The TMUX1136 is a complementary metal-oxide semiconductor (CMOS) single-pole double-throw (2:1) switch with two independently controlled channels. A wide operating supply of 1.08V to 5.5V makes this device an excellent choice for a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from GND to VDD. All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX1136 is part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 3nA and small package options enable use in portable applications.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | TMUX1136 5V Low-Leakage-Current, 2:1, 2-Channel Precision Analog Switch datasheet (Rev. B) | PDF | HTML | 02 feb 2024 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 jun 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 dic 2021 | |
| Application brief | Improving Pulse Oximeter Solution Performance without Sacrificing Size (Rev. A) | PDF | HTML | 26 abr 2021 | |
| Application note | Choosing the Right Multiplexer for MCU Expansion | PDF | HTML | 19 nov 2020 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Encapsulado | Pines | Símbolos CAD, huellas y modelos 3D |
|---|---|---|
| USON (DQA) | 10 | Ultra Librarian |
| VSSOP (DGS) | 10 | Ultra Librarian |
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