The TMUX1111, TMUX1112, and TMUX1113 are precision complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable 1:1, single-pole, single-throw (SPST) switches. Wide operating supply of 1.08V to 5.5V allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD.
The switches of the TMUX1111 are turned on with Logic 0 on the appropriate logic control inputs, while Logic 1 is required to turn on switches in the TMUX1112. The four channels of the TMUX1113 are split with two switches supporting Logic 0, while the other two switches support Logic 1. The TMUX1113 exhibits break-before-make switching, allowing the device to be used in cross-point switching applications.
The TMUX111x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8 nA and small package options enable use in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX111x 5V, Low-Leakage-Current, 1:1 (SPST), 4-Channel Precision Switches datasheet (Rev. C) | PDF | HTML | 03 ago 2023 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 13 may 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| UQFN (RSV) | 16 | Ultra Librarian |
Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.
El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.
Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI.