independent of the logic state of the control signals.

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Documentación técnica

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Tipo Título Fecha
* Data sheet CD405xB CMOS Single 8-Channel Analog Multiplexer or Demultiplexer With Logic-Level Conversion datasheet (Rev. M) PDF | HTML 15 nov 2024
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 dic 2021
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 19 nov 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 dic 2001

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Adaptador de interfaz

LEADED-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas rápidas de encapsulados con plomo

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Guía del usuario: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
PDIP (N) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
SOP (NS) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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